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SQUARE Power Management ICs 1,518

Power Management ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Adjustable Threshold Other IC type Nominal Bandwidth Control Mode Control Technique Maximum Input Voltage Minimum Input Voltage Nominal Input Voltage JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage (Vsup) Maximum Negative Input Voltage No. of Channels No. of Functions No. of Outputs No. of Terminals Maximum On-state Resistance (Ron) Maximum Operating Temperature Minimum Operating Temperature Maximum Output Current Maximum Output Voltage Minimum Output Voltage Nominal Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Main Out Ripple Voltage Screening Level Maximum Seated Height Sub-Category Maximum Supply Current (Isup) Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage (Vsup) Surface Mount Switcher Config Switching (V) Maximum Switching Frequency Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Nominal Threshold Voltage (V) Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Maximum Total Power Output Trim or Adjustable Output (V) Width (mm)
MPF7100BVBA0ESR2 by NXP Semiconductors

MPF7100BVBA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 7 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BVBA1ES by NXP Semiconductors

MPF7100BVBA1ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Position: QUAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BVBA4ESR2 by NXP Semiconductors

MPF7100BVBA4ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Seated Height: 1 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BVMA0ESR2 by NXP Semiconductors

MPF7100BVMA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BVMA2ESR2 by NXP Semiconductors

MPF7100BVMA2ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BVMA4ES by NXP Semiconductors

MPF7100BVMA4ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BMBA0ES by NXP Semiconductors

MPF7100BMBA0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Pitch: .5 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BVBA1ESR2 by NXP Semiconductors

MPF7100BVBA1ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Nominal Threshold Voltage (V): +2.8V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BVBA2ESR2 by NXP Semiconductors

MPF7100BVBA2ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BVBA3ES by NXP Semiconductors

MPF7100BVBA3ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Supply Voltage (Vsup): 2.5 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BVBA3ESR2 by NXP Semiconductors

MPF7100BVBA3ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BVMA2ES by NXP Semiconductors

MPF7100BVMA2ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Voltage (Vsup): 5.5 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BMBA0ESR2 by NXP Semiconductors

MPF7100BMBA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Adjustable Threshold: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BMMA0ESR2 by NXP Semiconductors

MPF7100BMMA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Peak Reflow Temperature (C): 260;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BVBA2ES by NXP Semiconductors

MPF7100BVBA2ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BVBA4ES by NXP Semiconductors

MPF7100BVBA4ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BVMA3ES by NXP Semiconductors

MPF7100BVMA3ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

MPF7100BVMA4ESR2 by NXP Semiconductors

MPF7100BVMA4ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 7;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N48

7 mm

3

7

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.5 V

5 V

YES

NO LEAD

.5 mm

QUAD

+2.8V

40

7 mm

LM73100RPWR by Texas Instruments

LM73100RPWR

Texas Instruments

LM73100RPWR by Texas Instruments is a Power Management IC with 10 terminals, operating b/w -40 to 125°C. It supports supply voltages from 2.7V to 23V and has an adjustable threshold of +2.53V, making it ideal for automotive applications requiring precise power supply support circuits in compact spaces.

YES

POWER SUPPLY SUPPORT CIRCUIT

S-PQCC-N10

e4

2 mm

2

1

1

10

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC10,.08,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

23 V

2.7 V

12 V

YES

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

QUAD

+2.53V

30

2 mm

MWCT1001A3VLH by NXP Semiconductors

MWCT1001A3VLH

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQFP-G64

e3

10 mm

3

54

1

64

105 Cel

-40 Cel

PLASTIC/EPOXY

LQFP

QFP64,.47SQ,20

SQUARE

FLATPACK, LOW PROFILE

260

AEC-Q100

1.6 mm

3.6 V

2.7 V

3.3 V

YES

TIN

GULL WING

.5 mm

DUAL

+2.73V

40

10 mm

LM5127QRGZRQ1 by Texas Instruments

LM5127QRGZRQ1

Texas Instruments

LM5127QRGZRQ1 by Texas Instruments is a Power Management IC with 3 channels, 30A output current, and 2200 kHz switching frequency. It is designed for automotive applications, featuring AEC-Q100 screening level and operating temperature range of -40 to 150°C. The IC supports a wide supply voltage range from 0.8V to 42V and comes in a compact chip carrier package style.

YES

POWER SUPPLY SUPPORT CIRCUIT

42 V

.8 V

S-PQCC-N48

e4

7 mm

3

3

1

3

48

150 Cel

-40 Cel

30 A

PLASTIC/EPOXY

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

3.9 mA

42 V

.8 V

12 V

YES

2200 kHz

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

+1V

30

7 mm

BQ29739DSER by Texas Instruments

BQ29739DSER

Texas Instruments

BQ29739DSER by Texas Instruments is a Power Management IC with 6 terminals, operating b/w -40 to 85°C. It supports supply voltages from 1.5V to 8V and has a small outline package style for industrial applications. With surface mount capability and nickel palladium gold finish, it's ideal for power supply support circuits in compact designs.

OVERCHARGE DETECTION VOLTAGE=0.02V

NO

POWER SUPPLY SUPPORT CIRCUIT

S-PDSO-N6

e4

1.5 mm

1

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VSON

SOLCC8,.06,20

SQUARE

SMALL OUTLINE, VERY THIN PROFILE

260

.8 mm

.0055 mA

8 V

1.5 V

3 V

YES

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

DUAL

+0.020V

30

1.5 mm

TPS6521845RSLR by Texas Instruments

TPS6521845RSLR

Texas Instruments

TPS6521845RSLR by Texas Instruments is a Power Management IC with 48 terminals in a square package. It operates b/w -40 to 105°C, supporting a min supply voltage of 2.2V and max output current of 1.8A. Ideal for industrial applications requiring high switching frequency up to 2400 kHz and multiple outputs for power supply support circuits.

