Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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INFRARED LED; Mounting Feature: THROUGH HOLE MOUNT; Semiconductor Material: GaAs; Configuration: SINGLE; Peak Wavelength (nm): 945; Minimum Operating Temperature: -25 Cel;
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Infrared LEDs TLN119(F) attributes and parameters. Explore more Infrared LEDs devices from Toshiba
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TLN119(F) Optoelectronics trade compliance attributes, and parameters.
HTS
8541.40.20.00
SB
TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.
LL4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Dc Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
Secos
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32H743IIT6
STMicroelectronics
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
2N2222A
Swampscott Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Vishay Intertechnology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
261
Deltrol Controls
Other Relays;
Hitano Enterprise
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
Lite-on Semiconductor
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-XSFM-T3; Minimum Input-Output Voltage Differential: 3 V;
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Minimum DS Breakdown Voltage: 50 V; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
LD275
Infineon Technologies
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Viewing Angle: 36 deg; Spectral Bandwidth: 55 m; Maximum Operating Temperature: 100 Cel;
LD261-4
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Spectral Bandwidth: 55 m; Peak Wavelength (nm): 950; Viewing Angle: 60 deg; Semiconductor Material: GaAs;
HE7601SG
Renesas Electronics
INFRARED LED; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Forward Voltage: 2.5 V; Maximum Operating Temperature: 60 Cel; Maximum Forward Current: .25 A;
TLN104(B,F)
Toshiba
Infrared LEDs; Mounting Feature: SURFACE MOUNT; Maximum Forward Current: .04 A; Peak Wavelength (nm): 940; Semiconductor Material: GaAs; Minimum Operating Temperature: -25 Cel;
QEE123
QEE123 by Onsemi is a single configuration infrared LED with a size of 1.65 mm. It has a max forward current of 0.05 A and operates at temperatures ranging from -40 to 100 °C. This LED is commonly used in applications such as remote controls, security systems, and proximity sensors.
SFH4010
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Spectral Bandwidth: 40 m; Semiconductor Material: GaAs; Maximum Reverse Voltage: 1 V;
TLN231(F)
INFRARED LED; Mounting Feature: THROUGH HOLE MOUNT; Peak Wavelength (nm): 870; Nominal Output Power: 30 W; Configuration: SINGLE; Maximum Operating Temperature: 85 Cel;
OP224
Optek Technology
INFRARED LED; Mounting Feature: SURFACE MOUNT; Spectral Bandwidth: 80 m; Maximum Reverse Voltage: 2 V; Peak Wavelength (nm): 890; Configuration: SINGLE;
QED122
The Onsemi QED122 is a single infrared LED with peak wavelength of 890nm. It has a max forward current of 0.1A and operates b/w -40 °C to 100°C. Ideal for applications requiring IR illumination in a compact 4.95mm round package with radial mount feature.
LD271L
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Peak Wavelength (nm): 950; Additional Features: HIGH RELIABILITY; No. of Functions: 1; Shape: ROUND;
SLR960A
SLR960A by Onsemi is an Infrared LED with 0.1A forward current, 945nm peak wavelength, and 80 °C max operating temp. Ideal for applications requiring IR illumination in environments ranging from -25°C to 80°C.
QEB363GR
INFRARED LED; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Configuration: SINGLE; Peak Wavelength (nm): 940; Maximum Forward Current: .05 A;
TIES494
Texas Instruments
TIES494 by Texas Instruments is an Infrared LED with peak wavelength of 860nm, forward current of 0.06A, and response time of 0.00000002s. Ideal for applications requiring precise infrared illumination in a temperature range from -40°C to 85°C.
TSML1030
Vishay Intertechnology's TSML1030 is a 1.9mm INFRARED LED with peak wavelength of 940nm, forward current of 0.1A, and forward voltage of 2.2V. Ideal for applications requiring a viewing angle of 24°, spectral bandwidth of 30m, and operating temperatures from -40 to 85 °C.
SLR732AV60
SLR732AV60 by Onsemi is an Infrared LED with 0.1A max forward current, 850nm peak wavelength, and 80 °C max operating temp. Ideal for applications requiring IR illumination in a 20° viewing angle.
SFH485P
SFH485P by Infineon Technologies is an Infrared LED with peak wavelength of 880nm, forward current of 0.1A, and viewing angle of 80°. It operates b/w -55°C to 100°C, ideal for applications requiring fast response time such as proximity sensors and optical switches.
