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TOIM5232-TR3

Vishay Intertechnology

TOIM5232-TR3 by Vishay Intertechnology

TOIM5232-TR3 by Vishay Intertechnology is a 20-terminal interface IC with CMOS technology. It operates b/w -25°C to 85°C, with supply voltage range of 2.7V to 3.6V. This square-shaped chip carrier is ideal for applications requiring very thin profile and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Semi Source

USA . 7,086 parts In-Stock

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Vyrian

USA . 6,813 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Corohmni

South Africa . 265 parts In-Stock

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$5.522

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265

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Aztec Data Supply Inc.

USA . 4,728 parts In-Stock

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$8.570

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AZTECH Wire

Italy . 815 parts In-Stock

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$16.720

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$16.720

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Ampacity Inc.

Singapore . 1,479 parts In-Stock

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$40.500

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Semicontronic

India . 610 parts In-Stock

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$43.500

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$42.412

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$42.195

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610

$43.500

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$42.195

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Continental Prestige Electronics

USA . 2,067 parts In-Stock

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Argo Parts USA

USA . 1,033 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Microchip USA

USA . 189 parts In-Stock

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Overview

Unleash the power of seamless connectivity with the TOIM5232-TR3 by Vishay Intertechnology. Designed for optimal performance and reliability, this interface circuit is perfect for a wide range of applications. With its innovative technology and compact design, this product offers unmatched value and benefits to customers. Say goodbye to connectivity issues and hello to smooth operations with the TOIM5232-TR3. Experience the quality and advantages that only Vishay Intertechnology can deliver.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on a PCB, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options, allowing for compatibility with a variety of systems.

Package Shape: SQUARE

Square package shape is a commonly used form factor that allows for efficient use of board space and easy alignment during assembly.

No. of Terminals: 20

Provides a sufficient number of connection points for versatile interfacing with other components or systems.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink/slug, and very thin profile design offers enhanced thermal performance and space-saving benefits.

Minimum Supply Voltage: 2.7 V

Allows for operation in low-power scenarios, making it suitable for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Can withstand relatively high temperatures, ensuring reliable performance in various environmental conditions.

Minimum Operating Temperature: -25 °C

Capable of functioning in cold temperatures, expanding the range of possible applications.

Terminal Position: QUAD

Quad terminal positioning provides a stable and secure connection, reducing the risk of signal interference or loss.

Maximum Seated Height: 0.8 mm

Low-profile design helps conserve space within the overall system layout and facilitates compact product designs.

Width: 4 mm

Compact width dimensions enable efficient use of board space, especially in applications with size constraints.

Length: 4 mm

Optimal length dimensions contribute to a balanced form factor and streamlined integration into electronic assemblies.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing overall efficiency.

Terminal Form: NO LEAD

Lead-free terminal form promotes environmentally friendly manufacturing processes and complies with RoHS regulations.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable performance in standard operating conditions.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, enabling compact PCB layouts and intricate circuit designs.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, this product facilitates communication between different components or systems, enhancing overall functionality.

Technical Specifications

Other Function Interface ICs TOIM5232-TR3 attributes and parameters. Explore more Other Function Interface ICs devices from Vishay Intertechnology

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N20

Length:

4 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

TOIM5232-TR3 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

Category top products 20

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