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XC18V04VQ44C0936

Xilinx

XC18V04VQ44C0936 by Xilinx

Xilinx XC18V04VQ44C0936 is a 512Kx8 EEPROM with 20ns access time, operating at 3.3V. It features parallel/serial mode and CMOS technology, suitable for industrial applications requiring configuration memory with 4194304-bit density. The package is a square flatpack with thin profile, offering 44 terminals in gull wing form at 0.8mm pitch.

Median Price

$40.250

Lifecycle Status

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1k+

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VNN

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Vyrian

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Overview

Upgrade your electronics with the XC18V04VQ44C0936 by Xilinx, a top-tier EEPROM solution. With Xilinx's reputation for quality and innovation, this product offers unparalleled value and benefits to customers. Ideal for industrial applications, this configuration memory device boasts a wide operating temperature range, high memory density, and fast access times. Trust Xilinx to deliver reliable performance and cutting-edge technology for all your electronic design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and can withstand various environmental conditions, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on circuit boards, enhancing the overall reliability of the product.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures efficient data transfer and communication within the device, improving performance and speed.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V offers energy efficiency while providing sufficient power for the EEPROM to function effectively.

No. of Terminals: 44

Having 44 terminals allows for versatile connectivity options and compatibility with various system architectures.

Package Style (Meter): FLATPACK, THIN PROFILE

The flatpack, thin profile package style saves space and enables compact designs, ideal for applications with limited space constraints.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this EEPROM can withstand heat stress and operate reliably in high-temperature environments.

Organization: 512KX8

The organization of 512KX8 allows for efficient data storage and retrieval, providing ample memory capacity for various applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this EEPROM can function in cold environments without compromising performance.

Terminal Finish: TIN LEAD

The tin lead terminal finish ensures good solderability and electrical conductivity, promoting stable connections and reliable performance.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage requirement of 3V ensures compatibility with a wide range of power sources, making this EEPROM versatile for various applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, contributing to the overall efficiency and reliability of the EEPROM.

Parallel or Serial: PARALLEL/SERIAL

Supporting both parallel and serial communication interfaces provides flexibility in connectivity options, allowing seamless integration into different systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy installation and removal, making maintenance and upgrades hassle-free for users.

Memory Density: 4194304 bit

With a high memory density of 4194304 bits, this EEPROM offers ample storage capacity for data-intensive applications and complex system configurations.

Maximum Access Time: 20 ns

A fast maximum access time of 20 nanoseconds ensures quick data retrieval and processing, enhancing the overall performance and responsiveness of the EEPROM.

Technical Specifications

EEPROM XC18V04VQ44C0936 attributes and parameters. Explore more EEPROM devices from Xilinx

Specs

Maximum Access Time:

20 ns

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e0

Length:

10 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Parallel or Serial:

PARALLEL/SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

XC18V04VQ44C0936 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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