Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MT47R128M8CF-3:H
Micron Technology
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MULTI BANK PAGE BURST
450 ns
SELF CONTAINED REFRESH
333 MHz
COMMON
4,8
R-PBGA-B60
e1
10 mm
1073741824 bit
DDR2 DRAM
8
1
60
134217728 words
128M
SYNCHRONOUS
85 Cel
0 Cel
128MX8
3-STATE
PLASTIC/EPOXY
TFBGA
BGA60,9X11,32
RECTANGULAR
GRID ARRAY
1.55
Not Qualified
8192
1.2 mm
YES
DRAMs
1.9 V
1.5 V
CMOS
OTHER
TIN SILVER COPPER
BALL
.8 mm
BOTTOM
8 mm
MT47R256M4CF-3:H
4
268435456 words
256M
256MX4
MT47R64M16HR-3:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PBGA-B84
12.5 mm
16
84
67108864 words
64M
64MX16
BGA84,9X15,32
.007 Amp
MT42L128M64D4KJ-25IT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Minimum Operating Temperature: -25 Cel;
5.5 ns
AUTO/SELF REFRESH
S-PBGA-B216
12 mm
2147483648 bit
LPDDR2 DRAM
32
216
-25 Cel
64MX32
VFBGA
SQUARE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
260
1 mm
1.95 V
1.7 V
1.8
Tin/Silver/Copper (Sn/Ag/Cu)
.4 mm
30
MT41J512M4HX-15E:D
DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.255 ns
667 MHz
R-PBGA-B78
11.5 mm
DDR3 DRAM
78
536870912 words
512M
512MX4
BGA78,9X13,32
GRID ARRAY, THIN PROFILE, FINE PITCH
NOT SPECIFIED
1.5
.012 Amp
385 mA
1.575 V
1.425 V
9 mm
MT42L128M64D4LC-3IT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 240; Package Code: VFBGA; Package Shape: SQUARE; Technology: CMOS;
DUAL BANK PAGE BURST
S-PBGA-B240
14 mm
8589934592 bit
64
240
128MX64
.5 mm
MT42L64M64D2MC-3IT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 240; Package Code: VFBGA; Package Shape: SQUARE; Self Refresh: YES;
SINGLE BANK PAGE BURST
4294967296 bit
64MX64
MT41K512M4DA-125:K
DDR3L DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.225 ns
800 MHz
10.5 mm
DDR3L DRAM
95 Cel
1.35
156 mA
1.45 V
1.283 V
MT41K512M4DA-125:M
220 mA
MT41K1G4RH-125:E
AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY
1073741824 words
1G
1GX4
.016 Amp
MT42L64M32D1KL-3IT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; No. of Words: 67108864 words;
AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
S-PBGA-B168
168
1.3 V
1.14 V
1.2
MT49H64M9CBM-25E:B
DDR DRAM; Temperature Grade: OTHER; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Pitch: 1 mm;
15 ns
AUTO REFRESH
400 MHz
SEPARATE
2,4,8
R-PBGA-B144
18.5 mm
603979776 bit
DDR DRAM
9
144
64MX9
TBGA
BGA144,12X18,40/32
GRID ARRAY, THIN PROFILE
1.5/1.8,1.8,2.5
.005 Amp
655 mA
11 mm
MT41J128M16JT-107:K
Micron Technology's MT41J128M16JT-107:K is a DDR3 DRAM with 128MX16 organization, operating at 933 MHz. It features a 1.5V supply voltage and offers 134217728 words of memory. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
.195 ns
933 MHz
R-PBGA-B96
96
128MX16
BGA96,9X16,32
226 mA
MT41J256M8DA-093:K
.18 ns
3
256MX8
171 mA
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
MT41J256M8DA-107:K
1066 MHz
190 mA
MT41J512M4HX-125:D
435 mA
MT41J512M4HX-187E:D
.3 ns
533 MHz
335 mA
MT41K256M16HA-125M:E
Micron Technology's MT41K256M16HA-125M:E is a DDR3L DRAM with 256MX16 organization, operating at 800 MHz. It features a thin profile grid array package and consumes up to 239 mA at 1.35V. Ideal for applications requiring high-speed synchronous memory with low power consumption.
