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SIR890DP-T1-GE3

Vishay Intertechnology

SIR890DP-T1-GE3 by Vishay Intertechnology

Vishay Intertechnology's SIR890DP-T1-GE3 is a N-channel Power FET with 20V DS Breakdown Voltage, ideal for switching applications. Featuring 70A IDM and 0.004 ohm RDS(on), this MOSFET operates in enhancement mode at up to 150°C. Its small outline package with matte tin finish makes it suitable for surface mount designs.

Median Price

$1.201

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

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$1.201

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Chip Stock

USA . 14,100 parts In-Stock

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Vyrian

USA . 2,546 parts In-Stock

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2,546

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 50 parts In-Stock

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$1.201

100+ parts

$1.177

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50

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Ampacity Inc.

Singapore . 667 parts In-Stock

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$5.050

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667

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AZTECH Wire

Italy . 288 parts In-Stock

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$13.251

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Perfect Parts

USA . 22,701 parts In-Stock

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Kepictronics

USA . 2,740 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Overview

Discover the unparalleled performance and reliability of the SIR890DP-T1-GE3 by Vishay Intertechnology, a leading manufacturer known for its high-quality products. This power field effect transistor (FET) is ideal for various applications such as switching, offering customers exceptional value and benefits. With a maximum drain current of 30A and a low on-resistance of 0.004 ohm, this enhancement mode transistor delivers superior power efficiency and performance. Trust Vishay Intertechnology for innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material makes the transistor lightweight and durable, suitable for various applications.

Polarity or Channel Type:

N-CHANNEL - N-channel FETs typically have higher electron mobility, allowing for better performance in switching applications.

Configuration:

SINGLE W/ BUILT-IN DIODE - The built-in diode simplifies circuit design and protects against reverse current flow.

Transistor Application:

SWITCHING - Designed specifically for switching applications, providing fast and efficient operation.

Surface Mount:

YES - Being surface mountable, this FET can be easily integrated onto circuit boards, saving space and enhancing overall product design.

Minimum DS Breakdown Voltage:

20 V - With a minimum breakdown voltage of 20V, this FET can handle higher voltages, making it suitable for a wide range of applications.

Package Shape:

RECTANGULAR - The rectangular package shape allows for a compact and efficient layout on circuit boards.

Terminal Form:

C BEND - The C bend terminal form ensures secure and reliable connections in applications.

Operating Mode:

ENHANCEMENT MODE - Operating in enhancement mode provides precise control and allows for lower power consumption.

Maximum Pulsed Drain Current (IDM):

70 A - The high pulsed drain current rating of 70A allows for handling sudden power surges without damage.

Avalanche Energy Rating (EAS):

80 mJ - The high avalanche energy rating of 80mJ ensures the FET can withstand high-energy transient events.

Maximum Drain Current (Abs) (ID):

50 A - The high drain current rating of 50A allows for reliable performance in demanding applications.

No. of Terminals:

5 - The five terminals provide flexibility in circuit design and connectivity options.

Maximum Power Dissipation (Abs):

50 W - With a maximum power dissipation of 50W, the FET can handle high power loads without overheating.

Package Style (Meter):

SMALL OUTLINE - The small outline package style saves space and allows for efficient heat dissipation.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Metal-oxide semiconductor technology ensures high performance and reliability in various operating conditions.

Maximum Operating Temperature:

150 °C - The high maximum operating temperature of 150°C allows the FET to operate reliably in harsh environments.

Transistor Element Material:

SILICON - Silicon material provides good thermal conductivity and ensures long-term reliability.

Terminal Finish:

MATTE TIN - The matte tin finish on terminals provides excellent solderability and corrosion resistance.

Maximum Drain Current (ID):

30 A - The maximum drain current rating of 30A ensures reliable operation in high current applications.

Maximum Drain-Source On Resistance:

0.004 ohm - The low drain-source on resistance of 0.004 ohm reduces power loss and improves efficiency.

Terminal Position:

DUAL - The dual terminal position allows for easy integration into circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) SIR890DP-T1-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

80 mJ

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

50 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.004 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-C5

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

70 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SIR890DP-T1-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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