Loading...

BQ29739DSER

Texas Instruments

BQ29739DSER by Texas Instruments

BQ29739DSER by Texas Instruments is a Power Management IC with 6 terminals, operating b/w -40 to 85°C. It supports supply voltages from 1.5V to 8V and has a small outline package style for industrial applications. With surface mount capability and nickel palladium gold finish, it's ideal for power supply support circuits in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,105

-

-

-

-

Digiode

USA . 1,021 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,021

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 922 parts In-Stock

1+ parts

$1.292

100+ parts

-

1k+ parts

$2.047

10k+ parts

-

922

$1.292

-

$2.047

-

DigiPath Technology Company

USA . 901 parts In-Stock

1+ parts

$1.423

100+ parts

$1.309

1k+ parts

-

10k+ parts

-

901

$1.423

$1.309

-

-

ChromeModa Solutions

Germany . 4,460 parts In-Stock

1+ parts

$1.452

100+ parts

$1.191

1k+ parts

-

10k+ parts

-

4,460

$1.452

$1.191

-

-

IDEA Electronic Components Group

UK . 93 parts In-Stock

1+ parts

$1.452

100+ parts

-

1k+ parts

$1.307

10k+ parts

-

93

$1.452

-

$1.307

-

One Stop Electronics

USA . 1,089 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,089

$3.500

-

-

-

Ampacity Inc.

Singapore . 609 parts In-Stock

1+ parts

$5.500

100+ parts

-

1k+ parts

-

10k+ parts

-

609

$5.500

-

-

-

Semicontronic

India . 1,527 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

10k+ parts

-

1,527

$6.500

$6.338

$6.305

-

AZTECH Wire

Italy . 476 parts In-Stock

1+ parts

$10.194

100+ parts

-

1k+ parts

-

10k+ parts

-

476

$10.194

-

-

-

Component Stockers USA

USA . 653 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

653

$99.990

-

-

-

Corphita

USA . 4,591 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,591

-

-

-

-

Microchip USA

USA . 2,292 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,292

-

-

-

-

Northwest PG Solutions

USA . 1,074 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,074

-

-

-

-

Native Components

USA . 645 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

645

-

-

-

-

Corohmni

South Africa . 488 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

488

-

-

-

-

Overview

Elevate your power management solutions with the BQ29739DSER by Texas Instruments. Crafted with precision and expertise, this Power Management IC boasts top-notch quality and reliability. Perfect for a range of applications in various industries, this small outline, very thin profile package offers unparalleled performance. With its industrial-grade temperature grade and advanced technology, this product ensures optimal functionality and efficiency. Experience the value and benefits that only Texas Instruments can deliver with the BQ29739DSER.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the power management IC.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage (Vsup): 3 V

A stable supply voltage of 3V ensures consistent power delivery to the connected devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can perform reliably in a variety of environments.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures makes this IC suitable for use in harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish on the terminals enhances conductivity and corrosion resistance.

Width (mm): 1.5 mm

The compact width of 1.5mm saves space on the circuit board and allows for more efficient design layouts.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC specifically designed for power supply support ensures optimal performance and efficiency.

Temperature Grade: INDUSTRIAL

The industrial temperature grade enables this IC to function reliably in industrial settings with varying temperature conditions.

Maximum Supply Current (Isup): 0.0055 mA

The low maximum supply current helps in reducing power consumption and heat generation, making this IC energy-efficient.

Technical Specifications

Power Management ICs BQ29739DSER attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

OVERCHARGE DETECTION VOLTAGE=0.02V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

1.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.06,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

.0055 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+0.020V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

BQ29739DSER Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20