Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MT47H32M16HR-187E:G
Micron Technology
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
FOUR BANK PAGE BURST
.35 ns
AUTO/SELF REFRESH
533 MHz
COMMON
4,8
R-PBGA-B84
e1
12.5 mm
536870912 bit
DDR2 DRAM
16
1
84
33554432 words
32M
SYNCHRONOUS
85 Cel
0 Cel
32MX16
3-STATE
PLASTIC/EPOXY
TFBGA
BGA84,9X15,32
RECTANGULAR
GRID ARRAY, THIN PROFILE, FINE PITCH
1.8
Not Qualified
8192
1.2 mm
YES
.007 Amp
DRAMs
1.9 V
1.7 V
CMOS
OTHER
TIN SILVER COPPER
BALL
.8 mm
BOTTOM
8 mm
MT47H64M8CF-187E:G
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PBGA-B60
10 mm
8
60
67108864 words
64M
64MX8
BGA60,9X11,32
MT41J256M16HA-093G:E
DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MULTI BANK PAGE BURST
.18 ns
1066 MHz
R-PBGA-B96
14 mm
4294967296 bit
DDR3 DRAM
96
268435456 words
256M
256MX16
BGA96,9X16,32
1.5
.018 Amp
305 mA
1.575 V
1.425 V
9 mm
MT41J128M8JP-107:G
DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Ports: 1;
R-PBGA-B78
11.5 mm
1073741824 bit
78
134217728 words
128M
128MX8
MT41J64M16JT-107:G
DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Ports: 1;
64MX16
MT41J256M16HA-093:E
Micron Technology's MT41J256M16HA-093:E is a DDR3 DRAM with 256MX16 organization, operating at 1066 MHz. It features synchronous operation, self-refresh capability, and a max clock frequency of 1066 MHz. Ideal for applications requiring high-speed memory access in devices such as computers and servers.
260
Tin/Silver/Copper (Sn/Ag/Cu)
30
MT41J256M16HA-107:E
.195 ns
933 MHz
95 Cel
274 mA
MT41J256M16HA-125:E
Micron Technology's MT41J256M16HA-125:E is a DDR3 DRAM with 256MX16 organization, operating at 800 MHz. It features a thin profile grid array package and synchronous operation mode. Ideal for applications requiring high-speed memory access in devices like servers and networking equipment.
.225 ns
800 MHz
243 mA
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
MT41J512M8RH-093:E
DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
10.5 mm
536870912 words
512M
512MX8
BGA78,9X13,32
282 mA
MT41J512M8RH-107:E
251 mA
MT41K512M16TNA-125:E
Micron Technology's MT41K512M16TNA-125:E is a DDR3L DRAM with 512MX16 organization, operating at 800 MHz. It features a thin profile grid array package and operates synchronously with self-refresh capability. Ideal for applications requiring high-speed memory access in devices such as smartphones, tablets, and networking equipment.
DUAL BANK PAGE BURST
8589934592 bit
DDR3L DRAM
3
512MX16
1.35
.036 Amp
266 mA
1.283 V
MT41K512M4DA-107:K
DDR3L DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
2147483648 bit
4
512MX4
.012 Amp
164 mA
1.45 V
IS43TR16256AL-125KBL
Integrated Silicon Solution
IS43TR16256AL-125KBL by Integrated Silicon Solution is a DDR3L DRAM with 256MX16 organization, operating at 1.35V. It features synchronous operation, self-refresh capability, and multi-bank page burst access mode. Ideal for applications requiring high memory density and fast access times in a compact grid array package.
.1 ns
PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
13 mm
10
MT41K1G8TRF-125IT:E
Micron Technology's MT41K1G8TRF-125IT:E is a DDR3L DRAM with 1GX8 organization, operating at 800 MHz. It features a thin profile grid array package and operates at 1.35V, suitable for applications requiring high-speed synchronous memory with low power consumption.
SELF REFRESH
e0
1073741824 words
1G
1GX8
TIN LEAD SILVER
9.5 mm
MT41K1G4RH-107:E
1GX4
.016 Amp
MT41K256M16HA-107:E
DDR3L DRAM; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MT41K256M16HA-107IT:E
Micron Technology's MT41K256M16HA-107IT:E is a DDR3L DRAM with 256MX16 organization, operating at 933 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in thin-profile devices.