YES

POWER SUPPLY SUPPORT CIRCUIT

S-PQCC-N48

e4

6 mm

3

8

1

7

48

105 Cel

-40 Cel

1.8 A

PLASTIC/EPOXY

HVQCCN

LCC48,.24SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.2 V

YES

2400 kHz

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

30

6 mm

TPS6521845RSLT by Texas Instruments

TPS6521845RSLT

Texas Instruments

TPS6521845RSLT by Texas Instruments is a Power Management IC with 48 terminals in a square package. It operates b/w -40 to 105°C, supporting supply voltages from 2.2V to 5.5V. With a max output current of 1.8A and switching frequency of 2400kHz, it's ideal for industrial applications requiring power supply support circuits.

YES

POWER SUPPLY SUPPORT CIRCUIT

S-PQCC-N48

e4

6 mm

3

8

1

7

48

105 Cel

-40 Cel

1.8 A

PLASTIC/EPOXY

HVQCCN

LCC48,.24SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.2 V

YES

2400 kHz

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

30

6 mm

TPS6521835RSLT by Texas Instruments

TPS6521835RSLT

Texas Instruments

TPS6521835RSLT by Texas Instruments is a 48-terminal Power Management IC with 7 channels, capable of handling up to 1.8A output current. It operates in industrial temperature range (-40 to 105°C) and supports a max switching frequency of 2400 kHz. Ideal for power supply support circuits in various applications.

Also require 2.2V to 5.5V supply

YES

POWER SUPPLY SUPPORT CIRCUIT

S-PQCC-N48

e4

6 mm

3

7

1

7

48

105 Cel

-40 Cel

1.8 A

PLASTIC/EPOXY

HVQCCN

LCC48,.24SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.2 V

3.6 V

YES

2400 kHz

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+2.3V

30

6 mm

TPS6521835RSLR by Texas Instruments

TPS6521835RSLR

Texas Instruments

TPS6521835RSLR by Texas Instruments is a Power Management IC with 48 terminals, operating at -40 to 105°C. It supports a max output current of 1.8A and has a switching frequency of 2400 kHz. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Also require 2.2V to 5.5V supply

YES

POWER SUPPLY SUPPORT CIRCUIT

S-PQCC-N48

e4

6 mm

3

7

1

7

48

105 Cel

-40 Cel

1.8 A

PLASTIC/EPOXY

HVQCCN

LCC48,.24SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.2 V

3.6 V

YES

2400 kHz

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+2.3V

30

6 mm

MC33FS8420G0ESR2 by NXP Semiconductors

MC33FS8420G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8415G0ES by NXP Semiconductors

MC33FS8415G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510A2ESR2 by NXP Semiconductors

MC33FS8510A2ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510D3ESR2 by NXP Semiconductors

MC33FS8510D3ESR2

NXP Semiconductors

MC33FS8510D3ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating b/w -40 to 125 °C. It has a supply voltage range of 5.1V to 36V and a max current of 25mA. Ideal for automotive applications due to AEC-Q100 screening level and compact chip carrier package style.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510A0ESR2 by NXP Semiconductors

MC33FS8510A0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G6ES by NXP Semiconductors

MC33FS8410G6ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Seated Height: 1 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G0ESR2 by NXP Semiconductors

MC33FS8410G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8400G5ESR2 by NXP Semiconductors

MC33FS8400G5ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8400G0ESR2 by NXP Semiconductors

MC33FS8400G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 8 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8530A4ESR2 by NXP Semiconductors

MC33FS8530A4ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Seated Height: 1 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8530A1ESR2 by NXP Semiconductors

MC33FS8530A1ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8520A0ES by NXP Semiconductors

MC33FS8520A0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Current (Isup): 25 mA;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8405G0ES by NXP Semiconductors

MC33FS8405G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Length: 8 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G0ES by NXP Semiconductors

MC33FS8410G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 6;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G3ESR2 by NXP Semiconductors

MC33FS8410G3ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Pitch: .5 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G6ESR2 by NXP Semiconductors

MC33FS8410G6ESR2

NXP Semiconductors

MC33FS8410G6ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating b/w -40 to 125°C. It has a supply voltage range of 5.1-36V and max current of 25mA. Ideal for power supply management circuits in automotive applications due to AEC-Q100 screening level.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G0ES by NXP Semiconductors

MC33FS8430G0ES

NXP Semiconductors

MC33FS8430G0ES by NXP Semiconductors is a Power Management IC with 6 channels, operating voltage range of 5.1V to 36V, and AEC-Q100 screening level. It features a package style of CHIP CARRIER and is suitable for automotive power supply management applications.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G0ESR2 by NXP Semiconductors

MC33FS8430G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Position: QUAD;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G2ES by NXP Semiconductors

MC33FS8430G2ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Finish: TIN;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G4ES by NXP Semiconductors

MC33FS8430G4ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Peak Reflow Temperature (C): 260;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8435G0ES by NXP Semiconductors

MC33FS8435G0ES

NXP Semiconductors

MC33FS8435G0ES by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125 °C. It has a supply voltage range of 5.1V to 36V and a max current of 25mA. This chip carrier package is suitable for power supply management circuits in automotive applications due to its AEC-Q100 screening level.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8435G0ESR2 by NXP Semiconductors

MC33FS8435G0ESR2

NXP Semiconductors

MC33FS8435G0ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125°C. It features a supply voltage range of 5.1-36V, suitable for automotive applications due to AEC-Q100 screening and compact chip carrier package style.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm