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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC2S50-6TQ144C by Xilinx

XC2S50-6TQ144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

1728

96

92

384

50000

263 MHz

0.6 ns

Field Programmable Gate Arrays

384 CLBS, 50000 Gates

Maximum usable gates 50000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XCV405E-6BG560C by Xilinx

XCV405E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV405E-6BG560I by Xilinx

XCV405E-6BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV405E-6FG676C by Xilinx

XCV405E-6FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XCV405E-6FG676I by Xilinx

XCV405E-6FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XCV405E-7BG560C by Xilinx

XCV405E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV405E-7BG560I by Xilinx

XCV405E-7BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV405E-7FG676C by Xilinx

XCV405E-7FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XCV405E-8FG676C by Xilinx

XCV405E-8FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XCV812E-6BG560C by Xilinx

XCV812E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

21168

404

404

4704

254016

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

4704 CLBS, 254016 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV812E-7BG560C by Xilinx

XCV812E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

21168

404

404

4704

254016

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

4704 CLBS, 254016 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV812E-8BG560C by Xilinx

XCV812E-8BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

21168

404

404

4704

254016

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

4704 CLBS, 254016 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XC2S200-5FG256C by Xilinx

XC2S200-5FG256C

Xilinx

XC2S200-5FG256C by Xilinx is a FPGA with 5292 logic cells, 1176 CLBs, and 200000 gates. It operates at max frequency of 263 MHz and has 180 inputs/176 outputs. Ideal for applications requiring high-speed processing in electronics design.

FPGA

5292

180

176

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

Maximum usable gates 200000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S200-5FG456C by Xilinx

XC2S200-5FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

288

284

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

Maximum usable gates 200000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC2S200-5PQ208C by Xilinx

XC2S200-5PQ208C

Xilinx

The Xilinx XC2S200-5PQ208C is a FPGA with 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. It operates at a max frequency of 263 MHz and has 144 inputs and 140 outputs. Ideal for applications requiring high-speed processing in compact designs.

FPGA

5292

144

140

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

208

S-PQFP-G208

e4

No

XC2S200-6FG256C by Xilinx

XC2S200-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

180

176

1176

200000

263 MHz

0.6 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

Maximum usable gates 200000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S200-6FG456C by Xilinx

XC2S200-6FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

288

284

1176

200000

263 MHz

0.6 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

Maximum usable gates 200000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC2S200-6PQ208C by Xilinx

XC2S200-6PQ208C

Xilinx

The Xilinx XC2S200-6PQ208C is a FPGA with 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. It operates at a max frequency of 263 MHz and has 144 inputs and 140 outputs. Ideal for applications requiring high-speed processing in telecommunications, automotive, and industrial sectors.

FPGA

5292

144

140

1176

200000

263 MHz

0.6 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

Maximum usable gates 200000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

208

S-PQFP-G208

e4

No

XCS10XL-4CS144C by Xilinx

XCS10XL-4CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

196

112

112

196

3000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

MAXIMUM usable gates 10000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Lead

.8 mm

144

S-PBGA-B144

e0

No

XCS10XL-5CS144C by Xilinx

XCS10XL-5CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

196

112

112

196

3000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

MAXIMUM usable gates 10000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Lead

.8 mm

144

S-PBGA-B144

e0

No

XCS20XL-4CS144C by Xilinx

XCS20XL-4CS144C

Xilinx

Xilinx XCS20XL-4CS144C FPGA features 400 logic cells, 7000 gates, and a max clock frequency of 217 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and medical devices.

