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W25Q32FVZEIG

Winbond Electronics

W25Q32FVZEIG by Winbond Electronics

Winbond Electronics' W25Q32FVZEIG is a 32M NOR Flash Memory with SPI interface, operating at up to 104 MHz. It features 100000 Write/Erase Cycles endurance and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring high-speed data transfer and reliable non-volatile memory storage.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Dan-Mar Components

USA . 16,910 parts In-Stock

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16,910

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Bristol Electronics

USA . 10,910 parts In-Stock

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10,910

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Vyrian

USA . 6,397 parts In-Stock

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6,397

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Corohmni

South Africa . 186 parts In-Stock

1+ parts

$2.808

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186

$2.808

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Aztec Data Supply Inc.

USA . 181 parts In-Stock

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$4.749

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181

$4.749

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AZTECH Wire

Italy . 600 parts In-Stock

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$18.919

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600

$18.919

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Continental Prestige Electronics

USA . 5,955 parts In-Stock

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5,955

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 3,179 parts In-Stock

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3,179

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock the power of high-quality flash memory with the W25Q32FVZEIG by Winbond Electronics. Known for their reliable and innovative products, Winbond Electronics offers a top-of-the-line solution for your memory needs. This flash memory device is perfect for applications requiring fast and efficient data storage, offering customers value, benefits, and advantages that set it apart from the competition. Experience seamless performance and reliability with Winbond Electronics' W25Q32FVZEIG, the ideal choice for all your memory requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to impact, making it suitable for various applications.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V ensures stable and consistent power supply for optimal performance of the flash memory.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this flash memory can withstand harsh environmental conditions and extended usage.

Write Protection: HARDWARE/SOFTWARE

The write protection feature allows for secure data storage and prevents accidental deletion or modification of important information.

Endurance: 100000 Write/Erase Cycles

Having an endurance of 100,000 write/erase cycles ensures reliability and longevity of the flash memory, making it a cost-effective choice for frequent data read/write operations.

Technical Specifications

Flash Memory W25Q32FVZEIG attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

Length:

8 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00002 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25Q32FVZEIG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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