Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.
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MT48LC16M16A2P-6AL:G
Micron Technology
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: TSOP2; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
FOUR BANK PAGE BURST
5.4 ns
AUTO/SELF REFRESH
167 MHz
COMMON
1,2,4,8
R-PDSO-G54
22.22 mm
268435456 bit
SYNCHRONOUS DRAM
16
1
54
16777216 words
16M
SYNCHRONOUS
70 Cel
0 Cel
16MX16
3-STATE
PLASTIC/EPOXY
TSOP2
TSOP54,.46,32
RECTANGULAR
SMALL OUTLINE, THIN PROFILE
3.3
Not Qualified
8192
1.2 mm
YES
1,2,4,8,FP
.0025 Amp
DRAMs
150 mA
3.6 V
3 V
CMOS
COMMERCIAL
GULL WING
.8 mm
DUAL
10.16 mm
MT48LC32M8A2BB-6A:G
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
S-PBGA-B60
16 mm
8
60
33554432 words
32M
32MX8
TFBGA
BGA60,8X15,32
SQUARE
GRID ARRAY, THIN PROFILE, FINE PITCH
BALL
BOTTOM
8 mm
MT48LC32M8A2BB-7E:G
143 MHz
MT48LC32M8A2P-6A:G
MT48LC64M4A2BB-6A:G
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 60; Package Code: TFBGA; Package Shape: SQUARE; Memory Density: 268435456 bit;
4
67108864 words
64M
64MX4
MT48LC64M4A2P-6A:G
100 mA
MT41K256M8DA-125AAT:K
Micron Technology's MT41K256M8DA-125AAT:K is a DDR3L DRAM with 256MX8 organization, operating at 800 MHz. It features a low supply voltage of 1.35V and is designed for automotive applications due to its AEC-Q100 screening level. The memory IC offers a memory density of 2147483648 bits and supports multi-bank page burst access mode.
MULTI BANK PAGE BURST
800 MHz
R-PBGA-B78
e1
10.5 mm
2147483648 bit
DDR3L DRAM
78
268435456 words
256M
125 Cel
-40 Cel
256MX8
BGA78,9X13,32
260
1.35
AEC-Q100
.012 Amp
195 mA
1.45 V
1.283 V
AUTOMOTIVE
TIN SILVER COPPER
30
MT47H128M8SH-25EAAT:M
Micron Technology's MT47H128M8SH-25EAAT:M is a DDR2 DRAM with 128MX8 organization, operating at 1.8V. It features synchronous mode, self-refresh capability, and multi-bank page burst access for high-speed performance. Ideal for applications requiring fast memory access in automotive electronics or industrial control systems.
.4 ns
R-PBGA-B60
10 mm
1073741824 bit
DDR2 DRAM
134217728 words
128M
128MX8
NOT SPECIFIED
1.9 V
1.7 V
1.8
MT47H128M8SH-25EAIT:M
Micron Technology's MT47H128M8SH-25EAIT:M is a DDR2 DRAM with 128MX8 organization, operating at 400 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access such as automotive electronics or industrial control systems.
400 MHz
4,8
95 Cel
BGA60,9X11,32
.01 Amp
210 mA
W9816G6JH-6I
Winbond Electronics
W9816G6JH-6I by Winbond Electronics is a 1MX16 Synchronous DRAM with 16-bit memory width. Operating at 3.3V, it features dual bank page burst access mode and self-refresh capability. Ideal for industrial applications requiring fast data processing in a compact package.
DUAL BANK PAGE BURST
5 ns
R-PDSO-G50
20.95 mm
16777216 bit
50
1048576 words
1M
85 Cel
1MX16
INDUSTRIAL
IS43TR16512A-15HBLI
Integrated Silicon Solution
IS43TR16512A-15HBLI by Integrated Silicon Solution is a 512MX16 DDR3 DRAM with 1.5V supply voltage, synchronous operation, and self-refresh capability. It features a low-profile grid array package suitable for applications requiring dual bank page burst access mode and 16-bit memory width. Ideal for high-performance computing devices needing reliable memory solutions.
