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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC5210-5PQ240C by Xilinx

XC5210-5PQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;

FPGA

324

196

196

324

10000

83 MHz

4.6 ns

CMOS

Field Programmable Gate Arrays

324 CLBS, 10000 Gates

MAX available 16000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

32 mm

32 mm

4.1 mm

QFP240,1.3SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC5210-6PQ240C by Xilinx

XC5210-6PQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;

FPGA

324

196

196

324

10000

83 MHz

5.6 ns

CMOS

Field Programmable Gate Arrays

324 CLBS, 10000 Gates

MAX available 16000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

32 mm

32 mm

4.1 mm

QFP240,1.3SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XCS30-3PQ240C by Xilinx

XCS30-3PQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

32 mm

32 mm

4.1 mm

QFP240,1.3SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XCS30-4PQ240C by Xilinx

XCS30-4PQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

166 MHz

1.2 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

32 mm

32 mm

4.1 mm

QFP240,1.3SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XCS30XL-4PQ240C by Xilinx

XCS30XL-4PQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

32 mm

32 mm

4.1 mm

QFP240,1.3SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XCS40-3PQ240C by Xilinx

XCS40-3PQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;

FPGA

784

205

205

784

13000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

32 mm

32 mm

4.1 mm

QFP240,1.3SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XCS40-4PQ240C by Xilinx

XCS40-4PQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;

FPGA

784

205

205

784

13000

166 MHz

1.2 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

32 mm

32 mm

4.1 mm

QFP240,1.3SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XCS40XL-4PQ240C by Xilinx

XCS40XL-4PQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;

FPGA

784

205

205

784

13000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

32 mm

32 mm

4.1 mm

QFP240,1.3SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XC3030L-8VQ64C by Xilinx

XC3030L-8VQ64C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE;

FPGA

100

54

54

100

1500

80 MHz

6.7 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 1500 Gates

Max usable 2000 Logic gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

10 mm

10 mm

1.2 mm

TQFP64,.47SQ

Quad

Gull Wing

Tin Lead

.5 mm

64

S-PQFP-G64

e0

No

XC3030L-8VQ64I by Xilinx

XC3030L-8VQ64I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE;

FPGA

100

54

54

100

1500

80 MHz

6.7 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 1500 Gates

Max usable 2000 Logic gates

3.3

3 V

3.6 V

3.3 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

10 mm

10 mm

1.2 mm

TQFP64,.47SQ

Quad

Gull Wing

Tin Lead

.5 mm

64

S-PQFP-G64

e0

No

XC7K325T-1FB900I by Xilinx

XC7K325T-1FB900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

25475

0.74 ns

25475 CLBS

1

.97 V

1.03 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.54 mm

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

XC4010E-1BG225C by Xilinx

XC4010E-1BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

166 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-3BG225C by Xilinx

XC4010E-3BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-3BG225I by Xilinx

XC4010E-3BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 160;

FPGA

400

160

160

400

7000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-4BG225C by Xilinx

XC4010E-4BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-4BG225I by Xilinx

XC4010E-4BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 400;

FPGA

400

160

160

400

7000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-1BG225C by Xilinx

XC4013E-1BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

166 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-2BG225C by Xilinx

XC4013E-2BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-2BG225I by Xilinx

XC4013E-2BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 10000;

FPGA

1368

192

192

576

10000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-3BG225C by Xilinx

XC4013E-3BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-3BG225I by Xilinx

XC4013E-3BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 4.5 V;

FPGA

1368

192

192

576

10000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-4BG225C by Xilinx

XC4013E-4BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-4BG225I by Xilinx

XC4013E-4BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 5;

FPGA

1368

192

192

576

10000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4085XLA-09BG352I by Xilinx

XC4085XLA-09BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

7448

289

289

3136

55000

227 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

3136 CLBS, 55000 Gates

Can also use 180000 gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XC4036XLA-09BG432C by Xilinx

XC4036XLA-09BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1296

288

288

1296

22000

227 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

1296 CLBS, 22000 Gates

Can also use 65000 gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XC4052XLA-08BG432C by Xilinx

XC4052XLA-08BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1936

352

352

1936

33000

263 MHz

1 ns

CMOS

Field Programmable Gate Arrays

1936 CLBS, 33000 Gates

Can also use 100000 gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XC4085XLA-08BG432C by Xilinx

XC4085XLA-08BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

7448

352

352

3136

55000

263 MHz

1 ns

CMOS

Field Programmable Gate Arrays

3136 CLBS, 55000 Gates

Can also use 180000 gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XC4085XLA-09BG432C by Xilinx

