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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
ICE40LP8K-CM121TR1K by Lattice Semiconductor

ICE40LP8K-CM121TR1K

Lattice Semiconductor

ICE40LP8K-CM121TR1K by Lattice Semiconductor is a FPGA with 7680 logic cells, 960 CLBs, and 93 inputs/outputs. It operates at max clock frequency of 133 MHz, suitable for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and very thin profile, it offers versatility in design integration.

FPGA

7680

93

93

960

133 MHz

9.36 ns

CMOS

960 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

5 mm

5 mm

1 mm

Tape and Reel

BGA121,11X11,16

Bottom

Ball

Tin Silver Copper

.4 mm

121

S-PBGA-B121

e1

ICE40LP8K-CM121TR by Lattice Semiconductor

ICE40LP8K-CM121TR

Lattice Semiconductor

ICE40LP8K-CM121TR by Lattice Semiconductor is a CMOS FPGA with 7680 logic cells, 960 CLBs, and 93 inputs/outputs. Operating at up to 133 MHz, it suits industrial applications requiring high-speed processing in a compact form factor. The package style is grid array with very thin profile and fine pitch for space-constrained designs.

FPGA

7680

93

93

960

133 MHz

9.36 ns

CMOS

960 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

5 mm

5 mm

1 mm

Tape and Reel

BGA121,11X11,16

Bottom

Ball

Tin Silver Copper

.4 mm

121

S-PBGA-B121

e1

LCMXO3L-2100C-5BG324C by Lattice Semiconductor

LCMXO3L-2100C-5BG324C

Lattice Semiconductor

LCMXO3L-2100C-5BG324C by Lattice Semiconductor is a 264 CLB FPGA with max supply voltage of 3.465V and min operating temp of 0°C. Ideal for applications requiring low profile, fine pitch grid array packages in electronics industry.

FPGA

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

LCMXO3L-2100E-5UWG49CTR1K by Lattice Semiconductor

LCMXO3L-2100E-5UWG49CTR1K

Lattice Semiconductor

LCMXO3L-2100E-5UWG49CTR1K by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 264 CLBs, 0.4mm terminal pitch, and 1.26V max supply voltage. Ideal for applications requiring high-density programmable logic in compact form factors at temperatures ranging from 0 to 85°C.

FPGA

264

264 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.185 mm

3.106 mm

.6 mm

Bottom

Ball

Tin Silver Copper

.4 mm

49

R-PBGA-B49

e1

LCMXO3L-2100E-5UWG49CTR50 by Lattice Semiconductor

LCMXO3L-2100E-5UWG49CTR50

Lattice Semiconductor

LCMXO3L-2100E-5UWG49CTR50 by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 264 CLBs. It operates at a voltage range of 1.14V to 1.26V and has a temperature range of 0°C to 85°C. This FPGA is suitable for applications requiring high flexibility and programmability in electronic systems.

FPGA

264

264 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.185 mm

3.106 mm

.6 mm

Bottom

Ball

Tin Silver Copper

.4 mm

49

R-PBGA-B49

e1

LCMXO3L-2100E-5UWG49ITR50 by Lattice Semiconductor

LCMXO3L-2100E-5UWG49ITR50

Lattice Semiconductor

LCMXO3L-2100E-5UWG49ITR50 by Lattice Semiconductor is a FPGA with 2100 logic cells, 264 CLBs, and 38 inputs/outputs. It operates b/w -40 to 100°C, has a supply voltage range of 1.14V to 1.26V, and features a grid array package for applications in various electronic systems requiring programmable ICs.

FPGA

2100

38

38

264

264 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.185 mm

3.106 mm

.6 mm

Bottom

Ball

Tin Silver Copper

.4 mm

49

R-PBGA-B49

e1

LCMXO3L-4300E-5UWG81CTR1K by Lattice Semiconductor

LCMXO3L-4300E-5UWG81CTR1K

Lattice Semiconductor

LCMXO3L-4300E-5UWG81CTR1K by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 540 CLBs, 0.4mm terminal pitch, and 85°C max operating temp. Ideal for applications requiring high-density programmable logic in compact form factors.

FPGA

540

540 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

1

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.797 mm

3.693 mm

.567 mm

Bottom

Ball

Tin Silver Copper

.4 mm

81

R-PBGA-B81

e1

LCMXO3L-4300E-5UWG81CTR50 by Lattice Semiconductor

LCMXO3L-4300E-5UWG81CTR50

Lattice Semiconductor

LCMXO3L-4300E-5UWG81CTR50 by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 540 CLBs, 0.4mm terminal pitch, and 1.2V nominal voltage. Ideal for applications requiring high-density programmable logic solutions in compact form factors with operating temperatures ranging from 0 to 85°C.

