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W25Q64FVZPIG

Winbond Electronics

W25Q64FVZPIG by Winbond Electronics

Winbond Electronics' W25Q64FVZPIG is an 8MX8 flash memory with SPI serial bus, operating at up to 104 MHz. It offers a memory density of 67108864 bits and can withstand industrial temperature grades. Ideal for applications requiring fast data transfer and reliable storage in compact devices.

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Lifecycle Status

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Vyrian

USA . 2,480 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Bristol Electronics

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Nova Conductors

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EZ Electronic Parts

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South Electronics

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Corohmni

South Africa . 28 parts In-Stock

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Aztec Data Supply Inc.

USA . 97 parts In-Stock

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AZTECH Wire

Italy . 497 parts In-Stock

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Kepictronics

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Argo Parts USA

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Benley Electronics

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Continental Prestige Electronics

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Perfect Parts

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Bastille Electronics

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Advanced Electronics

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Computer Components Inc. - USA

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Overview

Boost your electronic devices with the reliable and high-quality W25Q64FVZPIG Flash Memory by Winbond Electronics. Known for their innovative solutions and cutting-edge technology, Winbond Electronics offers top-of-the-line products that guarantee superior performance and durability. The W25Q64FVZPIG is perfect for a wide range of applications, ensuring fast data transfer speeds and efficient operation. Upgrade your systems today and experience the value and benefits that this exceptional product brings to your projects. Trust Winbond Electronics to deliver excellence in every aspect of your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the flash memory product easy to handle and long-lasting.

Surface Mount: YES

Being surface-mountable allows for easy installation on circuit boards, saving space and simplifying the overall design of electronic devices.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data transfer is efficient and synchronized, enhancing overall performance of the flash memory.

Memory Density: 67108864 bit

With a high memory density, this flash memory product can store a large amount of data in a compact size, making it ideal for various applications.

Maximum Clock Frequency (fCLK): 104 MHz

A high clock frequency allows for fast data transfer speeds, making this flash memory product suitable for high-performance systems.

Memory IC Type: FLASH

Being a flash memory IC, this product offers non-volatile storage capabilities, ensuring data retention even when power is disconnected.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating temperatures, this flash memory product is reliable and durable in harsh environments.

No. of Words: 8388608 words

With a large number of words, this flash memory product has ample storage capacity for storing data efficiently.

Technical Specifications

Flash Memory W25Q64FVZPIG attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Alternate Memory Width:

1

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

20

JESD-30 Code:

R-PDSO-N8

Length:

6 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.2

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00005 Amp

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25Q64FVZPIG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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