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SQ2319ES-T1-GE3

Vishay Intertechnology

SQ2319ES-T1-GE3 by Vishay Intertechnology

Vishay Intertechnology's SQ2319ES-T1-GE3 is a P-channel FET with 40V DS breakdown voltage, 30A IDM, and 0.082 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package. Operating in enhancement mode at up to 175°C, it offers high power dissipation of 3W.

Median Price

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Chip Stock

USA . 67,500 parts In-Stock

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Vyrian

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Ack Elektronik San.Tic.Ltd.Sti

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Cyclops Electronics Ltd

UK . 1,484 parts In-Stock

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Nova Conductors

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Speed Components Ltd

Israel . 48 parts In-Stock

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J2 Sourcing AB

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NexGen Digital

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Corohmni

South Africa . 216 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,118 parts In-Stock

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AZTECH Wire

Italy . 723 parts In-Stock

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Ampacity Inc.

Singapore . 277 parts In-Stock

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Semicontronic

India . 1,330 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Computer Components Inc. - USA

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Bastille Electronics

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Overview

Experience superior power performance with the Vishay Intertechnology SQ2319ES-T1-GE3 P-CHANNEL Power Field Effect Transistor. This cutting-edge transistor offers reliable switching capabilities, making it ideal for a wide range of applications. With Vishay Intertechnology's reputation for high-quality components, you can trust that this FET will deliver exceptional value and efficiency for your projects. Upgrade your power solutions with the SQ2319ES-T1-GE3 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product lightweight and durable, ensuring long-lasting performance.

Polarity or Channel Type: P-CHANNEL

P-channel FETs have lower on-state resistance and higher current carrying capability, making them efficient for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides reliable and efficient performance in such scenarios.

Maximum Drain-Source On Resistance: 0.082 ohm

With a low on-resistance, the FET minimizes power losses and heat generation, leading to improved efficiency.

Maximum Power Dissipation (Abs): 3 W

The high power dissipation capability ensures that the FET can handle demanding applications without overheating or failing.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can function effectively in a wide range of environments and conditions.

Technical Specifications

Power Field Effect Transistors (FET) SQ2319ES-T1-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

1.8 mJ

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

3.3 A

Maximum Drain Current (ID):

3.3 A

Maximum Drain-Source On Resistance:

.082 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

3 W

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SQ2319ES-T1-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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