Loading...

672 Other Function Telecom Interface ICs 4

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
WP3160W6NFEI-320B1 by Microchip Technology

WP3160W6NFEI-320B1

Microchip Technology

WP3160W6NFEI-320B1 by Microchip Technology is a GRID ARRAY IC with 672 terminals in PLASTIC/EPOXY package. It's a TELECOM CIRCUIT for telecom applications, designed for surface mount with BALL terminals at the bottom.

S-PBGA-B672

1

672

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

WP3161F5NFEI-320B1 by Microchip Technology

WP3161F5NFEI-320B1

Microchip Technology

WP3161F5NFEI-320B1 by Microchip Technology is a telecom IC with 672 terminals in a grid array package. It features plastic/epoxy body material, surface mount capability, and ball-shaped bottom terminals. Ideal for telecom circuit applications due to its square package shape.

S-PBGA-B672

1

672

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

WP3161W6NFEI-320B1 by Microchip Technology

WP3161W6NFEI-320B1

Microchip Technology

WP3161W6NFEI-320B1 by Microchip Technology is a telecom IC with 672 terminals in a grid array package. It features plastic/epoxy body material, surface mount capability, and ball-shaped bottom terminals. Ideal for telecom circuit applications due to its advanced interface functionalities.

S-PBGA-B672

1

672

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

WP3161D4NFEI-400B1 by Microchip Technology

WP3161D4NFEI-400B1

Microchip Technology

WP3161D4NFEI-400B1 by Microchip Technology is a telecom IC with 672 terminals in a grid array package. It features plastic/epoxy body material, surface mount capability, and ball-shaped bottom terminals. Ideal for telecom circuit applications due to its advanced interface functionalities.

S-PBGA-B672

1

672

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM