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LA1654C

Onsemi

LA1654C by Onsemi

LA1654C by Onsemi is a 16-terminal consumer IC with a rectangular package shape suitable for surface mount applications. It operates b/w -20 °C to 70°C, with supply voltage ranging from 1.5V to 3V. Ideal for various consumer circuit applications requiring compact and efficient electronic components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,256 parts In-Stock

1+ parts

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2,256

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Digiode

USA . 748 parts In-Stock

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748

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 6,560 parts In-Stock

1+ parts

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100+ parts

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6,560

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TANS Electronics

Latvia . 6,308 parts In-Stock

1+ parts

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6,308

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Kulean Microsystems

USA . 3,525 parts In-Stock

1+ parts

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3,525

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SupplyDigital Components

Austria . 2,389 parts In-Stock

1+ parts

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2,389

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Corphita

USA . 960 parts In-Stock

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960

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UHIMA Technologies

Türkiye . 946 parts In-Stock

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946

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Corohmni

South Africa . 438 parts In-Stock

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438

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Overview

Enhance your consumer electronics with the LA1654C by Onsemi. With a reputation for high-quality manufacturing, Onsemi delivers reliable and innovative solutions for consumer ICs. The LA1654C is designed for a wide range of applications, offering customers exceptional value and benefits. From its surface mount capability to its compact rectangular package shape, this product provides convenience and efficiency in any project. Trust Onsemi to deliver cutting-edge technology that enhances your products and sets you apart from the competition. Elevate your designs with the LA1654C today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making this product suitable for compact electronic devices.

Package Shape: RECTANGULAR

Rectangular package shape provides versatility in mounting options and allows for efficient use of space on a circuit board.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronic applications, ensuring optimal performance and compatibility with various consumer devices.

No. of Terminals: 16

Having 16 terminals allows for connectivity to multiple components or devices, increasing the functionality and versatility of the product.

Package Style (Meter): UNCASED CHIP

Uncased chip package style provides a cost-effective and compact solution, suitable for applications where a small footprint is essential.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand high temperatures, ensuring reliable performance in various environmental conditions.

Minimum Operating Temperature: -20 °C

The ability to operate at temperatures as low as -20 °C makes this product suitable for use in a wide range of environments, including cold climates.

Terminal Position: UPPER

The upper terminal position allows for easy accessibility and connection, simplifying the integration of this product into electronic devices.

Minimum Supply Voltage (Vsup): 1.5 V

Operating at a minimum supply voltage of 1.5V allows for energy-efficient operation and compatibility with low-power electronic devices.

Terminal Form: NO LEAD

The no-lead terminal form factor offers improved reliability and better signal integrity, making this product a reliable choice for critical consumer applications.

Maximum Supply Voltage (Vsup): 3 V

With a maximum supply voltage of 3V, this product is compatible with a wide range of power sources, providing flexibility in design and integration.

Technical Specifications

Other Function Consumer ICs LA1654C attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-XUUC-N16

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Maximum Supply Voltage (Vsup):

3 V

Minimum Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

LA1654C General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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