256MX16
239 mA
MT41K512M8RH-125M:E
512MX8
213 mA
MT46H128M16LFB7-5WT:B
DDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
FOUR BANK PAGE BURST
5 ns
200 MHz
2,4,8,16
S-PBGA-B60
DDR1 DRAM
-20 Cel
BGA60,9X10,32
.00001 Amp
130 mA
MT46H128M16LFB7-6WT:B
166 MHz
115 mA
MT46H128M32L2KQ-5WT:B
DDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 168; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
128MX32
BGA168,23X23,20
.75 mm
150 mA
MT46H128M32L2KQ-6WT:B
Micron Technology's MT46H128M32L2KQ-6WT:B is a DDR1 DRAM with 128MX32 organization, operating at 166 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in devices like smartphones and tablets.
140 mA
MT46H128M32L2MC-6WT:B
Micron Technology's MT46H128M32L2MC-6WT:B is a 128MX32 DDR1 DRAM with 240 terminals and operates at 166 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring fast access times and high memory density.
BGA240,27X27,20
MT46H64M32LFCX-5WT:B
DDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 90; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PBGA-B90
13 mm
90
BGA90,9X15,32
MT46H64M32LFCX-6WT:B
MT46H64M32LFMA-5WT:B
Micron Technology's MT46H64M32LFMA-5WT:B is a DDR1 DRAM with 64MX32 organization, operating at 200 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring fast access times and high memory density.
.7 mm
MT4HTF3264HZ-800G1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.4 ns
R-PDMA-N200
e3
67.6 mm
536870912 bit
DDR DRAM MODULE
200
33554432 words
32M
32MX16
DIMM
DIMM200,24
MICROELECTRONIC ASSEMBLY
30.15 mm
.028 Amp
1480 mA
3.6 V
NO
MATTE TIN
NO LEAD
.6 mm
DUAL
2.45 mm
MT47H512M8WTR-3:C
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 63; Package Code: FBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PBGA-B63
63
FBGA
BGA63,9X11,32
GRID ARRAY, FINE PITCH
MT41K1G8THE-15E:D
DDR3L DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
SELF REFRESH
1GX8
MT41K1G8TRF-125:E
MT41K1G8TRF-125:E by Micron Technology is a DDR3L DRAM with 1GX8 organization, operating at 800 MHz. It features a thin profile grid array package and consumes up to 243 mA of current. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
e0
.036 Amp
243 mA
TIN LEAD SILVER
9.5 mm
MT41K2G4TRF-125:E
2147483648 words
2G
2GX4
MT41K512M8RH-125:E
Micron Technology's MT41K512M8RH-125:E is a DDR3L DRAM with 512MX8 organization, operating at 800 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in devices like smartphones and tablets.
MT41K256M16HA-125:E
Micron Technology's MT41K256M16HA-125:E is a DDR3L DRAM with 256MX16 organization, operating at 800 MHz. It features synchronous operation, self-refresh capability, and a low supply voltage of 1.35V. Ideal for applications requiring high-speed memory access in compact electronic devices.
MT47R128M8CF-25:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Ports: 1;
MT47R256M4CF-25E:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
MT47R64M16HR-25:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Width: 16;
MT47R64M16HR-25E:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
MT42L128M32D1GU-25WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 134; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
SELF CONTAINED REFRESH; ALSO OPERATES AT MINIMUM 1.7 V
4,8,16
R-PBGA-B134
134
-30 Cel
BGA134,10X17,25
1.2,1.8
.0001 Amp
194 mA
.65 mm
UPD48288118AFF-E24-DW1-A
Renesas Electronics
DDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, THIN PROFILE;
AUTO REFRESH; IT ALSO REQUIRES AT 2.5V
e6
301989888 bit
18
16777216 words
16M
16MX18
1.8,2.5
1.17 mm
TIN BISMUTH
UPD48288118AFF-E24-DW1
DDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Words: 16777216 words;
MT41K256M16HA-125IT:E
Micron Technology's MT41K256M16HA-125IT:E is a DDR3L DRAM with 256MX16 organization, operating at 800 MHz. It features a low supply voltage of 1.35V and offers 4294967296 bits memory density. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
MT41K1G4THD-15E:D
DDR3L DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Pitch: .8 mm;
MT41K1G4THD-187E:D
DDR3L DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
MT41K1G4THV-125:M
DDR3L DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
MT41K1G4THV-15E:M
DDR3L DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words Code: 1G;
MT41K512M8THD-15E:D
DDR3L DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Organization: 512MX8;
MT47H128M4CF-187E:G
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
.35 ns
128MX4
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