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XC18V02PCG44C

Xilinx

XC18V02PCG44C by Xilinx

XC18V02PCG44C by Xilinx is a 256Kx8 NOR type EEPROM with 20MHz clock frequency, operating at -40 to 85°C. It has 20000 write/erase cycles, suitable for industrial applications requiring configuration memory with 3.3V supply and parallel/serial interface.

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Overview

Unlock the power of your devices with the XC18V02PCG44C by Xilinx, a top-quality EEPROM chip designed for maximum performance and reliability. Manufactured by Xilinx, a trusted industry leader, this versatile chip is perfect for a wide range of applications, from industrial automation to consumer electronics. With its advanced technology and high memory density, this chip offers unparalleled value, benefits, and advantages to customers seeking cutting-edge solutions for their projects. Experience the difference with the XC18V02PCG44C and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the EEPROM, ensuring a longer lifespan.

Operating Mode: SYNCHRONOUS

Offers synchronized data transfer, improving reliability and speed.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages, making it easy to integrate into various systems.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher operating temperatures may be present.

Organization: 256KX8

Provides a large amount of data storage capability with efficient organization.

Memory Density: 2097152 bit

Offers a high memory density, allowing for storing a large amount of data.

Endurance: 20000 Write/Erase Cycles

Can withstand a high number of write/erase cycles, ensuring reliability and longevity.

Technical Specifications

EEPROM XC18V02PCG44C attributes and parameters. Explore more EEPROM devices from Xilinx

Specs

Maximum Access Time:

20 ns

Maximum Clock Frequency (fCLK):

20 MHz

Minimum Data Retention Time:

20

Endurance:

20000 Write/Erase Cycles

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.5862 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL/SERIAL

Peak Reflow Temperature (C):

245

Power Supplies (V):

2.5/3.3,3.3

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Maximum Standby Current:

.01 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

16.5862 mm

Trade Compliance

XC18V02PCG44C Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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