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XC7K355T-2FFG901I

Xilinx

XC7K355T-2FFG901I by Xilinx

Xilinx XC7K355T-2FFG901I FPGA offers 356160 logic cells, 27825 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring advanced programmable ICs with low combinatorial delay and multiple power supply options.

Median Price

$3,699.220

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Mouser Electronics

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Digiode

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Nova Conductors

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AZTECH Wire

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Modulus Dynamics

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Argo Parts USA

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Microchip USA

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Lixinc

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Overview

Unlock the power of innovation with the XC7K355T-2FFG901I by Xilinx, a leading manufacturer in Field Programmable Gate Arrays (FPGA). This cutting-edge technology offers unparalleled flexibility and performance for a wide range of applications. Experience seamless integration, high-speed processing, and reliable functionality with this state-of-the-art product. Embrace the future of technology and elevate your projects with the XC7K355T-2FFG901I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material for protection and longevity.

No. of Logic Cells: 356160

High number allows for complex designs and applications.

Surface Mount: YES

Easy and convenient installation on circuit boards.

Maximum Supply Voltage: 1.03 V

Low power consumption for energy efficiency.

No. of CLBs: 27825

Offers ample resources for implementing logic functions.

Technology Used: CMOS

Provides low power consumption and high noise immunity.

No. of Inputs: 300

Allows for versatile connectivity and input options.

Package Shape: SQUARE

Space-saving design for efficient PCB layout.

Form Of Terminal: BALL

Ensures reliable connections in applications.

Power Supplies (V): 1,1.8,3.3

Compatible with a variety of power sources for flexibility.

No. of Terminals: 901

Provides multiple connection points for versatility.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for customization and reconfiguration as needed.

Package Style (Meter): GRID ARRAY

Offers organized layout for easy integration into systems.

Minimum Supply Voltage: 0.97 V

Accommodates low power requirements for efficient operation.

Pitch Of Terminal: 1 mm

Standard spacing for compatibility with common connectors.

Maximum Combinatorial Delay of a CLB: 0.61 ns

Fast processing speed for real-time applications.

Organization: 27825 CLBS

Provides a structured layout for efficient programming and design.

Finishing Of Terminal Used: TIN SILVER COPPER

Ensures reliable and durable connections for longevity.

Position Of Terminal: BOTTOM

Simplifies installation and connection to other components.

Moisture Sensitivity Level (MSL): 4

Suitable for a range of environmental conditions.

Maximum Seated Height: 3.35 mm

Compact size for space-constrained applications.

Width: 31 mm

Standard width for compatibility with common PCB layouts.

Maximum Clock Frequency: 1286 MHz

Allows for high-speed processing and data transmission.

No. of Outputs: 300

Offers multiple output options for versatile applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 245

Suitable for high-temperature soldering processes.

Length: 31 mm

Standard length for compatibility with common PCB layouts.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7K355T-2FFG901I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

356160

No. of Inputs:

300

No. of Outputs:

300

No. of CLBs:

27825

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

0.61 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

27825 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

1,1.8,3.3 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

3.35 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

901

Standards

JESD-30 Code:

S-PBGA-B901

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7K355T-2FFG901I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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