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W83627HG-AW

Winbond Electronics

W83627HG-AW by Winbond Electronics

Multifunction Peripherals; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;

Median Price

$2.321

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,481 parts In-Stock

1+ parts

$4.870

100+ parts

$2.409

1k+ parts

$1.865

10k+ parts

$1.737

3,481

$4.870

$2.409

$1.865

$1.737

Arrow

USA . 55 parts In-Stock

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-

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$2.321

1k+ parts

$1.749

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$1.613

55

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$2.321

$1.749

$1.613

Verical

USA . 55 parts In-Stock

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55

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Chip1Stop

Japan . 55 parts In-Stock

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$2.321

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55

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$2.321

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Distributors (In-Stock)

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Component Electronics Inc.

Canada . 14 parts In-Stock

1+ parts

$3.850

100+ parts

$2.880

1k+ parts

$2.500

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-

14

$3.850

$2.880

$2.500

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NAC Semi

USA . 32 parts In-Stock

1+ parts

$4.050

100+ parts

$3.750

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32

$4.050

$3.750

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Chip Stock

USA . 983 parts In-Stock

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983

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Q Components

USA . 396 parts In-Stock

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396

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LWI Electronics Inc

India . 386 parts In-Stock

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Pegasus Components GmbH

Germany . 311 parts In-Stock

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ComSIT Distribution GmbH

Germany . 264 parts In-Stock

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ComSIT USA

USA . 264 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 189 parts In-Stock

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189

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Zilex Electronics Inc.

Canada . 179 parts In-Stock

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179

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Cyclops Electronics Ltd

UK . 129 parts In-Stock

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129

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Connect4Technologies Inc.

Canada . 117 parts In-Stock

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Tectiva GmbH

Germany . 105 parts In-Stock

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Connector Distribution Corp

USA . 66 parts In-Stock

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66

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Right Parts Inc.

USA . 66 parts In-Stock

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66

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Prism Electronics

USA . 50 parts In-Stock

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50

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J2 Sourcing AB

Sweden . 40 parts In-Stock

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40

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Inventory MP

USA . 22 parts In-Stock

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22

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Bristol Electronics

USA . 20 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 18 parts In-Stock

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North Shore Components

USA . 16 parts In-Stock

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Sogenti Electronics

Canada . 10 parts In-Stock

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Sunrise Surplus Inc.

USA . 8 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 677 parts In-Stock

1+ parts

$3.160

100+ parts

$3.000

1k+ parts

$2.900

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677

$3.160

$3.000

$2.900

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QUARKTWIN TECHNOLOGY LTD

USA . 8,199 parts In-Stock

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S.R.D Solutions

India . 5,000 parts In-Stock

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Perfect Parts

USA . 4,817 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Assy Fe

Spain . 1,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 724 parts In-Stock

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724

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Metaverse IC Inc.

Canada . 251 parts In-Stock

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251

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Epart123

USA . 94 parts In-Stock

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94

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Speed Components Ltd (Excess)

Israel . 31 parts In-Stock

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Technical Specifications

Multi-functional Peripherals W83627HG-AW attributes and parameters. Explore more Multi-functional Peripherals devices from Winbond Electronics

Specs

Address Bus Width:

4

Boundary Scan:

NO

Bus Compatibility:

LPC

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

4

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

128

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.67X.93,20

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

256

Maximum Seated Height:

3.32 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

W83627HG-AW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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