FPGA

400

160

160

400

7000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Maximum usable gates 20000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Lead

.8 mm

144

S-PBGA-B144

e0

No

XCS20XL-5CS144C by Xilinx

XCS20XL-5CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Maximum usable gates 20000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Lead

.8 mm

144

S-PBGA-B144

e0

No

XCS30XL-4CS280C by Xilinx

XCS30XL-4CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

576

192

192

576

10000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No

XCS30XL-5CS280C by Xilinx

XCS30XL-5CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

576

192

192

576

10000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No

XCS40XL-4CS280C by Xilinx

XCS40XL-4CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

784

224

224

784

13000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No

XCS40XL-5CS280C by Xilinx

XCS40XL-5CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

784

224

224

784

13000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No

XCV100E-6BG352C by Xilinx

XCV100E-6BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

2700

196

196

600

32400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV100E-6BG352I by Xilinx

XCV100E-6BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.89 V;

FPGA

2700

196

196

600

32400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV100E-7BG352C by Xilinx

XCV100E-7BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

2700

196

196

600

32400

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200E-6BG352C by Xilinx

XCV200E-6BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5292

260

260

1176

63504

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200E-7BG352C by Xilinx

XCV200E-7BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5292

260

260

1176

63504

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200E-7BG352I by Xilinx

XCV200E-7BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Lead (Sn63Pb37);

FPGA

5292

260

260

1176

63504

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200E-8BG352C by Xilinx

XCV200E-8BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5292

260

260

1176

63504

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300E-6BG352C by Xilinx

XCV300E-6BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

6912

260

260

1536

82944

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 82944 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300E-6BG352I by Xilinx

XCV300E-6BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Organization: 1536 CLBS, 82944 GATES;

FPGA

6912

260

260

1536

82944

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 82944 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300E-7BG352I by Xilinx

XCV300E-7BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; No. of Equivalent Gates: 82944;

FPGA

6912

260

260

1536

82944

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 82944 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV3200E-6CG1156C by Xilinx

XCV3200E-6CG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

73008

804

804

16224

876096

357.2 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

16224 CLBS, 876096 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.11 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-CBGA-B1156

e0

No

XCV3200E-7CG1156C by Xilinx

XCV3200E-7CG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

73008

804

804

16224

876096

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

16224 CLBS, 876096 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.11 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-CBGA-B1156

e0

No

ICE40LP1K-CM121TR1K by Lattice Semiconductor

ICE40LP1K-CM121TR1K

Lattice Semiconductor

ICE40LP1K-CM121TR1K by Lattice Semiconductor is a CMOS FPGA with 160 CLBs, operating at -40 to 100 °C. It has a package style of GRID ARRAY and is suitable for industrial applications requiring low power consumption and high performance in a compact form factor.

FPGA

160

CMOS

160 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

5 mm

5 mm

1 mm

Bottom

Ball

.4 mm

121

S-PBGA-B121

ICE40LP1K-CM36TR1K by Lattice Semiconductor

ICE40LP1K-CM36TR1K

Lattice Semiconductor

ICE40LP1K-CM36TR1K by Lattice Semiconductor is a 1280 logic cell FPGA with CMOS technology. It operates at 1.2V, has 160 CLBs, and offers a max combinatorial delay of 9.36ns. Ideal for industrial applications requiring high-performance and low power consumption in compact designs.

FPGA

1280

25

25

160

9.36 ns

CMOS

160 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

2.5 mm

2.5 mm

1 mm

Bottom

Ball

Tin Silver Copper

.4 mm

36

S-PBGA-B36

e1

ICE40LP1K-CM81TR1K by Lattice Semiconductor

ICE40LP1K-CM81TR1K

Lattice Semiconductor

ICE40LP1K-CM81TR1K by Lattice Semiconductor is a CMOS FPGA with 1280 logic cells, 160 CLBs, and 63 inputs/outputs. It operates at 1.2V nominal voltage, -40 to 100°C temperature range, and has a max combinatorial delay of 9.36ns per CLB. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package with fine pitch terminals.

FPGA

1280

63

63

160

9.36 ns

CMOS

160 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

4 mm

4 mm

1 mm

Bottom

Ball

Tin Silver Copper

.4 mm

81

S-PBGA-B81

e1

ICE40LP384-CM36TR1K by Lattice Semiconductor

ICE40LP384-CM36TR1K

Lattice Semiconductor

ICE40LP384-CM36TR1K by Lattice Semiconductor is a CMOS FPGA with 384 logic cells, 48 CLBs, and 25 inputs/outputs. It operates b/w -40 to 100 °C and has a max supply voltage of 1.26 V. Ideal for industrial applications requiring high-speed processing in a compact form factor.