MT41K256M16RE-15EIT:D
667 MHz
.02 Amp
285 mA
MT41K512M8RH-107:E
MT41K512M8RH-107IT:E
MT41K512M8RH-125IT:E
220 mA
MT42L128M32D1LF-25WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 168; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
SINGLE BANK PAGE BURST
5.5 ns
SELF CONTAINED REFRESH; ALSO REQUIRES 1.8 V SUPPLY
400 MHz
4,8,16
S-PBGA-B168
12 mm
LPDDR2 DRAM
32
168
-30 Cel
128MX32
VFBGA
BGA168,23X23,20
SQUARE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.2,1.8
.75 mm
.0001 Amp
194 mA
1.3 V
1.14 V
1.2
.5 mm
MT47H256M8THN-3:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 63; Package Code: FBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
333 MHz
R-PBGA-B63
63
256MX8
FBGA
BGA63,9X11,32
GRID ARRAY, FINE PITCH
.014 Amp
192 mA
MT47H512M4THN-3:H
MTA9ASF51272AZ-2G1A1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 284; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Words: 536870912 words;
AUTO/SELF REFRESH; WD-MAX
R-XDMA-N284
133.35 mm
38654705664 bit
DDR4 DRAM MODULE
72
284
512MX72
UNSPECIFIED
DIMM
MICROELECTRONIC ASSEMBLY
31.38 mm
1.26 V
NO
NO LEAD
DUAL
2.61 mm
MT42L128M32D1GU-18WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 134; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
SELF REFRESH; IT ALSO REQUIRES 1.2V NOM
R-PBGA-B134
134
BGA134,10X17,25
.7 mm
1.95 V
.65 mm
MT42L128M32D1LH-25WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 216; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
S-PBGA-B216
216
BGA216,29X29,16
.4 mm
MT42L128M64D2LL-18WT:A
64
128MX64
.002 Amp
MT42L128M64D2LL-25WT:A
MT42L128M64D2MP-25WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 220; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
S-PBGA-B220
220
BGA220,27X27,20
MT42L256M32D2LG-25WT:A
256MX32
MT42L256M32D2LK-18WT:A
MT42L256M64D4EV-18WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
S-PBGA-B253
11 mm
17179869184 bit
253
256MX64
BGA253,17X17,20
MT42L256M64D4EV-25WT:A
MT42L256M64D4LD-25WT:A
1 mm
MT47H64M16HR-25E:HTR
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words Code: 64K;
.4 ns
1048576 bit
65536 words
64K
64KX16
MT46H256M32L4JV-5WT:B
DDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 168; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
5 ns
200 MHz
2,4,8,16
DDR1 DRAM
-25 Cel
.00001 Amp
150 mA
MTA18ADF1G72PZ-2G1A1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Terminal Form: NO LEAD;
R-XDMA-N288
77309411328 bit
DDR DRAM MODULE
288
1GX72
18.9 mm
3.9 mm
MTA18ASF1G72HZ-2G1A1
Micron Technology's MTA18ASF1G72HZ-2G1A1 DDR DRAM MODULE offers 1GX72 organization, 72-bit memory width, and operates at 1.2V. Ideal for servers and high-performance computing applications due to its synchronous operation and self-refresh capability.
R-XZMA-N260
69.6 mm
NOT SPECIFIED
30.13 mm
ZIG-ZAG
3.7 mm
MTA18ASF1G72PDZ-2G1A1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.2;
31.4 mm
MTA36ASF2G72LZ-2G1A1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Memory Width: 72;
154618822656 bit
2147483648 words
2G
2GX72
MT47H128M8SH-187E:M
MT47H256M4SH-25E:M
256MX4
MT47H64M16NF-187E:M
MT36HVS51272PZ-80EH1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-XDMA-N240
e4
240
DIMM240,40
4 mm
.252 Amp
6246 mA
GOLD
17.9 mm
MT47H128M4SH-25E:H
128MX4
.01 Amp
MT47H32M16NF-187E:H
225 mA
MT47H1G4WTR-25E:C
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 63; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
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