XC4085XLA-09BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

7448

352

352

3136

55000

227 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

3136 CLBS, 55000 Gates

Can also use 180000 gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XC40200XV-07BG560C by Xilinx

XC40200XV-07BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

7056

448

448

7056

130000

296 MHz

1 ns

CMOS

Field Programmable Gate Arrays

7056 CLBS, 130000 Gates

Can also use 400000 gates

2.5

2.3 V

2.7 V

2.5,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin Lead

1.27 mm

560

S-PBGA-B560

e0

No

XC4085XLA-09BG560I by Xilinx

XC4085XLA-09BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Maximum Seated Height: 1.7 mm;

FPGA

3136

448

448

3136

55000

227 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

3136 CLBS, 55000 Gates

Can also use 180000 gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XC4003E-1PG120C by Xilinx

XC4003E-1PG120C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: PIN/PEG; No. of Terminals: 120; Package Code: HPGA; Package Shape: SQUARE;

FPGA

100

80

80

100

2000

166 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 2000 Gates

Max usable 3000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

34.544 mm

34.544 mm

4.318 mm

PGA120,13X13

Perpendicular

Pin/Peg

2.54 mm

120

S-CPGA-P120

No

XC4003E-2PG120C by Xilinx

XC4003E-2PG120C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: PIN/PEG; No. of Terminals: 120; Package Code: HPGA; Package Shape: SQUARE;

FPGA

100

80

80

100

2000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 2000 Gates

Max usable 3000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

34.544 mm

34.544 mm

4.318 mm

PGA120,13X13

Perpendicular

Pin/Peg

2.54 mm

120

S-CPGA-P120

No

XC4003E-2PG120I by Xilinx

XC4003E-2PG120I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: PIN/PEG; No. of Terminals: 120; Package Code: HPGA; Package Shape: SQUARE; Position Of Terminal: PERPENDICULAR;

FPGA

100

80

80

100

2000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 2000 Gates

Max usable 3000 Logic gates

5

4.5 V

5.5 V

5 V

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

34.544 mm

34.544 mm

4.318 mm

PGA120,13X13

Perpendicular

Pin/Peg

2.54 mm

120

S-CPGA-P120

No

XC4003E-3PG120C by Xilinx

XC4003E-3PG120C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: PIN/PEG; No. of Terminals: 120; Package Code: HPGA; Package Shape: SQUARE;

FPGA

100

80

80

100

2000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 2000 Gates

Max usable 3000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

34.544 mm

34.544 mm

4.318 mm

PGA120,13X13

Perpendicular

Pin/Peg

2.54 mm

120

S-CPGA-P120

No

XC4003E-3PG120I by Xilinx

XC4003E-3PG120I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: PIN/PEG; No. of Terminals: 120; Package Code: HPGA; Package Shape: SQUARE; Additional Features: MAX USABLE 3000 LOGIC GATES;

FPGA

100

80

80

100

2000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 2000 Gates

Max usable 3000 Logic gates

5

4.5 V

5.5 V

5 V

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

34.544 mm

34.544 mm

4.318 mm

PGA120,13X13

Perpendicular

Pin/Peg

2.54 mm

120

S-CPGA-P120

No

XC4003E-4PG120I by Xilinx

XC4003E-4PG120I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: PIN/PEG; No. of Terminals: 120; Package Code: HPGA; Package Shape: SQUARE; Length: 34.544 mm;

FPGA

100

80

80

100

2000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

100 CLBS, 2000 Gates

Max usable 3000 Logic gates

5

4.5 V

5.5 V

5 V

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

34.544 mm

34.544 mm

4.318 mm

PGA120,13X13

Perpendicular

Pin/Peg

2.54 mm

120

S-CPGA-P120

No

XC4005E-1PG156C by Xilinx

XC4005E-1PG156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: PIN/PEG; No. of Terminals: 156; Package Code: HPGA; Package Shape: SQUARE;

FPGA

196

112

112

196

3000

166 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

Max usable 5000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

42.164 mm

42.164 mm

4.318 mm

PGA156,16X16

Perpendicular

Pin/Peg

2.54 mm

156

S-CPGA-P156

No

XC4005E-2PG156C by Xilinx

XC4005E-2PG156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: PIN/PEG; No. of Terminals: 156; Package Code: HPGA; Package Shape: SQUARE;

FPGA

196

112

112

196

3000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

Max usable 5000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

42.164 mm

42.164 mm

4.318 mm

PGA156,16X16

Perpendicular

Pin/Peg

2.54 mm

156

S-CPGA-P156

No

XC4005E-3PG156C by Xilinx

XC4005E-3PG156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: PIN/PEG; No. of Terminals: 156; Package Code: HPGA; Package Shape: SQUARE;

