Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MTFDCAE001SAF-1D1IT
Micron Technology
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words Code: 1G; Minimum Operating Temperature: -40 Cel;
R-XXMA-X
36.9 mm
8589934592 bit
FLASH MODULE
8
1
1073741824 words
1G
ASYNCHRONOUS
85 Cel
-40 Cel
1GX8
UNSPECIFIED
XMA
RECTANGULAR
MICROELECTRONIC ASSEMBLY
SERIAL
5
9.7 mm
.06 Amp
120 mA
5.25 V
4.75 V
NO
CMOS
INDUSTRIAL
SLC NAND TYPE
26.6 mm
MTFDCAE001SAF-1D1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Technology: CMOS; Minimum Supply Voltage (Vsup): 4.75 V;
70 Cel
0 Cel
COMMERCIAL
MTFDCAE002SAF-1B1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; Memory Density: 17179869184 bit;
17179869184 bit
2147483648 words
2G
2GX8
MTFDCAE004SAF-1B1
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Code: XMA; Package Shape: RECTANGULAR; Programming Voltage (V): 5; No. of Functions: 1;
34359738368 bit
4294967296 words
4G
4GX8
MTFDDAV1T0TDL-1AW12ABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Memory Width: 8; Memory Density: 8796093022208 bit;
8796093022208 bit
1099511627776 words
1T
1TX8
NO LEAD
TLC NAND TYPE
MTFDDAV256TDL-1AW12ABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL; JESD-30 Code: R-XXMA-X; Package Body Material: UNSPECIFIED;
2199023255552 bit
274877906944 words
256G
256GX8
MTFDDAV512TDL-1AW12ABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-X; Surface Mount: NO; No. of Words Code: 512G;
4398046511104 bit
549755813888 words
512G
512GX8
MTFDHBA480TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words: 515396075520 words; No. of Words Code: 480G; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
R-XXMA-N
4123168604160 bit
515396075520 words
480G
480GX8
YES
MTFDHBA480TDF-1AW12ABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Surface Mount: YES; Package Body Material: UNSPECIFIED;
MTFDHBE3T2TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES; Organization: 3.2TX8; Technology: CMOS;
28147497671065 bit
3518437208883 words
3.2T
3.2TX8
MTFDHBE3T8TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES; Technology: CMOS; No. of Words Code: 3.84T;
33776997205278 bit
4222124650659 words
3.84T
3.84TX8
MTFDHBE7T6TDF-1AW4ZABYY
Micron Technology's MTFDHBE7T6TDF-1AW4ZABYY is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 7.68TX8 organization, TLC NAND TYPE, and 67553994410557 bit memory density. It operates in ASYNCHRONOUS mode at temperatures from 0 to 70 °C, suitable for FLASH MODULE applications.
67553994410557 bit
8444249301319 words
7.68T
7.68TX8
MTFDHBE800TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel; Memory Width: 8; Type: TLC NAND TYPE;
6871947673600 bit
858993459200 words
800G
800GX8
MTFDHBG1T9TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; Organization: 1.92TX8; Surface Mount: YES;
16888498602639 bit
2111062325329 words
1.92T
1.92TX8
MTFDHBE3T2TDG-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Memory Density: 28147497671065 bit; Technology: CMOS; Package Body Material: UNSPECIFIED;
MTFDHBE6T4TDG-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS; Terminal Position: UNSPECIFIED; Maximum Operating Temperature: 70 Cel;
56294995342131 bit
7036874417766 words
6.4T
6.4TX8
MTFDHBG1T9TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; No. of Functions: 1; Terminal Form: NO LEAD; No. of Words: 2111062325329 words;
MTFDHBG3T8TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words: 4222124650659 words; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Terminal Position: UNSPECIFIED;
MTFDHBA400TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Terminal Position: UNSPECIFIED;
3435973836800 bit
429496729600 words
400G
400GX8
MTFDHBA480TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Type: TLC NAND TYPE; No. of Words Code: 480G;
MTFDHBA960TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N; Package Body Material: UNSPECIFIED; Memory Density: 8246337208320 bit;
8246337208320 bit
1030792151040 words
960G
960GX8
MTFDHBE1T9TDF-1AW12ABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N; Memory Density: 16888498602639 bit; Technology: CMOS;
MTFDHBE1T9TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Memory Density: 16888498602639 bit; Surface Mount: YES; No. of Words Code: 1.92T;
MTFDHBE6T4TDG-1AW12ABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; JESD-30 Code: R-XXMA-N; Memory Density: 56294995342131 bit;
MTFDHBE7T6TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel; Memory Width: 8; No. of Words: 8444249301319 words;
MTFDHBA400TDG-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N; Surface Mount: YES; Minimum Operating Temperature: 0 Cel;
MTFDHBA800TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES; Operating Mode: ASYNCHRONOUS; Package Body Material: UNSPECIFIED;
MTFDHBE3T8TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Organization: 3.84TX8; Surface Mount: YES;
MTFDHBE6T4TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel; Technology: CMOS; Memory Density: 56294995342131 bit;
MTFDHBE800TDG-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Terminal Form: NO LEAD; Type: TLC NAND TYPE;
MTFDHBE960TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Surface Mount: YES; Memory Density: 8246337208320 bit;
MTFDHBG3T8TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; No. of Words: 4222124650659 words; Operating Mode: ASYNCHRONOUS;
MTFDHBE1T6TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel; Package Body Material: UNSPECIFIED; Terminal Position: UNSPECIFIED;
14073748835532 bit
1759218604441 words
1.6T
1.6TX8
MTFDHBE1T6TDG-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS; Package Body Material: UNSPECIFIED; Terminal Form: NO LEAD;
MTFDHBE1T9TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Memory Width: 8; Package Body Material: UNSPECIFIED; Technology: CMOS;
MTFDHBA960TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Position: UNSPECIFIED; Terminal Form: NO LEAD;
SFU3064GC2AE2TO-I-LF-1A1-STD
Swissbit Ag
SFU3064GC2AE2TO-I-LF-1A1-STD by Swissbit Ag is a 64GX8 MLC NAND USB flash drive with 549755813888-bit memory density. Operating at 5V, it has a programming voltage of 5V and supports asynchronous mode. Ideal for applications requiring high memory capacity and reliable data storage in temperatures ranging from -40 to 85°C.
USB 3.1 FLASH DRIVE
10
24 mm
549755813888 bit
USB FLASH DRIVE
68719476736 words
64G
64GX8
4.5 mm
160 mA
5.5 V
4.5 V
MLC NAND TYPE
12.1 mm
SFU3064GC2AE2TO-C-LF-1A1-STD
SFU3064GC2AE2TO-C-LF-1A1-STD by Swissbit Ag is a 64GX8 MLC NAND Flash Memory with 68719476736 words capacity. Operating at 5V, it has a CMOS technology and USB Flash Drive IC type. Ideal for applications requiring high memory density, such as data storage in devices with temperature range of 0 to 70°C.
MTFDKCC960TFR-1BC1ZABYY
Micron Technology's MTFDKCC960TFR-1BC1ZABYY is a RECTANGULAR MICROELECTRONIC ASSEMBLY Flash Memory with 960GX8 organization, TLC NAND Type, and 8246337208320 bit memory density. It operates b/w 0 to 70 °C and contains 1030792151040 words. Ideal for high-density storage applications requiring reliable performance in various temperature conditions.
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