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DIE Other Function Consumer ICs 12

Other Function Consumer ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Nominal Bandwidth Channel Separation General IC Type Demodulation Type Gain JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Noise Figure No. of Channels No. of Functions No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Nominal Output Power Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Maximum Reading Time Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
MF1PLUS6001DUD/03 by NXP Semiconductors

MF1PLUS6001DUD/03

NXP Semiconductors

MF1PLUS6001DUD/03 by NXP Semiconductors is a surface mount consumer IC designed for various applications. It operates b/w -25 °C and 70 °C, features an unencased chip package, and has no lead terminals. Ideal for compact electronic devices requiring reliable performance.

CONSUMER CIRCUIT

X-XUUC-N

1

70 Cel

-25 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

Not Qualified

YES

OTHER

NO LEAD

UPPER

MF1PLUS6031DUD/03 by NXP Semiconductors

MF1PLUS6031DUD/03

NXP Semiconductors

MF1PLUS6031DUD/03 by NXP Semiconductors is a surface mount consumer IC designed for various applications. It operates b/w -25 °C and 70 °C, features an unencased chip package, and has no lead terminals. Ideal for compact electronic devices requiring reliable performance.

CONSUMER CIRCUIT

X-XUUC-N

1

70 Cel

-25 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

Not Qualified

YES

OTHER

NO LEAD

UPPER

MF1PLUS8001DUD/03 by NXP Semiconductors

MF1PLUS8001DUD/03

NXP Semiconductors

MF1PLUS8001DUD/03 by NXP Semiconductors is a surface mount consumer IC designed for various applications. It operates b/w -25 °C and 70 °C, features an unencased chip package, and has no lead terminals. Ideal for compact electronic devices requiring reliable performance.

CONSUMER CIRCUIT

X-XUUC-N

1

70 Cel

-25 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

Not Qualified

YES

OTHER

NO LEAD

UPPER

MF1PLUS8031DUD/03 by NXP Semiconductors

MF1PLUS8031DUD/03

NXP Semiconductors

MF1PLUS8031DUD/03 by NXP Semiconductors is a surface mount consumer IC designed for various applications. It operates b/w -25 °C and 70 °C, featuring an unencased chip design with no lead terminals. Ideal for compact electronic devices, it ensures reliable performance in diverse environments.

CONSUMER CIRCUIT

X-XUUC-N

1

70 Cel

-25 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

Not Qualified

YES

OTHER

NO LEAD

UPPER

LA1654C-X1 by Onsemi

LA1654C-X1

Onsemi

LA1654C-X1 by Onsemi is a surface mount consumer IC with 16 terminals. It operates b/w -20 °C to 70°C, with a supply voltage range of 1.1V to 3.6V. This rectangular package chip is ideal for various consumer circuit applications.

CONSUMER CIRCUIT

R-XUUC-N16

1

16

70 Cel

-20 Cel

UNSPECIFIED

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

3

Not Qualified

Other Consumer ICs

0 mA

3.6 V

1.1 V

YES

OTHER

NO LEAD

UPPER

NT2L1011G0DUDZ by NXP Semiconductors

NT2L1011G0DUDZ

NXP Semiconductors

CONSUMER CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;

CONSUMER CIRCUIT

R-XUUC-N4

1

4

70 Cel

-25 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

NOT SPECIFIED

YES

NO LEAD

UPPER

NOT SPECIFIED

MF1S7031XDUD,005 by NXP Semiconductors

MF1S7031XDUD,005

NXP Semiconductors

CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;

CONSUMER CIRCUIT

R-XUUC-N4

1

4

70 Cel

-25 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

YES

OTHER

NO LEAD

UPPER

NT2H1001G0DUDV by NXP Semiconductors

NT2H1001G0DUDV

NXP Semiconductors

CONSUMER CIRCUIT; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Minimum Operating Temperature: -25 Cel; No. of Functions: 1;

CONSUMER CIRCUIT

R-XUUC-N

1

70 Cel

-25 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

NOT SPECIFIED

YES

NO LEAD

UPPER

NOT SPECIFIED

NT2H1001G0DUFV by NXP Semiconductors

NT2H1001G0DUFV

NXP Semiconductors

CONSUMER CIRCUIT; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; Maximum Operating Temperature: 70 Cel;

CONSUMER CIRCUIT

R-XUUC-N

1

70 Cel

-25 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

NOT SPECIFIED

YES

NO LEAD

UPPER

NOT SPECIFIED

NT2L1001G0DUDV by NXP Semiconductors

NT2L1001G0DUDV

NXP Semiconductors

CONSUMER CIRCUIT; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Minimum Operating Temperature: -25 Cel; Package Style (Meter): UNCASED CHIP;

CONSUMER CIRCUIT

R-XUUC-N

1

70 Cel

-25 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

NOT SPECIFIED

YES

NO LEAD

UPPER

NOT SPECIFIED

NT2L1001G0DUFV by NXP Semiconductors

NT2L1001G0DUFV

NXP Semiconductors

CONSUMER CIRCUIT; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; JESD-30 Code: R-XUUC-N; Minimum Operating Temperature: -25 Cel;

CONSUMER CIRCUIT

R-XUUC-N

1

70 Cel

-25 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

NOT SPECIFIED

YES

NO LEAD

UPPER

NOT SPECIFIED

THS6222YS by Texas Instruments

THS6222YS

Texas Instruments

THS6222YS by Texas Instruments is a rectangular unencased chip with 19 terminals. It operates in industrial temperature range (-40 to 85°C) and supports supply voltage from 8V to 32V. Ideal for consumer circuit applications requiring surface mount ICs with compact dimensions.

CONSUMER CIRCUIT

R-XUUC-N19

1.64 mm

1

1

19

85 Cel

-40 Cel

UNSPECIFIED

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

NOT SPECIFIED

32 V

8 V

YES

INDUSTRIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

1.26 mm