Loading...

TBGA Flash Memory 248

Flash Memory
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Ready or Busy Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Serial Bus Type Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Type Width Maximum Write Cycle Time (tWC) Write Protection
S25HS02GTDPBHV150 by Infineon Technologies

S25HS02GTDPBHV150

Infineon Technologies

S25HS02GTDPBHV150 by Infineon Technologies is a 256MX8 NOR type flash memory with a max clock frequency of 166 MHz. It operates in synchronous mode and has a min data retention time of 25 years. This flash memory is commonly used in applications such as consumer electronics, automotive systems, and industrial equipment.

166 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

3

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

1.8

1.2 mm

SPI

.00045 Amp

110 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL02GTDPBHV150 by Infineon Technologies

S25HL02GTDPBHV150

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 2.7 V; Type: NOR TYPE;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

3

1.2 mm

SPI

.000045 Amp

110 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL02GTDZBHB053 by Infineon Technologies

S25HL02GTDZBHB053

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Memory Density: 2147483648 bit; Write Protection: HARDWARE;

166 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

3

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

3

AEC-Q100

1.2 mm

SPI

.000655 Amp

110 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS02GTDZBHB053 by Infineon Technologies

S25HS02GTDZBHB053

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel; Moisture Sensitivity Level (MSL): 3;

166 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

3

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

1.8

AEC-Q100

1.2 mm

SPI

.00045 Amp

110 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

MT29F4G01ABAFD12-AUT:F by Micron Technology

MT29F4G01ABAFD12-AUT:F

Micron Technology

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL; Minimum Data Retention Time: 10;

CONFIGURABLE AS 4G X 1

2

133 MHz

10

100000 Write/Erase Cycles

R-PBGA-B24

8 mm

4294967296 bit

FLASH

8

1

24

536870912 words

512M

SYNCHRONOUS

125 Cel

-40 Cel

512MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

3.3

AEC-Q100

1.2 mm

SPI

.0001 Amp

35 mA

3.6 V

2.7 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

SLC NAND TYPE

6 mm

HARDWARE/SOFTWARE

MT29F4G01ABBFD12-AUT:F by Micron Technology

MT29F4G01ABBFD12-AUT:F

Micron Technology

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Endurance: 100000 Write/Erase Cycles; Operating Mode: SYNCHRONOUS;

CONFIGURABLE AS 4G X 1

2

83 MHz

10

100000 Write/Erase Cycles

R-PBGA-B24

8 mm

4294967296 bit

FLASH

8

1

24

536870912 words

512M

SYNCHRONOUS

125 Cel

-40 Cel

512MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

1.8

AEC-Q100

1.2 mm

SPI

.0001 Amp

35 mA

1.95 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

SLC NAND TYPE

6 mm

HARDWARE/SOFTWARE

S79FS01GSFABHB213 by Infineon Technologies

S79FS01GSFABHB213

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; Programming Voltage (V): 1.8;

133 MHz

20

100000 Write/Erase Cycles

R-PBGA-B24

e1

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

260

1.8

AEC-Q100; TS 16949

1.2 mm

SPI

.0006 Amp

200 mA

2 V

1.7 V

1.8

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

NOR TYPE

6 mm

HARDWARE

MT29F2G01ABAGD12-IT:G by Micron Technology

MT29F2G01ABAGD12-IT:G

Micron Technology

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Surface Mount: YES; Maximum Clock Frequency (fCLK): 133 MHz;

133 MHz

10

100000 Write/Erase Cycles

R-PBGA-B24

8 mm

2147483648 bit

FLASH

8

1

24

268435456 words

256M

SYNCHRONOUS

85 Cel

-40 Cel

256MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

3.3

1.2 mm

SPI

.00005 Amp

35 mA

3.6 V

2.7 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

SLC NAND TYPE

6 mm

HARDWARE/SOFTWARE