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Standard FPGAs

Field Programmable Gate Arrays (FPGA)

Available Parts 2,400+

Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC7K325T-L2FBG676E by Xilinx

XC7K325T-L2FBG676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

FPGA

326080

400

400

25475

0.91 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9,1.8,3.3 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.54 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7K325T-L2FBG900E by Xilinx

XC7K325T-L2FBG900E

Xilinx

The Xilinx XC7K325T-L2FBG900E is a FPGA with 326080 logic cells, 25475 CLBs, and 500 inputs/outputs. It operates at 0.9V nominal voltage and uses CMOS technology. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package.

FPGA

326080

500

500

25475

0.91 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.54 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K325T-L2FFG676E by Xilinx

XC7K325T-L2FFG676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

326080

400

400

25475

0.91 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9,1.8,3.3 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.37 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7K325T-L2FFG900E by Xilinx

XC7K325T-L2FFG900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

326080

500

500

25475

0.91 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K410T-L2FBG676E by Xilinx

XC7K410T-L2FBG676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

406720

400

400

31775

0.91 ns

CMOS

Field Programmable Gate Arrays

31775 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9,1.8,3.3 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.54 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7K410T-L2FFG900E by Xilinx

XC7K410T-L2FFG900E

Xilinx

The Xilinx XC7K410T-L2FFG900E is a FPGA with 406720 logic cells, 31775 CLBs, and 500 inputs/outputs. It operates at 0.9V nominal voltage and supports multiple power supplies (0.9V, 1.8V, 3.3V). Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package style.

FPGA

406720

500

500

31775

0.91 ns

CMOS

Field Programmable Gate Arrays

31775 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K480T-L2FFG901E by Xilinx

XC7K480T-L2FFG901E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 901; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): .9;

FPGA

477760

380

380

37325

0.91 ns

CMOS

Field Programmable Gate Arrays

37325 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

901

S-PBGA-B901

e1

No

XC7K70T-L2FBG484E by Xilinx

XC7K70T-L2FBG484E

Xilinx

The Xilinx XC7K70T-L2FBG484E is a FPGA with 65600 logic cells, 5125 CLBs, and 285 inputs/outputs. It operates at a max supply voltage of 0.93V and uses CMOS technology. This device is ideal for applications requiring high-speed processing and programmable logic capabilities in a compact GRID ARRAY package.

FPGA

65600

285

285

5125

0.91 ns

CMOS

Field Programmable Gate Arrays

5125 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9,1.8,3.3 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.54 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7K70T-L2FBG676E by Xilinx

XC7K70T-L2FBG676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B676;

FPGA

65600

300

300

5125

0.91 ns

CMOS

Field Programmable Gate Arrays

5125 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9,1.8,3.3 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.54 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XA6SLX100-2FGG484I by Xilinx

XA6SLX100-2FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

101261

326

326

667 MHz

CMOS

Field Programmable Gate Arrays

1.2,1.2/3.3,2.5/3.3 V

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX100-2FGG484Q by Xilinx

XA6SLX100-2FGG484Q

Xilinx

XA6SLX100-2FGG484Q by Xilinx is a CMOS FPGA with 101261 logic cells, 326 inputs/outputs, and max clock freq of 667MHz. Ideal for applications requiring high-speed processing like telecommunications, automotive systems, and industrial automation.

FPGA

101261

326

326

667 MHz

CMOS

Field Programmable Gate Arrays

1.2,1.2/3.3,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX16-2CSG225Q by Xilinx

XA6SLX16-2CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;

FPGA

14579

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX16-2CSG324I by Xilinx

XA6SLX16-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA324,18X18,32;

FPGA

14579

232

232

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX16-2CSG324Q by Xilinx

XA6SLX16-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

14579

232

232

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX16-3CSG225Q by Xilinx

XA6SLX16-3CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 62.5 MHz;

FPGA

14579

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX25-2CSG324I by Xilinx

XA6SLX25-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Power Supplies (V): 1.2,2.5/3.3;

FPGA

24051

226

226

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX25-2CSG324Q by Xilinx

XA6SLX25-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

24051

226

226

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX25-2FGG484Q by Xilinx

XA6SLX25-2FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

24051

266

266

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX25-3CSG324I by Xilinx

XA6SLX25-3CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; No. of Outputs: 226;

