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TOIM4232-TR1

Vishay Intertechnology

TOIM4232-TR1 by Vishay Intertechnology

TOIM4232-TR1 by Vishay Intertechnology is a small outline interface IC with 16 terminals. It operates b/w -25 to 85°C, with supply voltage ranging from 2.7V to 3.6V. Ideal for applications requiring an interface circuit in compact spaces.

Median Price

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Lifecycle Status

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In-Stock Inventory

1k+

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Chip Stock

USA . 2,880 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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Vyrian

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Holdelec - ElecDif-Pro

France . 45 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,834 parts In-Stock

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$3.381

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Corohmni

South Africa . 131 parts In-Stock

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AZTECH Wire

Italy . 757 parts In-Stock

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$18.763

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Ampacity Inc.

Singapore . 946 parts In-Stock

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$34.500

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Component Stockers USA

USA . 686 parts In-Stock

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$99.990

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Authorized Procurement Solutions

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Argo Parts USA

USA . 2,083 parts In-Stock

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Continental Prestige Electronics

USA . 1,277 parts In-Stock

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Overview

Discover the cutting-edge TOIM4232-TR1 by Vishay Intertechnology, a top-tier manufacturer known for its superior quality and innovative technology. This product falls under the category of Other Function Interface ICs, delivering exceptional performance and reliability. With a small outline package style and dual terminal position, this interface circuit offers seamless integration and ease of use. Experience the benefits of a wide operating temperature range, low supply voltage requirements, and matte tin terminal finish. Elevate your projects with the TOIM4232-TR1 and unlock endless possibilities in various applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material chosen for the package body ensures reliability and longevity of the product.

Surface Mount: YES

Enables easy and efficient integration into various electronic systems, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in power source options for the product.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and mounting on circuit boards, optimizing space usage.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components, ensuring versatile functionality and compatibility.

Package Style (Meter): SMALL OUTLINE

Compact and sleek design makes it suitable for applications where space is limited, such as in portable devices.

Minimum Supply Voltage: 2.7 V

Can operate effectively at low supply voltages, offering energy efficiency and extending battery life.

Maximum Operating Temperature: 85 °C

Capable of functioning reliably at high temperatures, suitable for use in various environmental conditions.

Minimum Operating Temperature: -25 °C

Designed to operate in sub-zero temperatures, making it suitable for applications in cold climates or industrial freezers.

Terminal Finish: MATTE TIN

Matte tin finish provides enhanced solderability and conductivity, ensuring secure connections and reliable performance.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting options, allowing for customization in circuit board layouts.

Maximum Seated Height: 2.7 mm

Low profile design with maximum seated height of 2.7 mm enables compact and flush installation in electronic devices.

Width: 7.4 mm

Narrow width of 7.4 mm facilitates easy integration and placement on circuit boards with limited space.

Length: 10.3 mm

Optimal length of 10.3 mm provides a balanced form factor for the product, fitting well within electronic systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: GULL WING

Gull wing terminal form ensures secure mechanical connection during soldering, reducing the risk of disconnection or damage.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V ensures consistent performance and compatibility with standard electronic systems.

Terminal Pitch: 1.27 mm

Fine terminal pitch of 1.27 mm allows for precise and compact layout on circuit boards, ideal for high-density designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate resistance to moisture, suitable for use in typical indoor environments.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit IC, ensuring seamless communication and connectivity between different electronic components.

Technical Specifications

Other Function Interface ICs TOIM4232-TR1 attributes and parameters. Explore more Other Function Interface ICs devices from Vishay Intertechnology

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.7 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.4 mm

Trade Compliance

TOIM4232-TR1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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