FPGA

196

112

112

196

3000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

Max usable 5000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

42.164 mm

42.164 mm

4.318 mm

PGA156,16X16

Perpendicular

Pin/Peg

2.54 mm

156

S-CPGA-P156

No

XC4005E-4PG156C by Xilinx

XC4005E-4PG156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: PIN/PEG; No. of Terminals: 156; Package Code: HPGA; Package Shape: SQUARE;

FPGA

196

112

112

196

3000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

Max usable 5000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

42.164 mm

42.164 mm

4.318 mm

PGA156,16X16

Perpendicular

Pin/Peg

2.54 mm

156

S-CPGA-P156

No

XC4005E-4PG156I by Xilinx

XC4005E-4PG156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: PIN/PEG; No. of Terminals: 156; Package Code: HPGA; Package Shape: SQUARE; No. of CLBs: 196;

FPGA

196

112

112

196

3000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

Max usable 5000 Logic gates

5

4.5 V

5.5 V

5 V

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

42.164 mm

42.164 mm

4.318 mm

PGA156,16X16

Perpendicular

Pin/Peg

2.54 mm

156

S-CPGA-P156

No

XC4006E-2PG156C by Xilinx

XC4006E-2PG156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: PIN/PEG; No. of Terminals: 156; Package Code: HPGA; Package Shape: SQUARE;

FPGA

608

125

125

256

4000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

256 CLBS, 4000 Gates

Max usable 6000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

42.164 mm

42.164 mm

4.318 mm

PGA156,16X16

Perpendicular

Pin/Peg

2.54 mm

156

S-CPGA-P156

No

XC4006E-3PG156C by Xilinx

XC4006E-3PG156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: PIN/PEG; No. of Terminals: 156; Package Code: HPGA; Package Shape: SQUARE;

FPGA

608

125

125

256

4000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

256 CLBS, 4000 Gates

Max usable 6000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

42.164 mm

42.164 mm

4.318 mm

PGA156,16X16

Perpendicular

Pin/Peg

2.54 mm

156

S-CPGA-P156

No

XC4006E-4PG156C by Xilinx

XC4006E-4PG156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: PIN/PEG; No. of Terminals: 156; Package Code: HPGA; Package Shape: SQUARE;

FPGA

608

125

125

256

4000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

256 CLBS, 4000 Gates

Max usable 6000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

42.164 mm

42.164 mm

4.318 mm

PGA156,16X16

Perpendicular

Pin/Peg

2.54 mm

156

S-CPGA-P156

No

XC4006E-4PG156I by Xilinx

XC4006E-4PG156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: PIN/PEG; No. of Terminals: 156; Package Code: HPGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

FPGA

608

125

125

256

4000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

256 CLBS, 4000 Gates

Max usable 6000 Logic gates

5

4.5 V

5.5 V

5 V

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

42.164 mm

42.164 mm

4.318 mm

PGA156,16X16

Perpendicular

Pin/Peg

2.54 mm

156

S-CPGA-P156

No

XC4008E-1PG191C by Xilinx

XC4008E-1PG191C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: PIN/PEG; No. of Terminals: 191; Package Code: HPGA; Package Shape: SQUARE;

FPGA

324

144

144

324

6000

166 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

324 CLBS, 6000 Gates

Max usable 8000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

47.244 mm

47.244 mm

4.318 mm

PGA191M,18X18

Perpendicular

Pin/Peg

2.54 mm

191

S-CPGA-P191

No

XC4008E-2PG191C by Xilinx

XC4008E-2PG191C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: PIN/PEG; No. of Terminals: 191; Package Code: HPGA; Package Shape: SQUARE;

FPGA

324

144

144

324

6000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

324 CLBS, 6000 Gates

Max usable 8000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

47.244 mm

47.244 mm

4.318 mm

PGA191M,18X18

Perpendicular

Pin/Peg

2.54 mm

191

S-CPGA-P191

No

XC4008E-3PG191C by Xilinx

XC4008E-3PG191C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: PIN/PEG; No. of Terminals: 191; Package Code: HPGA; Package Shape: SQUARE;

FPGA

324

144

144

324

6000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

324 CLBS, 6000 Gates

Max usable 8000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

No

Grid Array, Heat Sink/Slug

HPGA

Square

47.244 mm

47.244 mm

4.318 mm

PGA191M,18X18

Perpendicular

Pin/Peg

2.54 mm

191

S-CPGA-P191

No