FPGA

24051

226

226

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX25-3CSG324Q by Xilinx

XA6SLX25-3CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

24051

226

226

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX25T-2CSG324Q by Xilinx

XA6SLX25T-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; No. of Inputs: 190;

FPGA

24051

190

190

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX25T-2FGG484Q by Xilinx

XA6SLX25T-2FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

24051

250

250

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX25T-3FGG484Q by Xilinx

XA6SLX25T-3FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 250;

FPGA

24051

250

250

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX4-2CSG225I by Xilinx

XA6SLX4-2CSG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Screening Level: AEC-Q100;

FPGA

3840

132

132

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX4-2CSG225Q by Xilinx

XA6SLX4-2CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

3840

132

132

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX45-2CSG324I by Xilinx

XA6SLX45-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

43661

218

218

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45-2CSG324Q by Xilinx

XA6SLX45-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

43661

218

218

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45-2CSG484I by Xilinx

XA6SLX45-2CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B484;

FPGA

43661

320

320

667 MHz

CMOS

Field Programmable Gate Arrays

1.2,1.2/3.3,2.5/3.3 V

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX45-2FGG484I by Xilinx

XA6SLX45-2FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

43661

316

316

3411

667 MHz

0.26 ns

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100; TS 16949

XA6SLX45-3CSG324I by Xilinx

XA6SLX45-3CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

43661

218

218

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45-3CSG324Q by Xilinx

XA6SLX45-3CSG324Q

Xilinx

The Xilinx XA6SLX45-3CSG324Q is a FPGA with 43661 logic cells, 218 inputs/outputs, and max clock frequency of 62.5 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

43661

218

218

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45-3CSG484I by Xilinx

XA6SLX45-3CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

43661

320

320

862 MHz

CMOS

Field Programmable Gate Arrays

1.2,1.2/3.3,2.5/3.3 V

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX45-3FGG484I by Xilinx

XA6SLX45-3FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA484,22X22,40;

FPGA

43661

316

316

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX45-3FGG484Q by Xilinx

XA6SLX45-3FGG484Q

Xilinx

The Xilinx XA6SLX45-3FGG484Q is a FPGA with 43661 logic cells, 316 inputs/outputs, and max clock frequency of 62.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for automotive, industrial, or telecommunications sectors.

FPGA

43661

316

316

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100; TS 16949

XA6SLX45T-2CSG324Q by Xilinx

XA6SLX45T-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Pitch Of Terminal: .8 mm;

FPGA

43661

190

190

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45T-2FGG484Q by Xilinx

XA6SLX45T-2FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 43661;

FPGA

43661

296

296

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX45T-3CSG324Q by Xilinx

XA6SLX45T-3CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

43661

190

190

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45T-3FGG484I by Xilinx

XA6SLX45T-3FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B484;

FPGA

43661

296

296

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX45T-3FGG484Q by Xilinx

XA6SLX45T-3FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

43661

296

296

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX75-2CSG484Q by Xilinx

XA6SLX75-2CSG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

328

328

5831

0.26 ns

5831 CLBS

1.23

1.2 V

1.26 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

XA6SLX75-2FGG484Q by Xilinx

XA6SLX75-2FGG484Q

Xilinx

XA6SLX75-2FGG484Q by Xilinx is a FPGA with 74637 logic cells, 280 inputs/outputs, and max clock frequency of 62.5 MHz. Ideal for applications requiring high-speed processing like telecommunications, networking, and industrial automation.

FPGA

74637

280

280

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX75-3CSG484Q by Xilinx

XA6SLX75-3CSG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

328

328

5831

0.21 ns

5831 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

XA6SLX75-3FGG484Q by Xilinx

XA6SLX75-3FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

74637

280

280

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX75T-2FGG484I by Xilinx

XA6SLX75T-2FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

268

268

5831

667 MHz

0.26 ns

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100; TS 16949

XA6SLX75T-2FGG484Q by Xilinx

XA6SLX75T-2FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

74637

268

268

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX75T-3FGG484Q by Xilinx

XA6SLX75T-3FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

FPGA

74637

268

268

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX9-2CSG225I by Xilinx

XA6SLX9-2CSG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

9152

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX9-2CSG225Q by Xilinx

XA6SLX9-2CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B225;

FPGA

9152

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100