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SISS05DN-T1-GE3

Vishay Intertechnology

SISS05DN-T1-GE3 by Vishay Intertechnology

Vishay Intertechnology's SISS05DN-T1-GE3 is a P-channel FET with 30V DS breakdown voltage and 300A IDM. Ideal for switching applications, it operates in enhancement mode with -55 to 150 °C temperature range. With 0.0058 ohm max RDS(on) and 31.2 mJ EAS, this MOSFET offers high performance in a small outline package.

Median Price

$0.939

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Distrelec

Netherlands . 10,832 parts In-Stock

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$1.062

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$1.062

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Element14

Singapore . 9,425 parts In-Stock

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$0.816

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$0.563

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$0.552

9,425

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$0.816

$0.563

$0.552

Distributors (In-Stock)

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Nova Conductors

Japan . 75 parts In-Stock

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$0.849

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75

$0.849

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Maritex

Poland . 9,000 parts In-Stock

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$0.938

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$0.747

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$0.938

$0.747

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Vyrian

USA . 12,898 parts In-Stock

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Chip Stock

USA . 10,500 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 12,425 parts In-Stock

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$0.377

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12,425

$0.377

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Argo Parts USA

USA . 2,453 parts In-Stock

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$0.849

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2,453

$0.849

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Netroflash

USA . 100 parts In-Stock

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$0.849

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$0.807

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$0.790

100

$0.849

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$0.790

Microchip USA

USA . 5,539 parts In-Stock

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$3.464

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QUARKTWIN TECHNOLOGY LTD

USA . 24,861 parts In-Stock

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Continental Prestige Electronics

USA . 10,921 parts In-Stock

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$0.652

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$0.426

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10,921

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$0.652

$0.426

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Perfect Parts

USA . 3,360 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,083 parts In-Stock

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Overview

Unleash the power of innovation with the Vishay Intertechnology SISS05DN-T1-GE3 Power Field Effect Transistor. Designed for switching applications, this P-Channel FET offers unmatched performance and reliability. With a maximum operating temperature of 150°C and a minimum operating temperature of -55°C, this transistor is built to withstand extreme conditions. Its single configuration with built-in diode ensures seamless operation, while its small outline package style makes it ideal for space-constrained applications. Trust Vishay Intertechnology for quality components that deliver exceptional value and superior results. Upgrade your designs with the SISS05DN-T1-GE3 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and insulation for the transistor, ensuring durability and reliability.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low on-state resistance and high efficiency, making them suitable for power management applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection and simplified circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation.

Surface Mount: YES

Suitable for automated assembly processes, increasing production efficiency.

Maximum Pulsed Drain Current (IDM): 300 A

Capable of handling high current pulses, ideal for power applications.

Maximum Power Dissipation (Abs): 65.7 W

The high power dissipation capability allows for reliable operation under heavy loads.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, making it suitable for demanding environments.

Maximum Drain Current (ID): 108 A

High drain current rating allows for handling of large currents, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.0058 ohm

Low on-resistance minimizes power losses and improves efficiency.

Technical Specifications

Power Field Effect Transistors (FET) SISS05DN-T1-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

31.2 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

108 A

Maximum Drain-Source On Resistance:

.0058 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

140 pF

JESD-30 Code:

S-PDSO-N5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

300 A

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

116 ns

Maximum Turn On Time (ton):

62 ns

Trade Compliance

SISS05DN-T1-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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