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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC4005-5PQ208C by Xilinx

XC4005-5PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

196

112

112

196

4000

133.3 MHz

4.5 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 4000 Gates

616 flip-flops; typical gates = 4000-5000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

3.92 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin Lead

.5 mm

208

S-PQFP-G208

e0

No

XC3090-100PQ208C by Xilinx

XC3090-100PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

320

144

144

320

5000

100 MHz

7 ns

CMOS

Field Programmable Gate Arrays

320 CLBS, 5000 Gates

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

3.92 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin Lead

.5 mm

208

S-PQFP-G208

e0

No

XC4008-5PQ208C by Xilinx

XC4008-5PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

770

144

144

324

6500

133.3 MHz

4.5 ns

CMOS

Field Programmable Gate Arrays

324 CLBS, 6500 Gates

936 flip-flops; typical gates = 6500-8000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

3.92 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin Lead

.5 mm

208

S-PQFP-G208

e0

No

XC4013L-5PQ208C by Xilinx

XC4013L-5PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Length: 28 mm;

FPGA

576

10000

CMOS

576 CLBS, 10000 Gates

Typical gates = 10000-30000

5

4.75 V

5.25 V

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

Quad

Gull Wing

.5 mm

208

S-PQFP-G208

No

XC4005L-5PC84C by Xilinx

XC4005L-5PC84C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER;

FPGA

196

3000

CMOS

196 CLBS, 3000 Gates

Typical gates = 3000-9000

5

4.75 V

5.25 V

Plastic/Epoxy

Yes

Chip Carrier

QCCJ

Square

29.3116 mm

29.3116 mm

5.08 mm

Quad

J Bend

1.27 mm

84

S-PQCC-J84

No

XC4005L-5PQ208C by Xilinx

XC4005L-5PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Maximum Seated Height: 4.1 mm;

FPGA

196

3000

CMOS

196 CLBS, 3000 Gates

Typical gates = 3000-9000

5

4.75 V

5.25 V

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

Quad

Gull Wing

.5 mm

208

S-PQFP-G208

No

LCMXO3L-1300C-5BG256I by Lattice Semiconductor

LCMXO3L-1300C-5BG256I

Lattice Semiconductor

LCMXO3L-1300C-5BG256I by Lattice Semiconductor is a FPGA with 1300 logic cells, 160 CLBs, and 206 inputs/outputs. It operates b/w -40 to 100°C, has a supply voltage range of 2.375V to 3.465V, and uses a grid array package style. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

1300

206

206

160

160 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-1300C-6BG256C by Lattice Semiconductor

LCMXO3L-1300C-6BG256C

Lattice Semiconductor

LCMXO3L-1300C-6BG256C by Lattice Semiconductor is a 160 CLBs FPGA with max supply voltage of 3.465V and nominal voltage of 2.5V. It features a grid array package style, suitable for applications requiring low profile and fine pitch requirements in electronics design and development.

FPGA

160

160 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-1300C-6BG256I by Lattice Semiconductor

LCMXO3L-1300C-6BG256I

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE; Width: 14 mm;

FPGA

1300

206

206

160

160 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-2100C-5BG256C by Lattice Semiconductor

LCMXO3L-2100C-5BG256C

Lattice Semiconductor

LCMXO3L-2100C-5BG256C by Lattice Semiconductor is a 264 CLB FPGA with max supply voltage of 3.465V, ideal for applications requiring low profile and fine pitch grid array packages. Operating temp range from 0 to 85°C makes it suitable for various electronic designs needing high performance in compact spaces.

FPGA

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-4300C-5BG256C by Lattice Semiconductor

LCMXO3L-4300C-5BG256C

Lattice Semiconductor

LCMXO3L-4300C-5BG256C by Lattice Semiconductor is a 540 CLB FPGA with max supply voltage of 3.465V and min operating temp of 0°C. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

FPGA

540

540 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-4300C-5BG256I by Lattice Semiconductor

LCMXO3L-4300C-5BG256I

Lattice Semiconductor

LCMXO3L-4300C-5BG256I by Lattice Semiconductor is a 4300 Logic Cells FPGA with 540 CLBs and 206 Inputs/Outputs. It operates b/w -40 to 100°C, has a supply voltage range of 2.375V to 3.465V, and uses a GRID ARRAY package style. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

4300

206

206

540

540 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-6900C-5BG256C by Lattice Semiconductor

