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V62/08624-01XE

Texas Instruments

V62/08624-01XE by Texas Instruments

V62/08624-01XE by Texas Instruments is a Motion Control IC with 12V supply voltage, 28 terminals, and MILITARY temperature grade. It is used as a BRUSHLESS DC MOTOR CONTROLLER in applications requiring precise motion control at temperatures ranging from -55 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,263 parts In-Stock

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Digiode

USA . 1,975 parts In-Stock

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1,975

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Distributors (Availability)

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Semicontronic

India . 1,036 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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-

1,036

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 1,314 parts In-Stock

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$2.500

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1,314

$2.500

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One Stop Electronics

USA . 820 parts In-Stock

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$5.500

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820

$5.500

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Parana Technologies

USA . 1,191 parts In-Stock

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$7.857

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$8.413

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1,191

$7.857

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$8.413

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DigiPath Technology Company

USA . 291 parts In-Stock

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$8.651

100+ parts

$7.959

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291

$8.651

$7.959

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ChromeModa Solutions

Germany . 1,847 parts In-Stock

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$8.828

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$7.239

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1,847

$8.828

$7.239

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IDEA Electronic Components Group

UK . 1,693 parts In-Stock

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$8.828

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$8.387

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$7.945

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1,693

$8.828

$8.387

$7.945

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AZTECH Wire

Italy . 327 parts In-Stock

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$15.913

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327

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Corphita

USA . 3,787 parts In-Stock

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3,787

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Corohmni

South Africa . 429 parts In-Stock

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Overview

Unlock precision and reliability with the V62/08624-01XE by Texas Instruments. Designed for motion control applications, this top-tier Brushless DC Motor Controller boasts superior quality and performance. With Texas Instruments' trusted reputation in the industry, customers can expect nothing but excellence. From its durable package body material to its wide temperature range, this IC offers unmatched value and benefits. Elevate your projects with the V62/08624-01XE and experience the difference of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and less prone to damage during handling or operation.

Nominal Supply Voltage (Vsup) 12 V

Having a nominal supply voltage of 12V ensures compatibility with common power sources and allows for stable operation.

Maximum Operating Temperature 125 °C

The high maximum operating temperature of 125°C indicates robust performance capabilities and reliability even in demanding environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of Nickel Palladium Gold provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the product.

Width (mm) 15.24 mm

The compact width of 15.24mm allows for space-saving installation in tight or limited areas, making it suitable for various applications.

Minimum Supply Voltage (Vsup) 10 V

The minimum supply voltage of 10V ensures compatibility with low power sources, offering flexibility in power input options.

Temperature Grade MILITARY

The military-grade temperature tolerance ensures reliable operation in extreme conditions, making it suitable for use in rugged environments or critical applications.

Maximum Supply Current (Isup) 30 mA

With a maximum supply current of 30mA, the product operates efficiently and consumes minimal power, making it energy-efficient and cost-effective.

Maximum Output Current 0.01 A

The maximum output current of 0.01A allows for driving various components or devices with sufficient power, enhancing the product's versatility and application possibilities.

Technical Specifications

Motion Control ICs V62/08624-01XE attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e4

Length:

36.32 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

.01 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

30 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

15.24 mm

Trade Compliance

V62/08624-01XE Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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