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225 Other Function uPs,uCs & Peripheral ICs 10

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XC7Z010-1CLG225C by Xilinx

XC7Z010-1CLG225C

Xilinx

The Xilinx XC7Z010-1CLG225C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring low profile, fine pitch grid array packages in plastic/epoxy material.

S-PBGA-B225

13 mm

225

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z010-1CLG225I by Xilinx

XC7Z010-1CLG225I

Xilinx

The Xilinx XC7Z010-1CLG225I is a low-profile, fine-pitch grid array IC with 225 terminals. Operating b/w -40 to 100°C, it features a CMOS technology and requires a supply voltage of 0.95V to 1.05V. Ideal for System on Chip applications due to its compact size and ball terminal form factor.

S-PBGA-B225

13 mm

225

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z010-2CLG225I by Xilinx

XC7Z010-2CLG225I

Xilinx

XC7Z010-2CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. Ideal for applications requiring low profile and fine pitch grid array packages in Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B225

13 mm

225

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z010-3CLG225E by Xilinx

XC7Z010-3CLG225E

Xilinx

The Xilinx XC7Z010-3CLG225E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. This low profile chip in a grid array package is ideal for various applications requiring high performance and compact design.

S-PBGA-B225

13 mm

225

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XA7Z010-1CLG225Q by Xilinx

XA7Z010-1CLG225Q

Xilinx

XA7Z010-1CLG225Q by Xilinx is a MICROPROCESSOR CIRCUIT with 225 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Featuring CMOS technology, it has a 0.8 mm terminal pitch and TIN SILVER COPPER finish.

S-PBGA-B225

e1

13 mm

3

225

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1,1.8

Not Qualified

AEC-Q100

1.5 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

N

13 mm

MICROPROCESSOR CIRCUIT

XC7Z010-L1CLG225I by Xilinx

XC7Z010-L1CLG225I

Xilinx

XC7Z010-L1CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package features a grid array style with 225 terminals and is ideal for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B225

13 mm

225

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z007S-1CLG225C by Xilinx

XC7Z007S-1CLG225C

Xilinx

XC7Z007S-1CLG225C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95V to 1.05V. This low profile chip in a grid array package is ideal for various applications requiring high performance and compact design.

S-PBGA-B225

13 mm

225

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z007S-1CLG225I by Xilinx

XC7Z007S-1CLG225I

Xilinx

XC7Z007S-1CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 225 terminals in a low profile grid array package, it's ideal for various embedded applications.

S-PBGA-B225

13 mm

225

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z007S-2CLG225E by Xilinx

XC7Z007S-2CLG225E

Xilinx

The Xilinx XC7Z007S-2CLG225E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring low profile and fine pitch grid array packages.

S-PBGA-B225

13 mm

225

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z007S-2CLG225I by Xilinx

XC7Z007S-2CLG225I

Xilinx

XC7Z007S-2CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 225 terminals in a low profile grid array package, it's ideal for various uPs and uCs applications.

S-PBGA-B225

13 mm

225

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP