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2N4416-E3

Vishay Intertechnology

2N4416-E3 by Vishay Intertechnology

2N4416-E3 by Vishay Intertechnology is an N-CHANNEL FET with 10 dB Gp, operating in DEPLETION MODE. It operates in ULTRA HIGH FREQUENCY BAND for SWITCHING applications. With a max power dissipation of 0.3 W and Crss of 0.8 pF, it's ideal for RF circuits requiring high frequency performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,014 parts In-Stock

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7,014

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VNN

France . 3,440 parts In-Stock

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3,440

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Nova Conductors

Japan . 300 parts In-Stock

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300

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ES Components

USA . 195 parts In-Stock

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195

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,265 parts In-Stock

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$14.050

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1,265

$14.050

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AZTECH Wire

Italy . 870 parts In-Stock

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$16.945

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870

$16.945

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Perfect Parts

USA . 86 parts In-Stock

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Overview

Discover the power and precision of the 2N4416-E3 by Vishay Intertechnology, a leading name in electronic components. This RF small signal FET offers superior performance in switching applications, providing customers with reliability and efficiency. With its N-channel configuration and ultra-high frequency band capability, this transistor is a game-changer for your projects. Trust Vishay Intertechnology to deliver quality and innovation, and elevate your designs with the 2N4416-E3.

Feature Benefit Bullets

Package Body Material: METAL

The use of metal as the package body material ensures good heat dissipation, allowing the transistor to operate efficiently even at high temperatures.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have higher electron mobility, making them suitable for high-frequency applications such as switching.

Configuration: SINGLE

Single configuration transistors are easier to design with and have predictable behavior, making them reliable for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low power consumption.

Minimum Power Gain (Gp): 10 dB

With a minimum power gain of 10 dB, this transistor provides sufficient amplification for various applications while maintaining signal integrity.

Package Shape: ROUND

The round package shape allows for easy integration into circuit designs and provides consistent performance.

Terminal Form: WIRE

Wire terminals facilitate quick and secure connections, reducing assembly time and ensuring reliable operation.

Operating Mode: DEPLETION MODE

Depletion mode operation enables precise control over the transistor's conductivity, making it ideal for high-frequency switching applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra high-frequency band applications, this transistor offers excellent performance in demanding RF circuits.

No. of Terminals: 4

With 4 terminals, this transistor provides flexibility in circuit connections and allows for efficient signal routing.

Maximum Power Dissipation (Abs): 0.3 W

With a maximum power dissipation of 0.3W, this transistor can handle higher power levels without overheating or performance degradation.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers a compact and space-saving design, making it suitable for applications with limited board space.

Field Effect Transistor Technology: JUNCTION

Junction FET technology provides high gain and low noise performance, making this transistor ideal for RF applications that require precise signal amplification.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high-temperature environments and maintain stable performance.

Transistor Element Material: SILICON

Silicon is widely used in transistors for its high electron mobility and reliability, ensuring consistent performance over a wide range of operating conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides a reliable electrical connection and corrosion resistance, ensuring long-term performance and reliability.

Terminal Position: BOTTOM

Bottom terminal position allows for easy mounting and soldering on PCBs, simplifying assembly and ensuring proper alignment in the circuit layout.

Maximum Feedback Capacitance (Crss): 0.8 pF

With a maximum feedback capacitance of 0.8 pF, this transistor minimizes signal distortion and ensures efficient signal amplification in RF applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) 2N4416-E3 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Additional Features:

LOW NOISE

Configuration:

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

.8 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-206AF

JESD-30 Code:

O-MBCY-W4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Minimum Power Gain (Gp):

10 dB

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

WIRE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2N4416-E3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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