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XC7K70T-3FBG676E

Xilinx

XC7K70T-3FBG676E by Xilinx

The Xilinx XC7K70T-3FBG676E is a CMOS FPGA with 65600 logic cells and 5125 CLBs. It operates at a max clock frequency of 1412 MHz, making it ideal for high-performance applications in industries like telecommunications, aerospace, and automotive. With a package style of grid array and moisture sensitivity level of 4, this FPGA offers versatile programmability for various design requirements.

Median Price

$414.660

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Mouser Electronics

USA . 10 parts In-Stock

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VNN

France . 318 parts In-Stock

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Nova Conductors

Japan . 64 parts In-Stock

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Digiode

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Touchstone Systems

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Cyclops Electronics Ltd

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Ampacity Inc.

Singapore . 1,180 parts In-Stock

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One Stop Electronics

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AZTECH Wire

Italy . 587 parts In-Stock

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Corohmni

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Modulus Dynamics

Lithuania . 1,269 parts In-Stock

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Texas Native Microelectronics

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$110.862

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Vigor

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Semicontronic

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Corphita

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Continental Prestige Electronics

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$375.815

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Argo Parts USA

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Overview

Unleash the power of innovation with the XC7K70T-3FBG676E by Xilinx, a cutting-edge Field Programmable Gate Array designed to exceed your expectations. Manufactured with precision and expertise by Xilinx, this FPGA offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with endless possibilities for customization and optimization. Experience the value and benefits of this advanced technology, revolutionize your projects, and stay ahead of the curve with the XC7K70T-3FBG676E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for a wide range of applications.

No. of Logic Cells: 65600

With a high number of logic cells, this FPGA can handle complex and demanding tasks efficiently.

Surface Mount: YES

Surface mounting allows for easy integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage helps to minimize power consumption and heat dissipation, improving overall energy efficiency.

No. of CLBs: 5125

The large number of Configurable Logic Blocks allows for flexible and customizable programming options.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA reliable and efficient.

No. of Inputs: 300

With a high number of inputs, the FPGA can process a large amount of data simultaneously, enhancing performance.

Package Shape: SQUARE

The square shape of the package provides a compact design, making it ideal for space-constrained applications.

Form Of Terminal: BALL

Ball terminals ensure reliable connections and easy soldering during the assembly process.

Power Supplies (V): 1,1.8,3.3

Multiple power supply options allow for compatibility with different system requirements and voltage levels.

No. of Terminals: 676

The high number of terminals provides ample connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, the FPGA offers flexibility for customization and adapting to changing project requirements.

Package Style (Meter): GRID ARRAY

The grid array package style provides a strong and reliable connection to the PCB, ensuring stable operation in various conditions.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage ensures reliable operation even under low-power conditions.

Pitch Of Terminal: 1 mm

The small pitch of the terminals enables high-density mounting, saving valuable board space and allowing for more complex designs.

Maximum Combinatorial Delay of a CLB: 0.58 ns

The low combinatorial delay ensures fast processing of logic functions, enhancing the overall performance of the FPGA.

Organization: 5125 CLBS

The organized structure of 5125 Configurable Logic Blocks allows for efficient logic implementation and routing.

Finishing Of Terminal Used: TIN SILVER COPPER

The finishing of the terminals with tin, silver, and copper ensures good conductivity and corrosion resistance for long-lasting performance.

Position Of Terminal: BOTTOM

Bottom-mounted terminals make it easier to integrate the FPGA into the circuit board and facilitate heat dissipation.

Moisture Sensitivity Level (MSL): 4

The MSL rating of 4 indicates that the FPGA can withstand exposure to moderate moisture levels, increasing its reliability in various environments.

Maximum Seated Height: 2.54 mm

The low seated height profile makes the FPGA suitable for applications where space is limited.

Width: 27 mm

The compact width of the FPGA allows for easy integration into different board layouts and designs.

Maximum Clock Frequency: 1412 MHz

The high maximum clock frequency enables fast data processing and execution of complex algorithms.

No. of Outputs: 300

With a high number of outputs, the FPGA can deliver results to multiple devices or components simultaneously, enhancing system efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The FPGA can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance of 250°C allows for robust soldering connections and reliable operation under extreme conditions.

Length: 27 mm

The moderate length of the FPGA makes it compatible with standard board sizes and layouts.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7K70T-3FBG676E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

65600

No. of Inputs:

300

No. of Outputs:

300

No. of CLBs:

5125

Maximum Clock Frequency:

1412 MHz

CLB Maximum Delay:

0.58 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

5125 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

1,1.8,3.3 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.54 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7K70T-3FBG676E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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