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SI7234DP-T1-GE3

Vishay Intertechnology

SI7234DP-T1-GE3 by Vishay Intertechnology

Vishay Intertechnology's SI7234DP-T1-GE3 is an N-channel Power FET with 2 separate elements and built-in diode. It operates in enhancement mode for switching applications, offering a max pulsed drain current of 80A and a min DS breakdown voltage of 12V. Ideal for surface mount designs, it has a max power dissipation of 46W and can handle temperatures from -55 to 150°C.

Median Price

$1.743

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DigiKey

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$1.622

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Mouser Electronics

USA . 4,243 parts In-Stock

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$4.210

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$1.950

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$1.630

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$1.540

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$1.630

$1.540

Newark

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$4.700

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$2.440

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$2.120

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Farnell

UK . 13,094 parts In-Stock

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$1.961

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$1.493

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$1.468

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$1.468

Element14

Singapore . 13,094 parts In-Stock

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$1.525

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Arrow

USA . 6,000 parts In-Stock

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$1.347

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Verical

USA . 6,000 parts In-Stock

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$1.347

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Future Electronics

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$1.370

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Nova Conductors

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$1.888

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$1.888

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Chip Stock

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Vyrian

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North Shore Components

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NAC Semi

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Bristol Electronics

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Semicontronic

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$1.096

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Aztec Data Supply Inc.

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Continental Prestige Electronics

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$1.888

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$1.850

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$1.850

Netroflash

USA . 500 parts In-Stock

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$1.888

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$1.850

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Argo Parts USA

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Corohmni

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Overview

Discover the unparalleled performance and reliability of the Vishay Intertechnology SI7234DP-T1-GE3 Power FET. This N-CHANNEL transistor, with built-in diode, is perfect for switching applications, offering a maximum pulsed drain current of 80 A and a minimum DS breakdown voltage of 12 V. With a maximum power dissipation of 46 W, this transistor provides exceptional value and efficiency. Trust in Vishay Intertechnology's expertise in semiconductor technology and elevate your electronic designs with the SI7234DP-T1-GE3.

Feature Benefit Bullets

Polarity: N-CHANNEL

Provides efficient and reliable switching capabilities.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Offers versatile circuit design options with added protection.

Transistor Application: SWITCHING

Ideal for applications requiring high-speed switching.

Surface Mount: YES

Enables easy and compact PCB assembly.

Minimum DS Breakdown Voltage: 12 V

Ensures safe operation within specified voltage limits.

Package Shape: RECTANGULAR

Allows for space-efficient component placement on the board.

Terminal Form: C BEND

Simplifies connection to external circuits.

Operating Mode: ENHANCEMENT MODE

Enhances control over the transistor's conduction.

No. of Elements: 2

Provides redundancy and flexibility in circuit design.

Maximum Pulsed Drain Current (IDM): 80 A

Handles high transient loads effectively.

Maximum Drain Current (Abs) (ID): 60 A

Suits applications with moderate current requirements.

No. of Terminals: 6

Facilitates easy integration into circuit layouts.

Maximum Power Dissipation (Abs): 46 W

Handles heat dissipation efficiently for safe operation.

Package Style (Meter): SMALL OUTLINE

Offers a compact footprint for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides reliable performance and longevity.

Maximum Operating Temperature: 150 °C

Allows operation in high-temperature environments.

Transistor Element Material: SILICON

Ensures durability and stability in operation.

Minimum Operating Temperature: -55 °C

Suitable for use in extreme temperature conditions.

Terminal Finish: Matte Tin (Sn)

Ensures good electrical contact and corrosion resistance.

Maximum Drain Current (ID): 24.8 A

Supports applications with heavy current loads.

Maximum Drain-Source On Resistance: 0.005 ohm

Enables efficient current flow with minimal resistance.

Terminal Position: DUAL

Facilitates versatile circuit connections.

Case Connection: DRAIN

Simplifies connection to external components for efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes.

Technical Specifications

Power Field Effect Transistors (FET) SI7234DP-T1-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

24.8 A

Maximum Drain-Source On Resistance:

.005 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

C BEND

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SI7234DP-T1-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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