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Standard FPGAs

Field Programmable Gate Arrays (FPGA)

Available Parts 2,400+

Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XA6SLX9-2CSG324I by Xilinx

XA6SLX9-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 62.5 MHz;

FPGA

9152

200

200

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX9-2CSG324Q by Xilinx

XA6SLX9-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;

FPGA

9152

200

200

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XC7V2000T-1FLG1925C by Xilinx

XC7V2000T-1FLG1925C

Xilinx

Xilinx XC7V2000T-1FLG1925C is a FPGA with 1954560 logic cells, 152700 CLBs, and max clock frequency of 1818 MHz. Ideal for high-performance applications requiring advanced programmable ICs in compact form factors.

FPGA

1954560

1200

1200

152700

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

152700 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.75 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1925

S-PBGA-B1925

e1

No

XC7V2000T-2FHG1761C by Xilinx

XC7V2000T-2FHG1761C

Xilinx

The Xilinx XC7V2000T-2FHG1761C is a high-performance FPGA with 1954560 logic cells and 152700 CLBs. Operating at up to 1818 MHz, it has 850 inputs/outputs and uses CMOS technology. Ideal for applications requiring fast processing speeds in a compact form factor.

FPGA

1954560

850

850

152700

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

152700 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.75 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1761

S-PBGA-B1761

e1

No

XC7V2000T-2FLG1925C by Xilinx

XC7V2000T-2FLG1925C

Xilinx

Xilinx XC7V2000T-2FLG1925C is a FPGA with 1954560 logic cells, 152700 CLBs, and 1200 inputs/outputs. It operates at max frequency of 1818 MHz, suitable for high-performance applications like signal processing and data acceleration. With CMOS technology and low power supply requirements (1-1.8 V), it offers efficient programmable solutions in a compact grid array package.

FPGA

1954560

1200

1200

152700

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

152700 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.75 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1925

S-PBGA-B1925

e1

No

XC7VX1140T-1FLG1930C by Xilinx

XC7VX1140T-1FLG1930C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1930; Package Code: BGA; Package Shape: SQUARE;

FPGA

1139200

1100

1100

89000

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

89000 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.75 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1930

S-PBGA-B1930

e1

No

XC7VX1140T-1FLG1930I by Xilinx

XC7VX1140T-1FLG1930I

Xilinx

The Xilinx XC7VX1140T-1FLG1930I is a high-performance FPGA with 1139200 logic cells and 89000 CLBs. Operating at up to 1818 MHz, it offers 1100 inputs/outputs and uses CMOS technology. Ideal for applications requiring fast processing speeds in fields like telecommunications and aerospace.

FPGA

1139200

1100

1100

89000

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

89000 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.75 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1930

S-PBGA-B1930

e1

No

XC7VX1140T-2FLG1930C by Xilinx

XC7VX1140T-2FLG1930C

Xilinx

Xilinx XC7VX1140T-2FLG1930C FPGA offers 1139200 logic cells, 89000 CLBs, and a max clock frequency of 1818 MHz. Ideal for high-performance applications requiring advanced programmable ICs with a wide range of inputs and outputs.

FPGA

1139200

1100

1100

89000

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

89000 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.75 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1930

S-PBGA-B1930

e1

No

XC7VX330T-1FFG1157C by Xilinx

XC7VX330T-1FFG1157C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE;

FPGA

326400

600

600

25500

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

25500 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX330T-1FFG1157I by Xilinx

XC7VX330T-1FFG1157I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 1818 MHz;

FPGA

326400

600

600

25500

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

25500 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX330T-1FFG1761I by Xilinx

XC7VX330T-1FFG1761I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1761; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

326400

650

650

25500

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

25500 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1761

S-PBGA-B1761

e1

No

XC7VX330T-2FFG1157C by Xilinx

XC7VX330T-2FFG1157C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE;

FPGA

326400

600

600

25500

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

25500 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX330T-2FFG1157I by Xilinx

XC7VX330T-2FFG1157I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

326400

600

600

25500

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

25500 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX330T-2FFG1761C by Xilinx

XC7VX330T-2FFG1761C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1761; Package Code: BGA; Package Shape: SQUARE;

FPGA

326400

650

650

25500

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

25500 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1761

S-PBGA-B1761

e1

No

XC7VX330T-2FFG1761I by Xilinx

XC7VX330T-2FFG1761I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1761; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 326400;

FPGA

326400

650

650

25500

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

25500 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1761

S-PBGA-B1761

e1

No

XC7VX330T-3FFG1157E by Xilinx

XC7VX330T-3FFG1157E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

FPGA

326400

600

600

25500

1818 MHz

0.58 ns

CMOS

Field Programmable Gate Arrays

25500 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX330T-3FFG1761E by Xilinx

XC7VX330T-3FFG1761E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1761; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

326400

650

650

25500

1818 MHz

0.58 ns

CMOS

Field Programmable Gate Arrays

25500 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1761

S-PBGA-B1761

e1

No

XC7VX415T-1FFG1157I by Xilinx

XC7VX415T-1FFG1157I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1,1.8;

FPGA

412160

600

600

32200

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX415T-1FFG1158I by Xilinx

XC7VX415T-1FFG1158I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

412160

350

350

32200

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX415T-2FFG1157C by Xilinx

XC7VX415T-2FFG1157C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE;

FPGA

412160

600

600

32200

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX415T-2FFG1157I by Xilinx

XC7VX415T-2FFG1157I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;

FPGA

412160

600

600

32200

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX415T-2FFG1158C by Xilinx

XC7VX415T-2FFG1158C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE;

