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XC2S200-6FGG256C

Xilinx

XC2S200-6FGG256C by Xilinx

Xilinx XC2S200-6FGG256C FPGA features 5292 logic cells, 1176 CLBs, and 200000 gates. With a max clock frequency of 263 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

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Overview

Unlock a world of possibilities with the Xilinx XC2S200-6FGG256C Field Programmable Gate Array (FPGA). Manufactured by industry leader Xilinx, this FPGA boasts 5292 logic cells and 1176 CLBs, offering unmatched performance in a compact package. With 200000 equivalent gates and a maximum clock frequency of 263 MHz, this FPGA is ideal for a wide range of applications. Whether you're working on telecommunications, industrial automation, or aerospace projects, the XC2S200-6FGG256C delivers the power and flexibility you need to bring your designs to life. Experience the quality and innovation of Xilinx with this cutting-edge FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and cost-effective, making the product reliable for various applications.

No. of Logic Cells: 5292

With a high number of logic cells, this FPGA can handle complex logic operations and support advanced functionalities.

Maximum Supply Voltage: 2.625 V

Operating at a maximum supply voltage of 2.625V ensures efficient power consumption and performance.

No. of CLBs: 1176

Having a high number of Configurable Logic Blocks (CLBs) allows for flexible logic implementation and customization.

No. of Inputs: 284

A larger number of inputs provide flexibility in accepting various input signals and data streams.

Nominal Supply Voltage (V): 2.5

Stable nominal supply voltage of 2.5V ensures consistent performance and reliability.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can handle demanding thermal environments.

Maximum Clock Frequency: 263 MHz

Operating at a high clock frequency of 263MHz allows for fast processing and response times in real-time applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC2S200-6FGG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

5292

No. of Inputs:

284

No. of Outputs:

284

No. of CLBs:

1176

No. of Equivalent Gates:

200000

Maximum Clock Frequency:

263 MHz

CLB Maximum Delay:

0.6 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

1176 CLBS, 200000 Gates

Additional Features:

Maximum usable gates 200000

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Power Supplies:

1.5/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC2S200-6FGG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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