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W25Q128FVFIQ

Winbond Electronics

W25Q128FVFIQ by Winbond Electronics

Winbond Electronics' W25Q128FVFIQ is a 128M NOR flash memory with SPI serial bus, 104 MHz clock frequency, and 100000 write/erase cycles. It operates at -40 to 85 °C for industrial applications requiring reliable non-volatile memory storage.

Median Price

$1.543

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 38 parts In-Stock

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$1.543

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38

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Vyrian

USA . 7,409 parts In-Stock

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7,409

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Prism Electronics

USA . 900 parts In-Stock

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900

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ComSIT Distribution GmbH

Germany . 20 parts In-Stock

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20

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.543

100+ parts

$1.512

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2,000

$1.543

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AZTECH Wire

Italy . 803 parts In-Stock

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$13.608

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803

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Perfect Parts

USA . 1,008 parts In-Stock

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Overview

Experience lightning-fast data storage and retrieval with the Winbond Electronics W25Q128FVFIQ Flash Memory. Crafted with precision and innovation, Winbond Electronics ensures top-notch quality in all their products. The W25Q128FVFIQ is perfect for a wide range of applications, offering unmatched reliability and performance. Unlock seamless operation and enhanced productivity with this versatile flash memory solution. Choose Winbond Electronics for cutting-edge technology that delivers value and efficiency to meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this Flash Memory product lightweight and durable, ideal for various applications.

Surface Mount: YES

With the ability to be surface mounted, this Flash Memory can easily be integrated into circuit boards, saving space and improving overall design efficiency.

Operating Mode: SYNCHRONOUS

Operating in synchronous mode allows for faster and more efficient data transfer, making this Flash Memory suitable for high-performance systems.

Nominal Supply Voltage (Vsup): 3V

The 3V nominal supply voltage ensures compatibility with a wide range of systems and devices, making this Flash Memory versatile and easy to integrate.

Power Supplies (V): 3/3.3

With multiple power supply options, this Flash Memory can be adapted to different power requirements, offering flexibility in system design.

No. of Terminals: 16

The 16 terminals provide ample connectivity options, allowing for easy integration and communication with other components in the system.

Package Shape: RECTANGULAR

The rectangular package shape is a common and space-efficient design, making this Flash Memory easy to handle and install in various applications.

Technical Specifications

Flash Memory W25Q128FVFIQ attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G16

Length:

10.31 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

16

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2.64 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00002 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

7.49 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25Q128FVFIQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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