FPGA

412160

350

350

32200

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX415T-2FFG1158I by Xilinx

XC7VX415T-2FFG1158I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

412160

350

350

32200

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX415T-2FFG1927C by Xilinx

XC7VX415T-2FFG1927C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1927; Package Code: BGA; Package Shape: SQUARE;

FPGA

412160

600

600

32200

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

1 mm

1927

S-PBGA-B1927

e1

No

XC7VX415T-2FFG1927I by Xilinx

XC7VX415T-2FFG1927I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1927; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

412160

600

600

32200

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

1 mm

1927

S-PBGA-B1927

e1

No

XC7VX415T-3FFG1157E by Xilinx

XC7VX415T-3FFG1157E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

412160

600

600

32200

1818 MHz

0.58 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX485T-1FFG1158C by Xilinx

XC7VX485T-1FFG1158C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE;

FPGA

485760

350

350

37950

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX485T-1FFG1158I by Xilinx

XC7VX485T-1FFG1158I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.35 mm;

FPGA

485760

350

350

37950

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX485T-1FFG1927C by Xilinx

XC7VX485T-1FFG1927C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1927; Package Code: BGA; Package Shape: SQUARE;

FPGA

485760

600

600

37950

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1927

S-PBGA-B1927

e1

No

XC7VX485T-1FFG1927I by Xilinx

XC7VX485T-1FFG1927I

Xilinx

XC7VX485T-1FFG1927I by Xilinx is a FPGA with 485760 logic cells, 37950 CLBs, and max clock freq of 1818 MHz. Ideal for high-performance applications requiring advanced programmable ICs in compact form factors.

FPGA

485760

600

600

37950

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1927

S-PBGA-B1927

e1

No

XC7VX485T-1FFG1930C by Xilinx

XC7VX485T-1FFG1930C

Xilinx

The Xilinx XC7VX485T-1FFG1930C is a FPGA with 485760 logic cells, 37950 CLBs, and max clock frequency of 1818 MHz. It is used in applications requiring high-speed processing and programmable ICs for various industries.

FPGA

485760

700

700

37950

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1930

S-PBGA-B1930

e1

No

XC7VX485T-1FFG1930I by Xilinx

XC7VX485T-1FFG1930I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1930; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 700;

FPGA

485760

700

700

37950

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1930

S-PBGA-B1930

e1

No

XC7VX485T-2FFG1158C by Xilinx

XC7VX485T-2FFG1158C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE;

FPGA

485760

350

350

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX485T-2FFG1158I by Xilinx

XC7VX485T-2FFG1158I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1158;

FPGA

485760

350

350

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX485T-2FFG1927C by Xilinx

XC7VX485T-2FFG1927C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1927; Package Code: BGA; Package Shape: SQUARE;

FPGA

485760

600

600

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1927

S-PBGA-B1927

e1

No

XC7VX485T-2FFG1927I by Xilinx

XC7VX485T-2FFG1927I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1927; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

485760

600

600

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1927

S-PBGA-B1927

e1

No

XC7VX485T-2FFG1930C by Xilinx

XC7VX485T-2FFG1930C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1930; Package Code: BGA; Package Shape: SQUARE;

FPGA

485760

700

700

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1930

S-PBGA-B1930

e1

No

XC7VX485T-2FFG1930I by Xilinx

XC7VX485T-2FFG1930I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1930; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

485760

700

700

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1930

S-PBGA-B1930

e1

No

XC7VX485T-3FFG1158E by Xilinx

XC7VX485T-3FFG1158E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

485760

350

350

37950

1818 MHz

0.58 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX485T-3FFG1927E by Xilinx

XC7VX485T-3FFG1927E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1927; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

FPGA

485760

600

600

37950

1818 MHz

0.58 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

245 °C (473 °F)

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1927

S-PBGA-B1927

e1

No

XC7VX550T-1FFG1158C by Xilinx

XC7VX550T-1FFG1158C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE;

FPGA

554240

350

350

43300

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

43300 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX550T-1FFG1927C by Xilinx

XC7VX550T-1FFG1927C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1927; Package Code: BGA; Package Shape: SQUARE;

FPGA

554240

600

600

43300

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

43300 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1927

S-PBGA-B1927

e1

No

XC7VX550T-1FFG1927I by Xilinx

XC7VX550T-1FFG1927I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1927; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

554240

600

600

43300

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

43300 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1927

S-PBGA-B1927

e1

No

XC7VX550T-2FFG1158C by Xilinx

XC7VX550T-2FFG1158C

Xilinx

Xilinx XC7VX550T-2FFG1158C FPGA features 554240 logic cells, 43300 CLBs, and max clock frequency of 1818 MHz. Ideal for high-performance applications requiring advanced programmable IC technology in a compact grid array package with low combinatorial delay.

FPGA

554240

350

350

43300

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

43300 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX550T-2FFG1158I by Xilinx

XC7VX550T-2FFG1158I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

FPGA

554240

350

350

43300

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

43300 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX550T-2FFG1927C by Xilinx

XC7VX550T-2FFG1927C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1927; Package Code: BGA; Package Shape: SQUARE;

FPGA

554240

600

600

43300

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

43300 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1927

S-PBGA-B1927

e1

No

XC7VX550T-2FFG1927I by Xilinx

XC7VX550T-2FFG1927I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1927; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 43300;

FPGA

554240

600

600

43300

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

43300 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1927

S-PBGA-B1927

e1

No

XC7VX690T-1FFG1157C by Xilinx

XC7VX690T-1FFG1157C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE;

FPGA

693120

600

600

54150

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No