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TFBGA Other Function Telecom Interface ICs 13

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
TCA5013ZAHR by Texas Instruments

TCA5013ZAHR

Texas Instruments

TCA5013ZAHR by Texas Instruments is a 48-terminal, telecom interface IC with a supply voltage of 3.3V. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temperature of 260°C. This square-shaped IC is designed for telecom circuits, featuring a thin profile package body suitable for surface mount applications.

S-PBGA-B48

e1

5 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.2 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

PN5180A0ET/C1,151 by NXP Semiconductors

PN5180A0ET/C1,151

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B64

e1

5.5 mm

1

1

64

85 Cel

-30 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.15 mm

1.8 V

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

5.5 mm

STA8090FGBTR by STMicroelectronics

STA8090FGBTR

STMicroelectronics

STA8090FGBTR by STMicroelectronics is a telecom interface IC designed for industrial applications. It features a compact 99-terminal grid array with a max temp of 85 °C and operates at a nominal voltage of 1.2V. Ideal for surface mount designs, it ensures reliable performance in demanding environments.

R-PBGA-B99

6 mm

1

99

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

1.2 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

5 mm

STA8090FGTR by STMicroelectronics

STA8090FGTR

STMicroelectronics

STA8090FGTR by STMicroelectronics is a telecom interface IC designed for industrial applications. It features a compact 99-terminal grid array with a max operating temp of 85 °C and operates at a nominal voltage of 1.2V. Its thin profile and fine pitch make it ideal for space-constrained designs.

R-PBGA-B99

6 mm

1

99

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

1.2 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

5 mm

STA8090FG by STMicroelectronics

STA8090FG

STMicroelectronics

STA8090FG by STMicroelectronics is a telecom interface IC designed for industrial applications. It features a compact 99-terminal grid array with a max operating temp of 85 °C and operates at a nominal voltage of 1.2V. Its robust CMOS technology ensures reliable performance in demanding environments.

R-PBGA-B99

6 mm

1

99

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

1.2 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

5 mm

BCM43570KFFBG by Cypress Semiconductor

BCM43570KFFBG

Cypress Semiconductor

BCM43570KFFBG by Cypress Semiconductor is a 242-terminal IC with 867 Mbps data rate, operating at 0-60°C. Telecom circuit application with 3.3V supply voltage and 0.4mm terminal pitch for high-speed connectivity in commercial-grade environments.

Also has 1.2 V core supply

867 Mbps

S-PBGA-B242

10 mm

1

242

60 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA242,23X23,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.05 mm

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

BALL

.4 mm

BOTTOM

10 mm

STA8090EXGAJTR by STMicroelectronics

STA8090EXGAJTR

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B169

9 mm

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

AEC-Q100

1.2 mm

1.1 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

9 mm

STA8090EXGAJ by STMicroelectronics

STA8090EXGAJ

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B169

9 mm

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

AEC-Q100

1.2 mm

1.1 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

9 mm

STA8090EXGATR by STMicroelectronics

STA8090EXGATR

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B169

9 mm

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

AEC-Q100

1.2 mm

1.1 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

9 mm

STA8090EXGA by STMicroelectronics

STA8090EXGA

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B169

e3

9 mm

3

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

AEC-Q100

1.2 mm

1.1 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

BALL

.65 mm

BOTTOM

9 mm

PN5120A0ET/C2,151 by NXP Semiconductors

PN5120A0ET/C2,151

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B64

5.5 mm

1

64

85 Cel

-30 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

AEC-Q100

1.15 mm

3 V

YES

TELECOM CIRCUIT

OTHER

BALL

.65 mm

BOTTOM

5.5 mm

ADRV9002BBCZ-RL by Analog Devices

ADRV9002BBCZ-RL

Analog Devices

ADRV9002BBCZ-RL by Analog Devices is a telecom IC with 1 function. It has a package style of grid array, thin profile, and fine pitch. With an operating temperature range of -40 to 110 °C, it is suitable for industrial applications.

S-PBGA-B196

12 mm

3

1

196

110 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.19 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

12 mm

ADRV9002BBCZ by Analog Devices

ADRV9002BBCZ

Analog Devices

Analog Devices ADRV9002BBCZ is a telecom IC with 196 terminals in a grid array package. It operates b/w -40 to 110°C, with a nominal voltage of 1V. Ideal for telecom circuits, it has a thin profile and fine pitch design for surface mounting applications.

S-PBGA-B196

12 mm

3

1

196

110 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.19 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

12 mm