LCMXO3L-6900C-5BG256C

Lattice Semiconductor

LCMXO3L-6900C-5BG256C by Lattice Semiconductor is a 858 CLBs FPGA with max supply voltage of 3.465V, suitable for applications requiring low profile, fine pitch grid arrays. Operating temp range from 0 to 85°C, making it ideal for various industrial and commercial projects.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-6900C-5BG256I by Lattice Semiconductor

LCMXO3L-6900C-5BG256I

Lattice Semiconductor

LCMXO3L-6900C-5BG256I by Lattice Semiconductor is a FPGA with 6900 logic cells, 858 CLBs, and 206 inputs/outputs. It operates b/w -40 to 100°C, with a supply voltage range of 2.375V to 3.465V. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

6900

206

206

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-6900C-6BG256C by Lattice Semiconductor

LCMXO3L-6900C-6BG256C

Lattice Semiconductor

LCMXO3L-6900C-6BG256C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, operating b/w 0-85°C. Featuring a grid array package style, it has 0.8mm terminal pitch and is suitable for applications requiring low profile, fine pitch ICs in electronics manufacturing.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-6900C-6BG256I by Lattice Semiconductor

LCMXO3L-6900C-6BG256I

Lattice Semiconductor

LCMXO3L-6900C-6BG256I by Lattice Semiconductor is a FPGA with 6900 logic cells, 858 CLBs, and 206 inputs/outputs. It operates b/w -40 to 100°C, has a supply voltage range of 2.375V to 3.465V, and uses a grid array package style. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

6900

206

206

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

EPF8820GM883B-3 by Altera

EPF8820GM883B-3

Altera

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: PIN/PEG; No. of Terminals: 192; Package Code: PGA; Package Shape: SQUARE;

FPGA

672

152

148

CMOS

Field Programmable Gate Arrays

3.3/5,5 V

-55 °C (-67 °F)

125 °C (257 °F)

Military

220 °C (428 °F)

Ceramic

No

Grid Array

PGA

Square

PGA192,17X17

Perpendicular

Pin/Peg

Tin Lead

2.54 mm

192

S-XPGA-P192

e0

No

38535Q/M;38534H;883B

EPF8820WM883B-3 by Altera

EPF8820WM883B-3

Altera

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: QFP; Package Shape: SQUARE;

FPGA

672

152

148

CMOS

Field Programmable Gate Arrays

3.3/5,5 V

-55 °C (-67 °F)

125 °C (257 °F)

Military

220 °C (428 °F)

Ceramic

Yes

Flatpack

QFP

Square

QFP208,1.2SQ,20

Quad

Gull Wing

Tin Lead

.5 mm

208

S-XQFP-G208

e0

No

38535Q/M;38534H;883B

XCS30XL-5BG256C by Xilinx

XCS30XL-5BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCS40XL-5BG256C by Xilinx

XCS40XL-5BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

784

205

205

784

13000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCS05XL-5PC84C by Xilinx

XCS05XL-5PC84C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;

FPGA

100

77

77

100

2000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 2000 Gates

Maximum usable gates 5000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Chip Carrier

QCCJ

Square

29.3116 mm

29.3116 mm

5.08 mm

LDCC84,1.2SQ

Quad

J Bend

Tin Lead

1.27 mm

84

S-PQCC-J84

e0

No

XCS10XL-5PC84C by Xilinx

XCS10XL-5PC84C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;

FPGA

196

112

112

196

3000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

MAXIMUM usable gates 10000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Chip Carrier

QCCJ

Square

29.3116 mm

29.3116 mm

5.08 mm

LDCC84,1.2SQ

Quad

J Bend

Tin Lead

1.27 mm

84

S-PQCC-J84

e0

No

XCS05XL-4VQ100I by Xilinx

XCS05XL-4VQ100I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE; Surface Mount: YES;

FPGA

100

77

77

100

2000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 2000 Gates

Maximum usable gates 5000

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Tin/Lead

.5 mm

100

S-PQFP-G100

e0

No

XCS05XL-5VQ100C by Xilinx

XCS05XL-5VQ100C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FPGA

100

77

77

100

2000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 2000 Gates

Maximum usable gates 5000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Tin/Lead

.5 mm

100

S-PQFP-G100

e0

No

XCS10XL-4VQ100I by Xilinx

XCS10XL-4VQ100I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE; Pitch Of Terminal: .5 mm;

