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XC7V585T-1FF1157I

Xilinx

XC7V585T-1FF1157I by Xilinx

Xilinx XC7V585T-1FF1157I FPGA features 582720 logic cells, 600 inputs/outputs, and 1818 MHz clock frequency. Ideal for high-performance applications requiring advanced programmable ICs in a square grid array package with CMOS technology.

Median Price

$9,666.000

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Overview

Unlock the potential of your projects with the XC7V585T-1FF1157I from Xilinx, a powerhouse in FPGA technology. With over 580,000 logic cells and 600 inputs/outputs, this versatile device offers unmatched flexibility for a wide range of applications. Whether you're designing cutting-edge electronics or pushing the boundaries of computing, Xilinx's reputation for quality and innovation ensures that you're getting the best. Embrace the future of programmable gate arrays and elevate your creations with the XC7V585T-1FF1157I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the FPGA, making it suitable for a variety of environments.

No. of Logic Cells: 582720

With a high number of logic cells, this FPGA offers the capability to handle complex logic functions and computations efficiently.

Surface Mount: YES

Being surface mountable makes the installation and integration of this FPGA easier and more convenient.

Technology Used: CMOS

CMOS technology enables low power consumption and high speed performance, making this FPGA energy-efficient and reliable.

No. of Inputs: 600

With a large number of inputs, this FPGA can accommodate a wide range of input signals and data for processing.

Package Shape: SQUARE

The square package shape allows for more efficient use of space and easier integration into circuit designs.

Form Of Terminal: BALL

The ball form of terminal ensures secure connections and reliable conductivity for the FPGA.

Power Supplies (V): 1,1.8

The availability of multiple power supply options allows for flexibility in powering the FPGA according to specific requirements.

No. of Terminals: 1156

With a large number of terminals, this FPGA provides ample connectivity options for interfacing with other components and systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field programmable gate array, this IC offers reprogrammable logic, allowing for flexibility and customization in applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and organized layout for the terminals, enhancing the overall design and functionality of the FPGA.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals allows for precise and efficient connections, contributing to the reliability and performance of the FPGA.

Finishing Of Terminal Used: Tin/Lead (Sn/Pb)

The use of tin/lead finishing on the terminals ensures good solderability and conductivity, enhancing the overall quality and reliability of the FPGA.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom facilitates easier installation and maintenance of the FPGA in electronic systems.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that this FPGA has moderate sensitivity to moisture, making it suitable for a wider range of operating environments with controlled humidity levels.

Maximum Clock Frequency: 1818 MHz

With a high maximum clock frequency, this FPGA can process data and logic operations at high speeds, ideal for real-time applications and computations.

No. of Outputs: 600

Having a large number of outputs enables this FPGA to deliver processed data and signals to various components and systems efficiently.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7V585T-1FF1157I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

582720

No. of Inputs:

600

No. of Outputs:

600

Maximum Clock Frequency:

1818 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Power Supplies:

1,1.8 V

Temperature and Environmental Ratings

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Package Equivalence Code:

BGA1156,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Lead

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1156

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC7V585T-1FF1157I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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