Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Add filters
All
Selected
MT53D512M32D2NP-053WT:D
Micron Technology
LPDDR4 DRAM; No. of Terminals: 200; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Access Mode: SINGLE BANK PAGE BURST; No. of Words Code: 512M;
SINGLE BANK PAGE BURST
SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY
1869.1 MHz
COMMON
16,32
14.5 mm
17179869184 bit
LPDDR4 DRAM
32
1
200
536870912 words
512M
SYNCHRONOUS
85 Cel
-25 Cel
512MX32
PLASTIC/EPOXY
RECTANGULAR
.8 mm
YES
1.95 V
1.7 V
1.8
CMOS
BALL
BOTTOM
10 mm
MT53D512M32D2NP-062WT:D
LPDDR4 DRAM; No. of Terminals: 200; Package Shape: RECTANGULAR; Maximum Seated Height: .8 mm; Memory Width: 32; Memory Density: 17179869184 bit;
1600 MHz
MT53D512M32D2NP-046WT:D
LPDDR4 DRAM; No. of Terminals: 200; Package Shape: RECTANGULAR; Self Refresh: YES; Package Body Material: PLASTIC/EPOXY; No. of Words: 536870912 words;
2136.7 MHz
MT53D1024M32D4DT-046AIT:D
Micron Technology's MT53D1024M32D4DT-046AIT:D is a LPDDR4 DRAM with 1GX32 organization, operating at 2136.7 MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high memory density and fast data processing in automotive electronics or industrial devices.
MULTI BANK PAGE BURST
SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX
R-PBGA-B200
34359738368 bit
1073741824 words
1G
95 Cel
-40 Cel
1GX32
VFBGA
BGA200,12X22,32/25
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
AEC-Q100
.95 mm
1.17 V
1.06 V
1.1
MT53D512M32D2DS-046AUT:D
Micron Technology's MT53D512M32D2DS-046AUT:D is a LPDDR4 DRAM with 512MX32 organization, operating at up to 2136.7 MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high memory density and fast data processing in automotive electronics or industrial systems.
125 Cel
MT53D512M32D2DS-046AIT:D
Micron Technology's MT53D512M32D2DS-046AIT:D is a LPDDR4 DRAM with 512MX32 organization, operating at 2136.7 MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high memory density and fast data processing in automotive electronics or industrial devices.
MT53D1024M32D4DT-046AUT:D
Micron Technology's MT53D1024M32D4DT-046AUT:D is a LPDDR4 DRAM with 1GX32 organization, operating at up to 2136.7 MHz clock frequency. It features common I/O type, self-refresh mode, and AEC-Q100 screening level. Ideal for applications requiring high-speed synchronous memory in automotive electronics.
MT53D512M32D2DS-046AAT:D
Micron Technology's MT53D512M32D2DS-046AAT:D is a LPDDR4 DRAM with 512MX32 organization, operating at 2136.7 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory with a wide temperature range from -40 to 105°C.
105 Cel
MT53E512M16D1FW-046AIT:D
Micron Technology's MT53E512M16D1FW-046AIT:D is a LPDDR4 DRAM with 512MX16 organization, operating at up to 2136.7 MHz clock frequency. It features common I/O type, self-refresh mode, and synchronous operation. Ideal for applications requiring high-speed and low-power memory solutions in automotive electronics or mobile devices.
8589934592 bit
16
512MX16
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
1.1 mm
MT53E512M16D1FW-046AAT:D
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Width: 16; Sequential Burst Length: 16,32;
MT53E512M32D2FW-046AUT:D
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL; No. of Ports: 1;
MT53E512M32D2FW-046AIT:D
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS; Sequential Burst Length: 16,32;
MT53E512M64D2HJ-046WT:B
LPDDR4 DRAM; No. of Terminals: 556; Package Code: TFBGA; Package Shape: SQUARE; Terminal Form: BALL; Technology: CMOS;
SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
S-PBGA-B556
12.4 mm
64
556
512MX64
BGA556,29X29,16
SQUARE
.4 mm
MT53E128M16D1DS-046WT:A
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Words Code: 128M; Terminal Form: BALL;
SELF REFRESH, IT ALSO REQUIRES 1.8V NOMINAL SUPPLY, TERM PITCH-MAX
2133 MHz
2147483648 bit
134217728 words
128M
128MX16
MT53E128M32D2FW-046IT:A
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Width: 10 mm; Memory Width: 32;
4294967296 bit
128MX32
MT53E128M32D2FW-046WT:A
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.17 V; Minimum Operating Temperature: -25 Cel;
MT53B512M32D2NP-062AAT:C
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Refresh Cycles: 16384; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
DUAL BANK PAGE BURST
16384
.0033 Amp
410 mA
MT53B512M32D2NP-062AIT:C
.0025 Amp
400 mA
MT53B256M32D1DS-062AIT:C
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Refresh Cycles: 16384; Package Shape: RECTANGULAR; Memory Density: 8589934592 bit;
268435456 words
256M
256MX32
MT53B256M32D1NP-062AAT:C
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Refresh Cycles: 16384; Package Shape: RECTANGULAR; Technology: CMOS;
MT53B256M32D1NP-062AIT:C
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Refresh Cycles: 16384; Package Shape: RECTANGULAR; No. of Words: 268435456 words;
MT53E1G32D2FW-046AUT:B
Micron Technology's MT53E1G32D2FW-046AUT:B is a LPDDR4 DRAM with 1GX32 organization, operating at 2133 MHz. It features a thin profile grid array package, operates at temperatures from -40 to 125 °C, and is suitable for applications requiring high-speed synchronous memory.
