Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XC4VLX100-11FFG1148I by Xilinx is a FPGA with 110592 logic cells, 12288 CLBs, and 768 inputs/outputs. Operating at max frequency of 1205 MHz, it's ideal for high-performance applications requiring advanced programmable ICs in a compact GRID ARRAY package.
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Provides durability and protection for the internal components of the FPGA, ensuring reliable performance in various environmental conditions.
High number of logic cells allows for complex and advanced digital designs to be implemented effectively.
Enables easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.
Allows for flexibility in power requirements while maintaining stable operation of the FPGA.
Utilizes Complementary Metal-Oxide-Semiconductor technology for efficient power consumption and high-speed operation.
Provides ample input channels for interfacing with external devices and processing input signals effectively.
Square shape allows for efficient use of board space and facilitates uniform heat dissipation for better thermal management.
Ball terminal design enables secure and reliable connections, essential for seamless communication between the FPGA and other components.
Stable supply voltage ensures consistent performance of the FPGA under normal operating conditions.
Sufficient number of terminals for connecting the FPGA to external circuitry, offering flexibility in design and functionality.
Being a FPGA allows for reconfiguration of the logic functions, making it versatile and adaptable to changing project requirements.
Grid array package style provides a compact and organized layout for the terminals, making it easier for PCB assembly and routing.
Lower minimum supply voltage allows for efficient power management and can extend battery life in portable applications.
Close terminal pitch enables high-density mounting and minimizes signal interference for improved overall performance.
Organized into 12288 Configurable Logic Blocks (CLBs) for efficient logic implementation and resource utilization.
Terminal finishing with a combination of Tin, Silver, and Copper provides reliable conductivity and corrosion resistance for long-term reliability.
Bottom terminal position simplifies PCB layout and routing, enhancing overall design flexibility and ease of integration.
MSL 4 ensures that the FPGA can withstand exposure to moderate humidity levels during shipping and assembly processes.
Low profile design with a maximum seated height of 3.4 mm enables compact PCB assembly and reduces overall system height.
Compact width of 35 mm offers space-saving advantages and allows for efficient placement on PCBs with limited real estate.
High maximum clock frequency enables fast processing and execution of logic functions, suitable for demanding applications.
Numerous output channels for transmitting processed data and signals to other components, offering versatility and connectivity options.
Withstands peak reflow temperatures for up to 30 seconds, ensuring reliable soldering and assembly processes during manufacturing.
Can withstand peak reflow temperatures of 245°C, making it suitable for lead-free soldering processes and RoHS compliance.
Compact length of 35 mm offers a balanced form factor and allows for efficient PCB layout and design integration.
Field Programmable Gate Arrays (FPGA) XC4VLX100-11FFG1148I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XC4VLX100-11FFG1148I Programmable ICs trade compliance attributes, and parameters.
ECCN
3A001.A.7.A
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
2N7002
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
BAV99
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
International Devices
1N4148
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
Silicon Standard
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBF170LT1G
Onsemi
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
Bytesonic Electronics
Semitronics
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
DP83848IVVX/NOPB
Texas Instruments
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
Won-top Electronics
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
XC7A12T-2CSG325I
Xilinx
XC7A12T-2CSG325I by Xilinx is a Field Programmable Gate Array (FPGA) with 12800 logic cells and a max clock frequency of 1286 MHz. It is commonly used in industrial applications for its high performance and programmability.
10M25DAF256C8G
Intel
The Intel 10M25DAF256C8G is a FPGA with 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. It operates at a voltage range of 1.15V to 1.25V and has a temperature range of 0°C to 85°C. This FPGA is suitable for applications requiring high-speed processing and programmable logic capabilities in various electronic systems.
10M08SAE144C8G
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
EP4CE40F23C6N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
LCMXO2-4000HC-4BG332I
Lattice Semiconductor
LCMXO2-4000HC-4BG332I by Lattice Semiconductor is a FPGA with 4320 logic cells, 274 inputs/outputs, and operates at 2.5V nominal voltage. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
MPF100T-FCVG484I
Microchip Technology
MPF100T-FCVG484I by Microchip is a CMOS FPGA with 284 inputs/outputs, operating temp range of -40 to 100°C. It features a grid array package with 0.8mm terminal pitch, suitable for industrial applications requiring high-density programmable logic solutions.
