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SQ2303ES-T1_BE3

Vishay Intertechnology

SQ2303ES-T1_BE3 by Vishay Intertechnology

Vishay Intertechnology's SQ2303ES-T1_BE3 is a P-CHANNEL FET with 30V DS Breakdown Voltage, 10A IDM, and 0.17 ohm RDS(ON). Ideal for power management applications due to its small outline package style, -55 to 175 °C operating temperature range, and built-in diode configuration.

Median Price

$0.153

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 71,287 parts In-Stock

1+ parts

$0.850

100+ parts

$0.341

1k+ parts

$0.259

10k+ parts

$0.184

71,287

$0.850

$0.341

$0.259

$0.184

TTI

USA . 36,000 parts In-Stock

1+ parts

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$0.153

36,000

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$0.153

Arrow

USA . 3,000 parts In-Stock

1+ parts

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$0.146

3,000

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$0.146

Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

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$0.158

3,000

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$0.158

Verical

USA . 3,000 parts In-Stock

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$0.146

3,000

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$0.146

DigiKey

USA . 387 parts In-Stock

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387

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Vyrian

USA . 21,382 parts In-Stock

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Nova Conductors

Japan . 80 parts In-Stock

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80

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Ampacity Inc.

Singapore . 21,237 parts In-Stock

1+ parts

$0.122

100+ parts

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21,237

$0.122

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Aztec Data Supply Inc.

USA . 3,135 parts In-Stock

1+ parts

$1.100

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3,135

$1.100

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Corohmni

South Africa . 109 parts In-Stock

1+ parts

$1.352

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109

$1.352

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QUARKTWIN TECHNOLOGY LTD

USA . 16,567 parts In-Stock

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16,567

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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Continental Prestige Electronics

USA . 6,863 parts In-Stock

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Argo Parts USA

USA . 4,492 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Discover the power of innovation with Vishay Intertechnology's SQ2303ES-T1_BE3 Power Field Effect Transistor. Designed for enhanced performance and reliability, this P-Channel FET with a built-in diode is a game-changer in the electronics industry. From its small outline package to its high operating temperature range, this transistor offers unmatched value and efficiency. Whether you're looking to optimize power management in automotive applications or enhance battery charging systems, the SQ2303ES-T1_BE3 delivers superior results every time. Elevate your designs with Vishay Intertechnology's cutting-edge technology and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable applications.

Polarity or Channel Type: P-CHANNEL

The P-channel configuration allows for lower on-state resistance, resulting in less power loss and higher efficiency in operation.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, enhancing the reliability of the product.

Surface Mount: YES

The surface mount capability saves space on the PCB and allows for automated assembly processes, increasing production efficiency.

Minimum DS Breakdown Voltage: 30 V

The high DS breakdown voltage ensures the reliability and long-term stability of the product in various operating conditions.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient heat dissipation and easy mounting onto the PCB, improving overall thermal performance.

Terminal Form: GULL WING

The gull wing terminal form offers strong mechanical strength and easy soldering, ensuring a secure electrical connection.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for better control over the switching behavior of the FET, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 10 A

The high pulsed drain current rating ensures the FET can handle sudden surges in current without damage, making it reliable in high-power applications.

Avalanche Energy Rating (EAS): 2.4 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage spikes and transient events, increasing overall ruggedness.

No. of Terminals: 3

The three terminals allow for versatile connectivity options and enable the FET to be easily integrated into different circuit layouts.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs and portable electronics.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOSFET technology offers high switching speeds, low gate drive requirements, and reduced power loss, ensuring efficient operation.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the FET to withstand extreme heat conditions, expanding its range of applications.

Transistor Element Material: SILICON

The use of silicon material in the transistor element ensures reliable performance, high conductivity, and low heat generation.

Maximum Turn On Time (ton): 20 ns

The fast turn-on time enables quick switching between on and off states, improving overall efficiency and reducing power loss.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the FET to function in cold environments without compromising performance or reliability.

Maximum Turn Off Time (toff): 30 ns

The fast turn-off time minimizes switching losses and improves efficiency, making the FET suitable for high-speed applications.

Maximum Drain Current (ID): 2.5 A

The high drain current rating ensures the FET can handle continuous current flow without overheating, making it reliable in various power circuits.

Maximum Drain-Source On Resistance: 0.17 ohm

The low drain-source on resistance reduces power loss and improves efficiency, making the FET ideal for high-current applications.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and simplified PCB layout, making it easier to integrate the FET into different circuit designs.

Maximum Feedback Capacitance (Crss): 35 pF

The low feedback capacitance minimizes signal distortion and improves high-frequency performance, making the FET suitable for applications requiring fast response times.

Technical Specifications

Power Field Effect Transistors (FET) SQ2303ES-T1_BE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

2.4 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

2.5 A

Maximum Drain-Source On Resistance:

.17 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

35 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

10 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

30 ns

Maximum Turn On Time (ton):

20 ns

Trade Compliance

SQ2303ES-T1_BE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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