VSLY5940
Vishay Intertechnology's VSLY5940 is a 5mm INFRARED LED with peak wavelength of 940nm. It has a max forward current of 0.1A and viewing angle of 6°. Ideal for applications requiring precise infrared illumination in a compact form factor, such as optical sensors and proximity detectors.
SFH477E7500
INFRARED LED; Peak Wavelength (nm): 880; Minimum Operating Temperature: -55 Cel; Shape: ROUND; Additional Features: HIGH RELIABILITY; Maximum Forward Current: .1 A;
SLR963A
SLR963A by Onsemi is an Infrared LED with 0.1A max forward current, peak wavelength of 945nm, and 5V max reverse voltage. Ideal for surface mount applications in temperature range -25 °C to 80°C.
LTE-302-M
Lite-on Technology
Lite-on Technology's LTE-302-M is a 1.5mm ROUND INFRARED LED with peak wavelength of 940nm and max forward current of 0.05A. Ideal for applications requiring IR light emission, it operates b/w -40 to 85°C making it suitable for various optoelectronic projects.
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TLN107A-A
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Shape: ROUND; Size: 1.5 mm; No. of Functions: 1; Maximum Forward Current: .05 A;
TLN104(B,LB,F)
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Maximum Forward Voltage: 1.35 V; Spectral Bandwidth: 50 m; Maximum Reverse Voltage: 5 V; Maximum Operating Temperature: 85 Cel;
TLN103
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Forward Current: .04 A; Peak Wavelength (nm): 950; Maximum Operating Temperature: 75 Cel;
TLN105B(F)
INFRARED LED; Mounting Feature: THROUGH HOLE MOUNT; Minimum Operating Temperature: -25 Cel; Nominal Output Power: 11 W; Maximum Reverse Voltage: 5 V; Viewing Angle: 47 deg;
TLN104(LB)
INFRARED LED; Peak Wavelength (nm): 940; Maximum Operating Temperature: 85 Cel; Configuration: SINGLE; Size: 1.6 mm; Maximum Forward Current: .04 A;
TLN107A-B
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); No. of Functions: 1; JESD-609 Code: e0; Nominal Output Power: 2.5 W; Peak Wavelength (nm): 940;
TLN101A-C
INFRARED LED; Size: 4.675 mm; Shape: ROUND; Maximum Forward Current: .1 A; Nominal Output Power: 1.5 W; Additional Features: HIGH RELIABILITY;
TLN104(F)
Infrared LEDs; Mounting Feature: SURFACE MOUNT; Maximum Forward Voltage: 1.35 V; Maximum Reverse Voltage: 5 V; Maximum Operating Temperature: 85 Cel; Viewing Angle: 40 deg;
TLN103A
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); No. of Functions: 1; Peak Wavelength (nm): 940; Maximum Forward Current: .06 A; Maximum Operating Temperature: 75 Cel;
TLN105B
INFRARED LED; Size: 5 mm; Maximum Forward Current: .1 A; No. of Functions: 1; Minimum Operating Temperature: -25 Cel; Nominal Output Power: 11 W;
TLN104(LB,F)
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Peak Wavelength (nm): 940; Maximum Forward Current: .04 A; Maximum Reverse Voltage: 5 V; Maximum Forward Voltage: 1.35 V;
TLN104(B)
INFRARED LED; Minimum Operating Temperature: -25 Cel; Configuration: SINGLE; Maximum Forward Current: .04 A; Nominal Output Power: 2.5 W; Peak Wavelength (nm): 940;
TLN107A
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Size: 1.5 mm; Maximum Forward Current: .05 A; Configuration: SINGLE; Maximum Operating Temperature: 85 Cel;
TLN102(F)
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Forward Current: .1 A; Semiconductor Material: GaAs; Spectral Bandwidth: 50 m;
TLN104(B,LB)
INFRARED LED; No. of Functions: 1; Maximum Operating Temperature: 85 Cel; Maximum Forward Current: .04 A; Minimum Operating Temperature: -25 Cel; Peak Wavelength (nm): 940;
TLN101A
INFRARED LED; Additional Features: HIGH RELIABILITY; No. of Functions: 1; Size: 4.675 mm; Peak Wavelength (nm): 940; Nominal Output Power: 1.5 W;
TLN102
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Minimum Operating Temperature: -40 Cel; Size: 4.7 mm; Maximum Forward Current: .1 A; Peak Wavelength (nm): 940;
TLN104
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -25 Cel; JESD-609 Code: e0; Maximum Forward Current: .04 A;
TLN105A
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Spectral Bandwidth: 50 m; Maximum Forward Current: .1 A; Maximum Forward Voltage: 1.5 V;
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