FPGA

384

25

25

48

9.36 ns

CMOS

48 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

2.5 mm

2.5 mm

1 mm

Bottom

Ball

Tin Silver Copper

.4 mm

36

S-PBGA-B36

e1

ICE40LP384-CM49TR1K by Lattice Semiconductor

ICE40LP384-CM49TR1K

Lattice Semiconductor

ICE40LP384-CM49TR1K by Lattice Semiconductor is a CMOS FPGA with 48 CLBs, operating at -40 to 100 °C. It has a supply voltage range of 1.14-1.26 V and features a grid array package for industrial applications requiring high-density programmable logic solutions.

FPGA

48

CMOS

48 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

3 mm

3 mm

1 mm

Bottom

Ball

.4 mm

49

S-PBGA-B49

ICE40LP384-SG32TR1K by Lattice Semiconductor

ICE40LP384-SG32TR1K

Lattice Semiconductor

ICE40LP384-SG32TR1K by Lattice Semiconductor is a CMOS FPGA with 48 CLBs, 32 terminals, and max supply voltage of 1.26V. Ideal for industrial applications requiring high performance in compact form factor with operating temp range of -40 to 100°C. Package style includes chip carrier and very thin profile for versatile integration.

FPGA

48

CMOS

48 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Yes

Chip Carrier, Heat Sink/Slug, Very Thin Profile

HVQCCN

Square

5 mm

5 mm

1 mm

Quad

No Lead

Matte Tin

.5 mm

32

S-XQCC-N32

e3

ICE40LP384-SG32TR by Lattice Semiconductor

ICE40LP384-SG32TR

Lattice Semiconductor

ICE40LP384-SG32TR by Lattice Semiconductor is a 384 Logic Cells FPGA with 48 CLBs, operating at 1.2V. Suitable for industrial applications, it has a max combinatorial delay of 9.36ns and can withstand temperatures from -40 to 100°C.

FPGA

384

21

21

48

9.36 ns

CMOS

48 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Yes

Chip Carrier, Heat Sink/Slug, Very Thin Profile

HVQCCN

Square

5 mm

5 mm

1 mm

Quad

No Lead

Matte Tin

.5 mm

32

S-XQCC-N32

e3

ICE40LP4K-CM121TR1K by Lattice Semiconductor

ICE40LP4K-CM121TR1K

Lattice Semiconductor

ICE40LP4K-CM121TR1K by Lattice Semiconductor is a CMOS FPGA with 440 CLBs, operating at -40 to 100 °C. It has a package style of GRID ARRAY, suitable for industrial applications requiring low power consumption and high performance in compact designs.

FPGA

440

CMOS

440 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

5 mm

5 mm

1 mm

Bottom

Ball

.4 mm

121

S-PBGA-B121

ICE40LP4K-CM121TR by Lattice Semiconductor

ICE40LP4K-CM121TR

Lattice Semiconductor

ICE40LP4K-CM121TR by Lattice Semiconductor is a FPGA with 3520 logic cells, 440 CLBs, and 93 inputs/outputs. Operating at 1.2V, it has a max combinatorial delay of 9.36ns and can withstand temperatures from -40 to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

3520

93

93

440

9.36 ns

CMOS

440 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

5 mm

5 mm

1 mm

Bottom

Ball

Tin Silver Copper

.4 mm

121

S-PBGA-B121

e1

ICE40LP4K-CM81TR1K by Lattice Semiconductor

ICE40LP4K-CM81TR1K

Lattice Semiconductor

ICE40LP4K-CM81TR1K by Lattice Semiconductor is a CMOS FPGA with 3520 logic cells, 440 CLBs, and 63 inputs/outputs. It operates b/w -40 to 100 °C and has a max supply voltage of 1.26 V. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

3520

63

63

440

9.36 ns

CMOS

440 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

4 mm

4 mm

1 mm

Bottom

Ball

Tin Silver Copper

.4 mm

81

S-PBGA-B81

e1