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SSM3J351R,LXHF

Toshiba

SSM3J351R,LXHF by Toshiba

Toshiba SSM3J351R,LXHF is a P-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 14A IDM, and 0.184 ohm Drain-Source Resistance. Ideal for power management in automotive electronics due to AEC-Q101 compliance and 150°C operating temperature.

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ComSIT Distribution GmbH

Germany . 15,750 parts In-Stock

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Vyrian

USA . 11,330 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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Advanced Electronics

New Zealand . 650 parts In-Stock

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$0.458

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$0.435

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Aztec Data Supply Inc.

USA . 3,920 parts In-Stock

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$0.462

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Semicontronic

India . 11,592 parts In-Stock

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$0.520

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$0.507

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$0.504

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Ampacity Inc.

Singapore . 11,184 parts In-Stock

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Corohmni

South Africa . 425 parts In-Stock

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$0.892

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QUARKTWIN TECHNOLOGY LTD

USA . 5,816 parts In-Stock

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Continental Prestige Electronics

USA . 2,438 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 51 parts In-Stock

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Overview

Unleash the power of Toshiba's SSM3J351R,LXHF P-CHANNEL Power Field Effect Transistor (FET) for all your switching needs. With a 60V minimum breakdown voltage and 14A maximum pulsed drain current, this single configuration transistor offers top-notch performance in a small outline package. Perfect for applications requiring high efficiency and reliability, this enhancement mode transistor is a game-changer. Trust Toshiba's reputation for quality and innovation to deliver unmatched value with this cutting-edge semiconductor technology. Elevate your projects with the SSM3J351R,LXHF and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and reliability for long-term use.

Polarity or Channel Type: P-CHANNEL

The P-channel type allows for efficient operation and precise control in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and ensures smooth operation.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltage levels without damage.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB.

Terminal Form: FLAT

The flat terminal form provides a secure connection and ease of soldering.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation ensures low power consumption and reduced heat generation.

Maximum Pulsed Drain Current (IDM): 14 A

With a high pulsed drain current rating, this FET can handle high current spikes without issues.

Avalanche Energy Rating (EAS): 8.9 mJ

The high avalanche energy rating ensures reliability under high-stress conditions.

No. of Terminals: 3

The three terminals provide easy connectivity in a circuit.

Maximum Power Dissipation (Abs): 1 W

The 1W power dissipation rating ensures good thermal performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes it suitable for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology ensures high efficiency and performance in various applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, the FET can handle high-temperature environments.

Transistor Element Material: SILICON

Silicon material provides stable and reliable performance in different operating conditions.

Maximum Drain Current (ID): 3.5 A

With a high drain current rating, this FET can handle high current flow with ease.

Maximum Drain-Source On Resistance: 0.184 ohm

The low on-resistance ensures minimal power loss and efficient operation.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit design and installation.

Maximum Feedback Capacitance (Crss): 50 pF

The low feedback capacitance ensures improved performance and stability in high-frequency applications.

Reference Standard: AEC-Q101

Complies with the AEC-Q101 standard, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) SSM3J351R,LXHF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Toshiba

Specs

Avalanche Energy Rating (EAS):

8.9 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

3.5 A

Maximum Drain-Source On Resistance:

.184 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

50 pF

JESD-30 Code:

R-PDSO-F3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Maximum Pulsed Drain Current (IDM):

14 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SSM3J351R,LXHF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Toshiba

TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.

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