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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XA6SLX16-2CSG225Q by Xilinx

XA6SLX16-2CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;

FPGA

14579

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX16-3CSG225Q by Xilinx

XA6SLX16-3CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 62.5 MHz;

FPGA

14579

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX4-2CSG225I by Xilinx

XA6SLX4-2CSG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Screening Level: AEC-Q100;

FPGA

3840

132

132

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX4-2CSG225Q by Xilinx

XA6SLX4-2CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

3840

132

132

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX9-2CSG225I by Xilinx

XA6SLX9-2CSG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

9152

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX9-2CSG225Q by Xilinx

XA6SLX9-2CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B225;

FPGA

9152

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

ICE40LP4K-CM225 by Lattice Semiconductor

ICE40LP4K-CM225

Lattice Semiconductor

ICE40LP4K-CM225 by Lattice Semiconductor is a CMOS FPGA with 3520 logic cells, 440 CLBs, and 167 inputs/outputs. Operating at max 133 MHz clock frequency, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and very thin profile, it offers versatile integration possibilities.

FPGA

3520

167

167

440

133 MHz

9.36 ns

CMOS

Field Programmable Gate Arrays

440 CLBS

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

7 mm

7 mm

1 mm

BGA225,15X15,16

Bottom

Ball

Tin Silver Copper

.4 mm

225

S-PBGA-B225

e1

No

XC4010E-1BG225C by Xilinx

XC4010E-1BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

166 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-3BG225C by Xilinx

XC4010E-3BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-3BG225I by Xilinx

XC4010E-3BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 160;

FPGA

400

160

160

400

7000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-4BG225C by Xilinx

XC4010E-4BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-4BG225I by Xilinx

XC4010E-4BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 400;

FPGA

400

160

160

400

7000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-1BG225C by Xilinx

XC4013E-1BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

166 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-2BG225C by Xilinx

XC4013E-2BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-2BG225I by Xilinx

XC4013E-2BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 10000;

FPGA

1368

192

192

576

10000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-3BG225C by Xilinx

XC4013E-3BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-3BG225I by Xilinx

XC4013E-3BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 4.5 V;

FPGA

1368

192

192

576

10000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-4BG225C by Xilinx

XC4013E-4BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-4BG225I by Xilinx

XC4013E-4BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 5;

FPGA

1368

192

192

576

10000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC6SLX16-2CSG225C by Xilinx

XC6SLX16-2CSG225C

Xilinx

Xilinx XC6SLX16-2CSG225C FPGA features 14579 logic cells, 1139 CLBs, and 160 inputs/outputs. Operating at a max frequency of 667 MHz, it's ideal for applications requiring high-speed processing like telecommunications and industrial automation. With a low profile grid array package, it offers flexibility in design while maintaining high performance standards.

FPGA

14579

160

160

1139

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX16-2CSG225I by Xilinx

XC6SLX16-2CSG225I

Xilinx

Xilinx XC6SLX16-2CSG225I FPGA features 14579 logic cells, 1139 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

14579

160

160

1139

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX16-3CSG225C by Xilinx

XC6SLX16-3CSG225C

Xilinx

Xilinx XC6SLX16-3CSG225C FPGA features 14579 logic cells, 1139 CLBs, and 160 inputs/outputs. It operates at a max frequency of 862 MHz with a combinatorial delay of 0.21 ns per CLB. Ideal for applications requiring high-speed processing and complex logic functions in various industries.

FPGA

14579

160

160

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX16-3CSG225I by Xilinx

XC6SLX16-3CSG225I

Xilinx

XC6SLX16-3CSG225I by Xilinx is a CMOS-based FPGA with 14579 logic cells and 1139 CLBs. It operates at a max clock frequency of 862 MHz and is commonly used in industrial applications requiring high-performance programmable ICs.

FPGA

14579

160

160

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX16-L1CSG225I by Xilinx

XC6SLX16-L1CSG225I

Xilinx

XC6SLX16-L1CSG225I by Xilinx is a FPGA with 14579 logic cells, 1139 CLBs, and 160 inputs/outputs. Operating at 1.05V, it uses CMOS technology and has a max combinatorial delay of 0.46ns. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

14579

160

160

1139

0.46 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX4-2CSG225C by Xilinx

XC6SLX4-2CSG225C

Xilinx

Xilinx XC6SLX4-2CSG225C FPGA features 3840 logic cells, 300 CLBs, and 120 inputs/outputs. Utilized in applications requiring high clock frequencies up to 667 MHz, such as telecommunications and networking equipment due to its low profile grid array package style. Operating temperature ranges from 0°C to 85°C with a max supply voltage of 1.26 V.

FPGA

3840

120

120

300

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX4-2CSG225I by Xilinx

XC6SLX4-2CSG225I

Xilinx

Xilinx XC6SLX4-2CSG225I is a FPGA with 3840 logic cells, 300 CLBs, and 120 inputs/outputs. Operating at max frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a temperature range from -40 to 100°C.