XC7S15-1CPGA196C
The Xilinx XC7S15-1CPGA196C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
LCMXO2-256HC-4SG48C
LCMXO2-256HC-4SG48C by Lattice Semiconductor is a 256 Logic Cells FPGA with 32 CLBs and 40 Inputs/Outputs. It operates at a max voltage of 3.6V, suitable for applications requiring high-speed processing in compact electronic devices. Ideal for projects needing efficient programmable ICs in tight spaces with temp range of 0-85°C.
LCMXO2-256ZE-2SG32I
LCMXO2-256ZE-2SG32I by Lattice Semiconductor is a 256 Logic Cell FPGA with 32 CLBs and 21 Inputs/Outputs. Operating at 1.2V, it has a temperature range of -40 to 100°C. Ideal for applications requiring low power consumption and high performance in compact designs.
EP2C5F256C8N
EP2C5F256C8N by Intel is a FPGA with 4608 logic cells, 288 CLBs, and 1.25V max supply voltage. It is ideal for applications requiring high clock frequencies up to 402.5MHz, such as signal processing and data acceleration in various electronic systems. The package style is grid array, low profile with a square shape and surface mount capability for versatile integration options.
EP2C5Q208C8N
The EP2C5Q208C8N by Altera is a CMOS FPGA with 4608 logic cells, 288 CLBs, and a maximum clock frequency of 402.5 MHz. It has 142 inputs, 134 outputs, and requires a 3.3V supply. This FPGA is suitable for various applications requiring programmable logic.
XC7K160T-3FBG676E
Xilinx XC7K160T-3FBG676E is a FPGA with 162240 logic cells, 12675 CLBs, and max clock frequency of 1412 MHz. Ideal for high-speed applications requiring advanced programmable ICs in compact form factors.
XC7A100T-1CSG324I
Xilinx XC7A100T-1CSG324I is a FPGA with 101440 logic cells, 7925 CLBs, and 300 inputs/outputs. It operates at max frequency of 1098 MHz and supports industrial temperature range. Ideal for high-performance applications requiring fast processing speeds in compact form factors.
M2S090-FCSG325I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology Used: CMOS;
5CEFA7F23I7N
Intel's 5CEFA7F23I7N FPGA boasts 149.5K logic cells and operates at a max supply voltage of 1.13V. Ideal for applications requiring high-speed processing, with 240 inputs/outputs and CMOS technology ensuring efficient performance in a compact square package.
XC3S200AN-4FTG256C
Xilinx XC3S200AN-4FTG256C is a FPGA with 4032 logic cells, 448 CLBs, and 195 inputs. It operates at max frequency of 667 MHz and has 160 outputs. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.
EP1C3T144C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC6SLX75-3FGG676C
Xilinx XC6SLX75-3FGG676C is a FPGA with 74637 logic cells, 5831 CLBs, and 400 inputs/outputs. It operates at max clock frequency of 862 MHz, suitable for high-speed applications like signal processing and networking due to its advanced CMOS technology. With a package style of grid array and compact dimensions (27mm x 27mm), it offers flexibility in various electronic designs.
EP3C40F484I7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
10CL010YU256I7G
The Intel 10CL010YU256I7G is a field programmable gate array (FPGA) with 645 CLBs. It has a max supply voltage of 1.25V and operates in temperatures ranging from -40 to 100°C. This FPGA is commonly used in industrial applications for its versatility and compact size (14mm x 14mm).
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XC4VFX12-10FFG668C
XC4VFX12-10FFG668C by Xilinx is a FPGA with 12312 logic cells, 1368 CLBs, and 320 inputs/outputs. It operates at max frequency of 1028 MHz and supports CMOS technology. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.
XC4VFX100-12FFG1517CS1
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5);
XC4VLX200-11FF1513C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1513; Package Code: BGA; Package Shape: SQUARE;
XC4VLX200-11FF1513CS2
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1513; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
XC4VFX20-10FFG672C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
XC4VFX20-11FFG672C
XC4VFX20-11FFG672CS1
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.2,1.2/3.3,2.5;
XC4VFX100-11FFG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 94896;
XC4VLX100-10FFG1148I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.2;
XC4VLX15-10FFG668C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;
XC4VLX25-10FFG668C
XC4VLX60-10FF668C
XC4VSX35-10FFG668I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
XC4VFX100-10FFG1152C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
XC4VFX100-11FFG1517I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 576;
XC4VFX60-10FF672I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
XC4VFX60-10FFG1152I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
XC4VFX60-11FFG672C
XC4VFX60-11FFG672I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
XC4VLX100-10FF1513C
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