BGA200,12X20,32/25
MT53E256M32D2FW-046AAT:B
Micron Technology's MT53E256M32D2FW-046AAT:B is a LPDDR4 DRAM with 256MX32 organization, operating at 2133 MHz. It features a common I/O type, self-refresh mode, and synchronous operation. Ideal for applications requiring high-speed memory performance in automotive electronics or industrial devices.
3-STATE
MT53E1536M32D4DT-046AIT:A
Micron Technology's MT53E1536M32D4DT-046AIT:A is a LPDDR4 DRAM with 1536MX32 organization, operating at up to 2136.7 MHz clock frequency. It features common I/O type, self-refresh mode, and operates in synchronous mode. Ideal for applications requiring high memory density and fast data processing in automotive electronics or industrial devices.
51539607552 bit
1610612736 words
1536M
1536MX32
MT53E256M32D2DS-046AUT:B
Micron Technology's MT53E256M32D2DS-046AUT:B is a LPDDR4 DRAM with 256MX32 organization, operating at 2133 MHz. It features a very thin profile package style with 200 terminals and supports synchronous operation. Ideal for applications requiring high-speed memory access in automotive electronics due to AEC-Q100 screening level.
MT53E256M32D2FW-046AIT:B
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Ports: 1; Minimum Supply Voltage (Vsup): 1.06 V;
MT53E256M16D1FW-046AAT:B
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA200,12X22,32/25; Terminal Position: BOTTOM;
256MX16
MT53E256M32D2DS-046AIT:B
Micron Technology's MT53E256M32D2DS-046AIT:B is a 256MX32 LPDDR4 DRAM with a max clock frequency of 2133 MHz. It operates in synchronous mode, has a self-refresh feature, and is commonly used in automotive applications due to its AEC-Q100 screening level.
MT53E256M16D1DS-046AIT:B
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL; Terminal Pitch: .8 mm;
MT53E768M32D4DT-053WT:E
Micron Technology's MT53E768M32D4DT-053WT:E is a LPDDR4 DRAM with 768MX32 organization, operating at 1866 MHz. It features a very thin profile package style and supports multi-bank page burst access mode. Ideal for applications requiring high-speed and low-power memory solutions.
1866 MHz
25769803776 bit
805306368 words
768M
768MX32
MT53E768M64D4HJ-046AAT:A
LPDDR4 DRAM; No. of Terminals: 556; Package Code: TFBGA; Package Shape: SQUARE; Maximum Standby Current: .0032 Amp; Memory Density: 51539607552 bit;
3.5 ns
768MX64
.0032 Amp
320 mA
MT53E768M64D4HJ-046AIT:A
LPDDR4 DRAM; No. of Terminals: 556; Package Code: TFBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel; Package Body Material: PLASTIC/EPOXY;
MT53E512M64D4HJ-046AAT:D
LPDDR4 DRAM; No. of Terminals: 556; Package Code: TFBGA; Package Shape: SQUARE; Sequential Burst Length: 16,32; Output Characteristics: 3-STATE;
.0036 Amp
390 mA
MT53E512M64D4HJ-046AIT:D
LPDDR4 DRAM; No. of Terminals: 556; Package Code: TFBGA; Package Shape: SQUARE; Maximum Clock Frequency (fCLK): 2133 MHz; Output Characteristics: 3-STATE;
MT53E1536M32D4DE-046AIT:B
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Interleaved Burst Length: 16,32; No. of Ports: 1;
BGA200,12X22,32
1.14 mm
.00075 Amp
260 mA
MT53E1536M32D4DE-046AAT:B
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00075 Amp; Memory Density: 51539607552 bit;
MT53E512M64D4NK-046WT:D
LPDDR4 DRAM; No. of Terminals: 366; Package Code: VFBGA; Package Shape: SQUARE; Maximum Supply Current: 360 mA; Additional Features: SELF REFRESH; IT ALSO REQUIRES 1.8V NOM;
S-PBGA-B366
15 mm
366
BGA366,29X29,20
.7 mm
360 mA
.5 mm
MT53E512M64D4NK-053WT:D
Micron Technology's MT53E512M64D4NK-053WT:D is a LPDDR4 DRAM with 512MX64 organization, operating at 1866 MHz. It features a very thin profile, fine pitch grid array package style and supports multi-bank page burst access mode. Ideal for applications requiring high-speed memory performance in compact devices.
300 mA
MT53E512M64D4HJ-046AUT:D
LPDDR4 DRAM; No. of Terminals: 556; Package Code: TFBGA; Package Shape: SQUARE; No. of Words: 536870912 words; Maximum Operating Temperature: 125 Cel;
MT53E2G32D4NQ-046WT:A
Micron Technology's MT53E2G32D4NQ-046WT:A is a LPDDR4 DRAM with 2GX32 organization, 32-bit memory width, and 68719476736-bit memory density. It operates synchronously at temperatures ranging from -25°C to 85°C. Ideal for applications requiring high-speed and low-power memory solutions in compact form factors.
R-PBGA-B
68719476736 bit
2147483648 words
2G
2GX32
NO
MT53E256M32D1KS-046AAT:L
Micron Technology's MT53E256M32D1KS-046AAT:L is a LPDDR4 DRAM with 256MX32 organization, operating at 2133 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for automotive applications due to AEC-Q100 and ISO 26262 screening levels.
32768
AEC-Q100, ISO 26262
.0009 Amp
42.3 mA
© 2023 All rights reserved