R-PBGA-B96
14 mm
8589934592 bit
DDR3 DRAM
96
536870912 words
512M
512MX16
LFBGA
GRID ARRAY, LOW PROFILE, FINE PITCH
1.4 mm
1.575 V
1.425 V
1.5
MT42L16M32D1LG-25AAT:A
LPDDR2 DRAM; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Maximum Seated Height: .8 mm; Terminal Form: BALL;
5.5 ns
SELF REFRESH
S-PBGA-B168
12 mm
536870912 bit
LPDDR2 DRAM
32
168
16MX32
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.95 V
.5 mm
MT8HTF6464HDY-667D3
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.45 ns
333 MHz
R-XDMA-N200
e4
67.6 mm
4294967296 bit
DDR DRAM MODULE
64
200
64MX64
UNSPECIFIED
DIMM
DIMM200,24
MICROELECTRONIC ASSEMBLY
3.8 mm
.056 Amp
1480 mA
NO
GOLD
NO LEAD
.6 mm
30.5 mm
MT4HTF3264AY-53ED3
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.5 ns
267 MHz
R-PDMA-N240
240
32MX64
DIMM240,40
1360 mA
1 mm
MT8HTF6464HDY-53ED3
266 MHz
R-PDMA-N200
1380 mA
MT16HTF6464AY-40EB2
.6 ns
200 MHz
.08 Amp
1880 mA
MT4HTF3264HY-53ED3
.028 Amp
MT16HTF12864AY-53ED4
128MX64
.112 Amp
1856 mA
MT16VDDF12864HG-335D2
.7 ns
e0
2.5
3280 mA
2.7 V
2.3 V
TIN LEAD
MT18HTF12872AY-667D4
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-XDMA-N240
9663676416 bit
72
128MX72
3240 mA
OTHER
MT16LSDT6464AY-13ED2
SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 168; Package Shape: RECTANGULAR; Terminal Position: DUAL; No. of Words Code: 64M;
R-XDMA-N168
SYNCHRONOUS DRAM MODULE
MT36HTF25672PY-667D1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; JESD-609 Code: e4;
45 ns
19327352832 bit
256MX72
MT48H16M32L2B5-10IT
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Access Mode: FOUR BANK PAGE BURST;
R-PBGA-B90
13 mm
90
MT48H16M32L2B5-10
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Additional Features: AUTO/SELF REFRESH;
MT48H16M32L2B5-8IT
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Memory Density: 536870912 bit;
8.5 ns
MT48H16M32L2B5-8
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Self Refresh: YES;
MT48H16M32L2F5-10IT
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
TIN LEAD SILVER
MT48H16M32L2F5-10
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.9 V;
MT48H16M32L2F5-8IT
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
MT48H16M32L2F5-8
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Memory Width: 32;
MT48LC32M8A2P-75IT:DTR
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
e3
Matte Tin (Sn)
MT46V64M8BN-6IT:FTR
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
12.5 mm
DDR1 DRAM
64MX8
TBGA
GRID ARRAY, THIN PROFILE
Tin/Silver/Copper (Sn/Ag/Cu)
MT47H128M8HQ-3:ETR
DDR2 DRAM; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
11.5 mm
COMMERCIAL EXTENDED
MT48H16M16LFBF-75:GTR
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: VFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
6 ns
R-PBGA-B54
9 mm
MT48LC32M16A2P-75:CTR
Micron Technology's MT48LC32M16A2P-75:CTR is a 32MX16 DRAM with 33554432 words and 536870912 bit memory density. Operating at 3.3V, it offers synchronous operation, self-refresh capability, and a max access time of 5.4 ns. Ideal for commercial applications requiring fast and reliable memory performance.
32MX16
MT48LC4M32LFB5-8IT:GTR
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
7 ns
134217728 bit
4194304 words
4M
4MX32
MT47H128M8CF-187E:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.35 ns
533 MHz
250 mA
MT47H128M8CF-25:H
Micron Technology's MT47H128M8CF-25:H is a DDR2 DRAM with 128MX8 organization, operating at 400 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in devices with limited space and power constraints.
MT47H128M8CF-25E:H
Micron Technology's MT47H128M8CF-25E:H is a DDR2 DRAM with 128MX8 organization, operating at 400 MHz. It features a 1.8V supply voltage and offers 8192 refresh cycles. Ideal for applications requiring high-speed synchronous memory with a capacity of 1073741824 bits in a compact grid array package.
MT47H128M8CF-25EIT:H
DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MT47H128M8CF-3:H
Micron Technology's MT47H128M8CF-3:H is a DDR2 DRAM with 128MX8 organization, operating at 333 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Suitable for applications requiring high-speed memory access in devices like computers and networking equipment.
3
185 mA
MT47H128M8CF-3IT:H
Micron Technology's MT47H128M8CF-3IT:H is a DDR2 DRAM with 128MX8 organization, operating at 333 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast access times.
MT47H128M8CF-3L:H
MT47H256M4CF-25E:H
256MX4
MT47H256M4CF-3:H
MT47H256M4CF-3IT:H
MT47H64M16HR-187E:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PBGA-B84
84
64MX16
BGA84,9X15,32
.007 Amp
300 mA
MT47H64M16HR-25:H
260 mA
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