FPGA

3840

120

120

300

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX4-3CSG225C by Xilinx

XC6SLX4-3CSG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

3840

120

120

300

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX4-3CSG225I by Xilinx

XC6SLX4-3CSG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

3840

132

132

300

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX4-L1CSG225C by Xilinx

XC6SLX4-L1CSG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

3840

132

132

300

0.46 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX4-L1CSG225I by Xilinx

XC6SLX4-L1CSG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

3840

120

120

300

0.46 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-2CSG225C by Xilinx

XC6SLX9-2CSG225C

Xilinx

Xilinx XC6SLX9-2CSG225C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 667 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

9152

160

160

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-2CSG225I by Xilinx

XC6SLX9-2CSG225I

Xilinx

Xilinx XC6SLX9-2CSG225I FPGA features 9152 logic cells, 715 CLBs, and 160 inputs/outputs. With a max clock frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The device operates b/w -40 to 100°C and supports supply voltages of 1.14V to 1.26V.

FPGA

9152

160

160

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-3CSG225C by Xilinx

XC6SLX9-3CSG225C

Xilinx

Xilinx XC6SLX9-3CSG225C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. It operates at 1.2V nominal voltage and is used in applications requiring high-speed processing like telecommunications and signal processing.

FPGA

9152

160

160

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-3CSG225I by Xilinx

XC6SLX9-3CSG225I

Xilinx

XC6SLX9-3CSG225I by Xilinx is a FPGA with 9152 logic cells, 715 CLBs, and 160 inputs/outputs. Operating at max frequency of 862 MHz, it's ideal for industrial applications requiring high-speed processing in a temperature range from -40 to 100°C. The package style is grid array with low profile and fine pitch terminals.

FPGA

9152

160

160

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-L1CSG225C by Xilinx

XC6SLX9-L1CSG225C

Xilinx

The Xilinx XC6SLX9-L1CSG225C is a FPGA with 9152 logic cells, 715 CLBs, and 160 inputs/outputs. It operates at voltages of 1.05V and supports CMOS technology. Ideal for applications requiring high-speed processing in compact designs with low power consumption.

FPGA

9152

160

160

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-L1CSG225I by Xilinx

XC6SLX9-L1CSG225I

Xilinx

Xilinx XC6SLX9-L1CSG225I is a FPGA with 9152 logic cells, 715 CLBs, and 160 inputs/outputs. Operating at max voltage of 1.05V, it's ideal for industrial applications requiring high combinatorial delay performance in a compact package. With a grid array style and low profile design, it offers versatility in various electronic systems.

FPGA

9152

160

160

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX16-N3CSG225C by Xilinx

XC6SLX16-N3CSG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

14579

160

160

1139

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX16-N3CSG225I by Xilinx

XC6SLX16-N3CSG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

14579

160

160

1139

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-N3CSG225C by Xilinx

XC6SLX9-N3CSG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

9152

160

160

715

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-N3CSG225I by Xilinx

XC6SLX9-N3CSG225I

Xilinx

Xilinx XC6SLX9-N3CSG225I FPGA features 9152 logic cells, 715 CLBs, and 160 inputs/outputs. With a max clock frequency of 806 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The device operates b/w -40 to 100°C and uses CMOS technology with a supply voltage range of 1.14-1.26V.

FPGA

9152

160

160

715

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC7S15-1CSGA225C by Xilinx

XC7S15-1CSGA225C

Xilinx

Xilinx XC7S15-1CSGA225C FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data processing units.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S15-1CSGA225I by Xilinx

XC7S15-1CSGA225I

Xilinx

Xilinx XC7S15-1CSGA225I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a low profile grid array package style.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S15-2CSGA225C by Xilinx

XC7S15-2CSGA225C

Xilinx

The Xilinx XC7S15-2CSGA225C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

12800

100

100

1000

1286 MHz

1.05 ns

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S15-2CSGA225I by Xilinx

XC7S15-2CSGA225I

Xilinx

Xilinx XC7S15-2CSGA225I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Suitable for surface mount designs with a package style of grid array and fine pitch terminals.

FPGA

12800

100

100

1000

1286 MHz

1.05 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S15-L1CSGA225I by Xilinx

XC7S15-L1CSGA225I

Xilinx

Xilinx XC7S15-L1CSGA225I FPGA offers 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S25-1CSGA225C by Xilinx

XC7S25-1CSGA225C

Xilinx

The Xilinx XC7S25-1CSGA225C is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. The package style is grid array, low profile, fine pitch with PLASTIC/EPOXY material.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S25-1CSGA225I by Xilinx

XC7S25-1CSGA225I

Xilinx

XC7S25-1CSGA225I by Xilinx is a Field Programmable Gate Array (FPGA) with 23360 logic cells and 1825 configurable logic blocks (CLBs). It operates at a max clock frequency of 1098 MHz and is commonly used in industrial applications.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S25-2CSGA225I by Xilinx

XC7S25-2CSGA225I

Xilinx

The Xilinx XC7S25-2CSGA225I is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1286 MHz. It operates b/w -40 to 100 °C and has a package style of GRID ARRAY for industrial applications.

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1