FPGA

540

540 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

1

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.797 mm

3.693 mm

.567 mm

Bottom

Ball

Tin Silver Copper

.4 mm

81

R-PBGA-B81

e1

LCMXO3L-4300E-5UWG81CTR by Lattice Semiconductor

LCMXO3L-4300E-5UWG81CTR

Lattice Semiconductor

LCMXO3L-4300E-5UWG81CTR by Lattice Semiconductor is a 540 CLB FPGA with max supply voltage of 1.26V, suitable for applications requiring high performance in compact form factors. Featuring a grid array package style, 0.4mm terminal pitch, and operating temperature range of 0-85°C, it is ideal for space-constrained designs needing efficient programmable ICs.

FPGA

540

540 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

1

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.797 mm

3.693 mm

.567 mm

Bottom

Ball

Tin Silver Copper

.4 mm

81

R-PBGA-B81

e1

LCMXO3L-4300E-5UWG81ITR50 by Lattice Semiconductor

LCMXO3L-4300E-5UWG81ITR50

Lattice Semiconductor

LCMXO3L-4300E-5UWG81ITR50 by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 4300 logic cells, 540 CLBs, and 63 inputs/outputs. It is used for applications requiring field programmable gate arrays with a very thin profile and fine pitch package style.

FPGA

4300

63

63

540

540 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

1

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.797 mm

3.693 mm

.567 mm

Bottom

Ball

Tin Silver Copper

.4 mm

81

R-PBGA-B81

e1

LCMXO3L-4300E-5UWG81ITR by Lattice Semiconductor

LCMXO3L-4300E-5UWG81ITR

Lattice Semiconductor

LCMXO3L-4300E-5UWG81ITR by Lattice Semiconductor is a FPGA with 4300 logic cells, 540 CLBs, and 63 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 1.14V to 1.26V. Ideal for applications requiring high-density programmable logic solutions in compact form factors.

FPGA

4300

63

63

540

540 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

1

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.797 mm

3.693 mm

.567 mm

Bottom

Ball

Tin Silver Copper

.4 mm

81

R-PBGA-B81

e1

LCMXO3L-6900C-5BG400I by Lattice Semiconductor

LCMXO3L-6900C-5BG400I

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

6900

335

335

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

LFE5U-45F-6BG554I by Lattice Semiconductor

LFE5U-45F-6BG554I

Lattice Semiconductor

Lattice Semiconductor's LFE5U-45F-6BG554I FPGA features 44000 logic cells, 5500 CLBs, and 245 inputs/outputs. With a max supply voltage of 1.155V, it is ideal for applications requiring high-performance computing in industrial automation, telecommunications, and automotive systems.

FPGA

44000

245

245

5500

5500 CLBS

1.1

1.045 V

1.155 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

1.76 mm

BGA554,26X26,32

Bottom

Ball

Tin Silver Copper

.8 mm

554

S-PBGA-B554

e1

LFE5U-85F-6BG554C by Lattice Semiconductor

LFE5U-85F-6BG554C

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

260 °C (500 °F)

30 s

3

Tin Silver Copper

e1

LFE5U-85F-6BG756C by Lattice Semiconductor

LFE5U-85F-6BG756C

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1;

FPGA

260 °C (500 °F)

30 s

3

Tin Silver Copper

e1

LFE5U-85F-7BG554C by Lattice Semiconductor

LFE5U-85F-7BG554C

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Finishing Of Terminal Used: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;

FPGA

260 °C (500 °F)

30 s

3

Tin Silver Copper

e1

LFE5U-85F-8BG554C by Lattice Semiconductor

LFE5U-85F-8BG554C

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;

FPGA

260 °C (500 °F)

30 s

3

Tin Silver Copper

e1

LFE5U-85F-8BG554I by Lattice Semiconductor

LFE5U-85F-8BG554I

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;

FPGA

260 °C (500 °F)

30 s

3

Tin Silver Copper

e1

LFE5U-85F-8BG756C by Lattice Semiconductor

LFE5U-85F-8BG756C

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;

FPGA

260 °C (500 °F)

30 s

3

Tin Silver Copper

e1

LFE5U-85F-8BG756I by Lattice Semiconductor

LFE5U-85F-8BG756I

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Finishing Of Terminal Used: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

260 °C (500 °F)

30 s

3

Tin Silver Copper

e1

LFE5UM-45F-7BG554C by Lattice Semiconductor

LFE5UM-45F-7BG554C

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1;

FPGA

260 °C (500 °F)

30 s

3

Tin Silver Copper

e1

LFE5UM-45F-7BG554I by Lattice Semiconductor

LFE5UM-45F-7BG554I

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;

FPGA

260 °C (500 °F)

30 s

3

Tin Silver Copper

e1

LFE5UM-85F-6BG381C by Lattice Semiconductor

LFE5UM-85F-6BG381C

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): NOT SPECIFIED;

FPGA

3

LFE5UM-85F-6BG554C by Lattice Semiconductor

LFE5UM-85F-6BG554C

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;

