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GL12T-HG3-18

Vishay Intertechnology

GL12T-HG3-18 by Vishay Intertechnology

GL12T-HG3-18 by Vishay Intertechnology is a single avalanche diode with 300W peak power dissipation, 13.3V breakdown voltage, and 24V clamping voltage. Ideal for transient suppression in automotive electronics due to AEC-Q101 compliance and unidirectional polarity. Operates b/w -55°C to 150°C with matte tin finish and gull wing terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,672 parts In-Stock

1+ parts

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4,672

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Nova Conductors

Japan . 79 parts In-Stock

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79

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 320 parts In-Stock

1+ parts

$0.122

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320

$0.122

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Aztec Data Supply Inc.

USA . 2,936 parts In-Stock

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$0.175

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2,936

$0.175

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Ampacity Inc.

Singapore . 767 parts In-Stock

1+ parts

$2.010

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767

$2.010

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AZTECH Wire

Italy . 299 parts In-Stock

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$6.261

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299

$6.261

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Continental Prestige Electronics

USA . 2,274 parts In-Stock

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2,274

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Argo Parts USA

USA . 2,218 parts In-Stock

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2,218

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Overview

Elevate your electronic designs with the GL12T-HG3-18 from Vishay Intertechnology, a leading manufacturer known for top-quality transient suppression devices. Ideal for protecting sensitive components from voltage spikes, this product offers unmatched reliability and performance. Whether you're in the automotive, industrial, or consumer electronics industry, this device provides peace of mind with its advanced technology and robust construction. Trust Vishay Intertechnology to deliver superior products that exceed your expectations. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Config: SINGLE

Single configuration simplifies installation and reduces complexity in circuit design.

Surface Mount: YES

Surface mount capability allows for easy integration into PCB assemblies.

Maximum Non Repetitive Peak Reverse Power Dissipation: 300 W

High power dissipation capability provides protection against transient surges and spikes.

Nominal Breakdown Voltage: 13.3 V

Stable breakdown voltage ensures consistent performance in protecting sensitive components.

Package Shape: RECTANGULAR

Rectangular shape facilitates efficient placement and mounting on PCBs.

No. of Terminals: 3

Having 3 terminals allows for easy connection and integration into circuits.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in saving space and enabling compact designs.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -55 °C

Wide range of operating temperature makes it suitable for use in extreme environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and conductivity for reliable connections.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in mounting and connection options.

Minimum Breakdown Voltage: 13.3 V

Consistent minimum breakdown voltage ensures reliable protection against voltage surges.

Maximum Breakdown Voltage: 17.2 V

High maximum breakdown voltage provides added protection for sensitive components.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures high reliability and quality for automotive applications.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Trans voltage suppressor diode type offers efficient protection against voltage spikes and surges.

Technology: AVALANCHE

Avalanche technology provides fast response time and high energy handling capability.

Terminal Form: GULL WING

Gull wing terminal form allows for easy surface mounting and secure solder connection.

Maximum Repetitive Peak Reverse Voltage: 12 V

High maximum repetitive peak reverse voltage ensures robust protection for components.

Polarity: UNIDIRECTIONAL

Unidirectional polarity ensures protection in one direction, making it ideal for specific applications.

Maximum Clamping Voltage: 24 V

Maximum clamping voltage of 24 V offers effective protection against transient voltage spikes.

Diode Element Material: SILICON

Silicon diode element material ensures high reliability and efficiency in energy absorption.

Technical Specifications

Transient Suppression Devices GL12T-HG3-18 attributes and parameters. Explore more Transient Suppression Devices devices from Vishay Intertechnology

Specs

Maximum Breakdown Voltage:

17.2 V

Minimum Breakdown Voltage:

13.3 V

Nominal Breakdown Voltage:

13.3 V

Maximum Clamping Voltage:

24 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

300 W

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Polarity:

UNIDIRECTIONAL

Reference Standard:

AEC-Q101

Maximum Repetitive Peak Reverse Voltage:

12 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

GL12T-HG3-18 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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