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LA1654C-X1

Onsemi

LA1654C-X1 by Onsemi

LA1654C-X1 by Onsemi is a surface mount consumer IC with 16 terminals. It operates b/w -20 °C to 70°C, with a supply voltage range of 1.1V to 3.6V. This rectangular package chip is ideal for various consumer circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,516 parts In-Stock

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7,516

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Digiode

USA . 414 parts In-Stock

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414

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AZTECH Wire

Italy . 649 parts In-Stock

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$12.200

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649

$12.200

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TANS Electronics

Latvia . 7,565 parts In-Stock

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7,565

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SupplyDigital Components

Austria . 6,333 parts In-Stock

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6,333

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Kulean Microsystems

USA . 3,005 parts In-Stock

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3,005

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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Problanco Electronics

Mexico . 939 parts In-Stock

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939

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Corphita

USA . 299 parts In-Stock

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299

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Corohmni

South Africa . 271 parts In-Stock

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UHIMA Technologies

Türkiye . 174 parts In-Stock

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Overview

Discover the innovative LA1654C-X1 by Onsemi, a top-quality consumer IC that exceeds expectations. Manufactured by Onsemi, a leading name in the industry, this versatile product offers endless possibilities in various applications. From smart home devices to automotive systems, the LA1654C-X1 delivers unmatched performance and reliability. With its surface mount design and compact package shape, this IC is easy to integrate into any project. Trust Onsemi for cutting-edge technology and elevate your products with the LA1654C-X1. Unlock new possibilities and take your creations to the next level with this exceptional consumer circuit. Enhance your designs today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during manufacturing processes.

Package Shape: RECTANGULAR

Rectangular shape enables efficient use of space on the circuit board, making the product compact and suitable for various applications.

Power Supplies (V): 3

Operates at a standard voltage level of 3V, ensuring compatibility with most electronic devices and systems.

Package Style (Meter): UNCASED CHIP

Uncased chip design offers versatility in mounting options and allows for customization based on specific requirements.

Maximum Operating Temperature: 70 °C

Withstands high temperatures up to 70 °C, providing reliable performance in demanding environments.

Minimum Operating Temperature: -20 °C

Functions effectively even in low temperatures down to -20 °C, ensuring reliable operation in diverse conditions.

Minimum Supply Voltage (Vsup): 1.1 V

Can operate efficiently at low power supply voltages, offering energy-saving capabilities and enhanced performance.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a maximum supply voltage of 3.6V, providing flexibility in power input options and compatibility with various systems.

Technical Specifications

Other Function Consumer ICs LA1654C-X1 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-XUUC-N16

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

0 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

LA1654C-X1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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