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SIR826DP-T1-GE3

Vishay Intertechnology

SIR826DP-T1-GE3 by Vishay Intertechnology

Vishay Intertechnology's SIR826DP-T1-GE3 is a N-channel Power FET with 80V DS breakdown voltage, ideal for switching applications. Features include 100A max pulsed drain current, 0.0052 ohm max drain-source resistance, and 104W power dissipation. Suitable for enhancement mode operation in high-power electronics.

Median Price

$2.772

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,165 parts In-Stock

1+ parts

$1.915

100+ parts

$1.386

1k+ parts

$1.296

10k+ parts

-

2,165

$1.915

$1.386

$1.296

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Mouser Electronics

USA . 13,094 parts In-Stock

1+ parts

$3.630

100+ parts

$1.660

1k+ parts

$1.460

10k+ parts

$1.360

13,094

$3.630

$1.660

$1.460

$1.360

DigiKey

USA . 7,303 parts In-Stock

1+ parts

$3.630

100+ parts

$1.659

1k+ parts

$1.454

10k+ parts

$1.188

7,303

$3.630

$1.659

$1.454

$1.188

Verical

USA . 2,165 parts In-Stock

1+ parts

-

100+ parts

$1.386

1k+ parts

$1.296

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2,165

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$1.386

$1.296

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TTI

USA . 1,890 parts In-Stock

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1,890

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.463

100+ parts

-

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10

$1.463

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FDH Electronics

USA . 9 parts In-Stock

1+ parts

$5.513

100+ parts

$3.291

1k+ parts

$3.196

10k+ parts

$3.196

9

$5.513

$3.291

$3.196

$3.196

Chip Stock

USA . 34,122 parts In-Stock

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Vyrian

USA . 5,274 parts In-Stock

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5,274

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Zilex Electronics Inc.

Canada . 2 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 643 parts In-Stock

1+ parts

$0.579

100+ parts

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643

$0.579

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$1.434

100+ parts

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1k+ parts

$1.377

10k+ parts

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1,000

$1.434

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$1.377

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Argo Parts USA

USA . 4,849 parts In-Stock

1+ parts

$1.463

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4,849

$1.463

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Continental Prestige Electronics

USA . 33 parts In-Stock

1+ parts

$1.463

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$1.434

33

$1.463

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$1.434

Aztec Data Supply Inc.

USA . 703 parts In-Stock

1+ parts

$1.510

100+ parts

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703

$1.510

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Advanced Electronics

New Zealand . 83 parts In-Stock

1+ parts

$1.874

100+ parts

$1.705

1k+ parts

$1.537

10k+ parts

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83

$1.874

$1.705

$1.537

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Microchip USA

USA . 4,578 parts In-Stock

1+ parts

$8.753

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4,578

$8.753

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QUARKTWIN TECHNOLOGY LTD

USA . 23,882 parts In-Stock

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Perfect Parts

USA . 12,515 parts In-Stock

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12,515

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iodParts Technologies Inc.

India . 12,500 parts In-Stock

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12,500

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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9,000

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Kepictronics

USA . 942 parts In-Stock

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Metaverse IC Inc.

Canada . 198 parts In-Stock

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Overview

Discover the power of the SIR826DP-T1-GE3 by Vishay Intertechnology, a top-quality Power FET designed for switching applications. With a robust construction and cutting-edge technology, this N-CHANNEL transistor offers enhanced performance and reliability. From its high breakdown voltage to its low on-resistance, this transistor delivers unmatched efficiency and durability. Whether you're in automotive, industrial, or consumer electronics, the SIR826DP-T1-GE3 provides the perfect solution for your power management needs. Upgrade your systems with Vishay Intertechnology's superior components and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs often have lower on-resistance and higher efficiency compared to P-channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for faster switching times and helps protect the circuit from voltage spikes, enhancing the overall reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET delivers high performance and efficiency in controlling the flow of current.

Minimum DS Breakdown Voltage: 80 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown, ensuring safe and reliable operation in various circuits.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into circuit boards, optimizing space and layout in the design.

Maximum Pulsed Drain Current (IDM): 100 A

The high pulsed drain current rating enables this FET to handle short-term, high-current pulses without damage, making it ideal for demanding applications.

Avalanche Energy Rating (EAS): 61 mJ

The FET's ability to handle avalanche energy ensures reliable operation in high-energy transient conditions, making it suitable for rugged environments.

Maximum Drain Current (Abs) (ID): 60 A

With a high maximum drain current rating, this FET can safely handle continuous current flow, making it suitable for various power management applications.

Maximum Power Dissipation (Abs): 104 W

The high power dissipation rating allows the FET to handle high power levels without overheating, ensuring long-term reliability in demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds, low on-state resistance, and high efficiency, making it an ideal choice for power switching applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can perform reliably in high-temperature environments without compromising performance.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides good solderability and corrosion resistance, ensuring reliable electrical connections in various applications.

Maximum Drain-Source On Resistance: 0.0052 ohm

The low on-resistance of the FET results in minimal power dissipation and improved efficiency, making it suitable for high-current applications.

Technical Specifications

Power Field Effect Transistors (FET) SIR826DP-T1-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

61 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.0052 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-C5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

C BEND

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SIR826DP-T1-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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