FPGA

260 °C (500 °F)

30 s

3

Tin Silver Copper

e1

LFE5UM-85F-7BG381C by Lattice Semiconductor

LFE5UM-85F-7BG381C

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Moisture Sensitivity Level (MSL): 3;

FPGA

3

LFE5UM-85F-7BG554C by Lattice Semiconductor

LFE5UM-85F-7BG554C

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

FPGA

260 °C (500 °F)

30 s

3

Tin Silver Copper

e1

LFE5UM-85F-8BG554C by Lattice Semiconductor

LFE5UM-85F-8BG554C

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;

FPGA

260 °C (500 °F)

30 s

3

Tin Silver Copper

e1

LFE5UM-85F-8BG554I by Lattice Semiconductor

LFE5UM-85F-8BG554I

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

FPGA

260 °C (500 °F)

30 s

3

Tin Silver Copper

e1

XCV400E-6BG560C by Xilinx

XCV400E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV400E-6BG560I by Xilinx

XCV400E-6BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; No. of Logic Cells: 10800;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV400E-7BG560C by Xilinx

XCV400E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV400E-7BG560I by Xilinx

XCV400E-7BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.89 V;

FPGA

10800

404

404

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV600E-6BG560C by Xilinx

XCV600E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

15552

404

404

3456

186624

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV600E-6BG560I by Xilinx

XCV600E-6BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.89 V;

FPGA

15552

404

404

3456

186624

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV600E-7BG560C by Xilinx

XCV600E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

15552

404

404

3456

186624

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV600E-7BG560I by Xilinx

XCV600E-7BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.71 V;

FPGA

15552

404

404

3456

186624

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XC2S100-5FG256I by Xilinx

XC2S100-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

180

176

600

100000

263 MHz

0.7 ns

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S100-5FG456I by Xilinx

XC2S100-5FG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

600

100000

263 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2S100-5PQ208I by Xilinx

XC2S100-5PQ208I

Xilinx

Xilinx XC2S100-5PQ208I FPGA offers 2700 logic cells, 600 CLBs, and 100000 equivalent gates. With a max clock frequency of 263 MHz, it is ideal for industrial applications requiring high-speed processing and programmable IC solutions. The package style is flatpack with fine pitch terminals, making it suitable for compact designs in various electronic systems.

FPGA

2700

144

140

600

100000

263 MHz

0.7 ns

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

208

S-PQFP-G208

e4

No

XC2S100-5TQ144I by Xilinx

XC2S100-5TQ144I

Xilinx

Xilinx XC2S100-5TQ144I FPGA offers 2700 logic cells, 600 CLBs, and 100000 gates. Ideal for industrial applications with a max clock frequency of 263 MHz. Package style: flatpack, low profile, fine pitch.

FPGA

2700

96

92

600

100000

263 MHz

0.7 ns

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC2S15-5CS144I by Xilinx

XC2S15-5CS144I

Xilinx

Xilinx XC2S15-5CS144I FPGA features 432 logic cells, 96 CLBs, and 15000 equivalent gates. Operating at a max clock frequency of 263 MHz, it is ideal for applications requiring high-speed processing in compact designs. With a package style of grid array and thin profile, it offers versatility in various electronic systems.

FPGA

432

96

92

96

15000

263 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

96 CLBS, 15000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XC2S15-5TQ144I by Xilinx

XC2S15-5TQ144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Length: 20 mm;

FPGA

432

90

86

96

15000

263 MHz

0.7 ns

Field Programmable Gate Arrays

96 CLBS, 15000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC2S15-5VQ100I by Xilinx

XC2S15-5VQ100I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE; No. of Inputs: 64;

FPGA

432

64

60

96

15000

263 MHz

0.7 ns

Field Programmable Gate Arrays

96 CLBS, 15000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

100

S-PQFP-G100

e4

No

XC2S150-5FG256I by Xilinx

XC2S150-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 150000;

FPGA

3888

180

176

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S150-5FG456I by Xilinx

XC2S150-5FG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

264

260

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC2S150-5PQ208I by Xilinx

XC2S150-5PQ208I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; No. of Inputs: 144;

FPGA

3888

144

140

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

208

S-PQFP-G208

e4

No

XC2S200-5FG256I by Xilinx

XC2S200-5FG256I

Xilinx

The Xilinx XC2S200-5FG256I is a FPGA with 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. It operates at max frequency of 263 MHz, suitable for industrial applications requiring high-speed processing. With a package style of grid array and moisture sensitivity level of 3, it offers reliable performance in various environments.

FPGA

5292

180

176

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S200-5FG456I by Xilinx

XC2S200-5FG456I

Xilinx

The Xilinx XC2S200-5FG456I is a FPGA with 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. It operates at max frequency of 263 MHz and has 288 inputs and 284 outputs. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.

FPGA

5292

288

284

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No