FPGA

196

112

112

196

3000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

MAXIMUM usable gates 10000

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Tin/Lead

.5 mm

100

S-PQFP-G100

e0

No

XCS10XL-5VQ100C by Xilinx

XCS10XL-5VQ100C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FPGA

196

112

112

196

3000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

MAXIMUM usable gates 10000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Tin/Lead

.5 mm

100

S-PQFP-G100

e0

No

XCS20XL-5VQ100C by Xilinx

XCS20XL-5VQ100C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Maximum usable gates 20000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Tin/Lead

.5 mm

100

S-PQFP-G100

e0

No

XCS30XL-5VQ100C by Xilinx

XCS30XL-5VQ100C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

100

S-PQFP-G100

e0

No

XCS10XL-5TQ144C by Xilinx

XCS10XL-5TQ144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

196

112

112

196

3000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

MAXIMUM usable gates 10000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

144

S-PQFP-G144

e0

No

XCS20XL-4TQ144I by Xilinx

XCS20XL-4TQ144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

400

160

160

400

7000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Maximum usable gates 20000

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

144

S-PQFP-G144

e0

No

XCS20XL-5TQ144C by Xilinx

XCS20XL-5TQ144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Maximum usable gates 20000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

144

S-PQFP-G144

e0

No

XCS30XL-4TQ144I by Xilinx

XCS30XL-4TQ144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;

FPGA

576

196

196

576

10000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

144

S-PQFP-G144

e0

No

XCS30XL-5TQ144C by Xilinx

XCS30XL-5TQ144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

144

S-PQFP-G144

e0

No

XCS20XL-4PQ208I by Xilinx

XCS20XL-4PQ208I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; No. of Inputs: 160;

FPGA

400

160

160

400

7000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Maximum usable gates 20000

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

208

S-PQFP-G208

e0

No

XCS20XL-5PQ208C by Xilinx

XCS20XL-5PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Maximum usable gates 20000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

208

S-PQFP-G208

e0

No

XCS30XL-4PQ208I by Xilinx

XCS30XL-4PQ208I

Xilinx

Xilinx XCS30XL-4PQ208I FPGA features 576 logic cells, 10000 gates, and a max clock frequency of 217 MHz. Ideal for applications requiring high-speed processing and programmable ICs in compact designs.

FPGA

576

196

196

576

10000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

208

S-PQFP-G208

e0

No

XCS30XL-5PQ208C by Xilinx

XCS30XL-5PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

208

S-PQFP-G208

e0

No

XCS40XL-4PQ208I by Xilinx

XCS40XL-4PQ208I

Xilinx

Xilinx XCS40XL-4PQ208I FPGA features 784 logic cells, 13000 gates, and a max clock frequency of 217 MHz. Ideal for applications requiring high-speed processing and programmable ICs in compact designs with a square package shape and gull wing terminals.

FPGA

784

205

205

784

13000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

208

S-PQFP-G208

e0

No

XCS40XL-5PQ208C by Xilinx

XCS40XL-5PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

784

205

205

784

13000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

208

S-PQFP-G208

e0

No

XCS30XL-5PQ240C by Xilinx

XCS30XL-5PQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

32 mm

32 mm

4.1 mm

QFP240,1.3SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XCS40XL-5PQ240C by Xilinx

XCS40XL-5PQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;

FPGA

784

205

205

784

13000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

32 mm

32 mm

4.1 mm

QFP240,1.3SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC6VLX195T-3FF784C by Xilinx

XC6VLX195T-3FF784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

1412 MHz

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.86 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX240T-3FF1759C by Xilinx

XC6VLX240T-3FF1759C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

241152

720

720

1412 MHz

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin Lead

1 mm

1759

S-PBGA-B1759

e0

No

XC6VLX75T-3FF484C by Xilinx

XC6VLX75T-3FF484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1412 MHz

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XCS30-3BG256C by Xilinx

XCS30-3BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin Lead

1.27 mm

256

S-PBGA-B256

e0

No

XCS30-4BG256C by Xilinx

XCS30-4BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

166 MHz

1.2 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin Lead

1.27 mm

256

S-PBGA-B256

e0

No

XCS30XL-4BG256C by Xilinx

XCS30XL-4BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCS40-3BG256C by Xilinx

XCS40-3BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

784

205

205

784

13000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No