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UCC37324DGN

Texas Instruments

UCC37324DGN by Texas Instruments

UCC37324DGN by Texas Instruments is a MOSFET gate driver with 2 channels, operating at 4.5-15V. It has a small outline package, suitable for commercial applications requiring true output polarity and peak current limit of 4A. With fast turn-on/off times of 0.04/0.05 us, it is ideal for high-speed buffer or inverter-based MOSFET driving in various electronic systems.

Median Price

$1.800

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 192 parts In-Stock

1+ parts

$1.800

100+ parts

$1.086

1k+ parts

$1.034

10k+ parts

-

192

$1.800

$1.086

$1.034

-

Mouser Electronics

USA . 132 parts In-Stock

1+ parts

$1.880

100+ parts

$1.350

1k+ parts

$1.110

10k+ parts

$0.816

132

$1.880

$1.350

$1.110

$0.816

Chip1Stop

Japan . 240 parts In-Stock

1+ parts

$5.790

100+ parts

$2.710

1k+ parts

-

10k+ parts

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240

$5.790

$2.710

-

-

Rochester

USA . 107,292 parts In-Stock

1+ parts

-

100+ parts

$1.380

1k+ parts

$1.150

10k+ parts

$1.020

107,292

-

$1.380

$1.150

$1.020

Verical

USA . 65,020 parts In-Stock

1+ parts

-

100+ parts

-

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$1.438

10k+ parts

$1.275

65,020

-

-

$1.438

$1.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,278 parts In-Stock

1+ parts

$0.831

100+ parts

-

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-

10k+ parts

-

3,278

$0.831

-

-

-

Bristol Electronics

USA . 17 parts In-Stock

1+ parts

$2.030

100+ parts

-

1k+ parts

-

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17

$2.030

-

-

-

TME

Poland . 228 parts In-Stock

1+ parts

$2.110

100+ parts

$1.510

1k+ parts

-

10k+ parts

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228

$2.110

$1.510

-

-

Chip Stock

USA . 6,610 parts In-Stock

1+ parts

-

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-

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6,610

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Sensible Micro Corp

USA . 6,249 parts In-Stock

1+ parts

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6,249

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Vyrian

USA . 3,469 parts In-Stock

1+ parts

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3,469

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Lantek

USA . 160 parts In-Stock

1+ parts

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160

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ACDS - Activité Composants Distribution Service

France . 17 parts In-Stock

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17

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Dan-Mar Components

USA . 17 parts In-Stock

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17

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,097 parts In-Stock

1+ parts

$0.788

100+ parts

-

1k+ parts

-

10k+ parts

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4,097

$0.788

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-

-

Parana Technologies

USA . 335 parts In-Stock

1+ parts

$7.003

100+ parts

-

1k+ parts

$7.565

10k+ parts

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335

$7.003

-

$7.565

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ChromeModa Solutions

Germany . 3,001 parts In-Stock

1+ parts

$7.868

100+ parts

$6.452

1k+ parts

-

10k+ parts

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3,001

$7.868

$6.452

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IDEA Electronic Components Group

UK . 1,910 parts In-Stock

1+ parts

$7.868

100+ parts

-

1k+ parts

$7.081

10k+ parts

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1,910

$7.868

-

$7.081

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Microchip USA

USA . 2,548 parts In-Stock

1+ parts

$39.850

100+ parts

$39.280

1k+ parts

$39.000

10k+ parts

$38.710

2,548

$39.850

$39.280

$39.000

$38.710

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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DigiPath Technology Company

USA . 1,517 parts In-Stock

1+ parts

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100+ parts

$7.094

1k+ parts

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10k+ parts

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1,517

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$7.094

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Lixinc

USA . 751 parts In-Stock

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751

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Perfect Parts

USA . 700 parts In-Stock

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700

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GreenTree Electronics

Israel . 160 parts In-Stock

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160

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Kepictronics

USA . 96 parts In-Stock

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96

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Overview

Enhance the performance of your MOSFET applications with the UCC37324DGN by Texas Instruments. With a reputation for high-quality products, Texas Instruments delivers reliable solutions for your circuit needs. This MOSFET gate driver offers exceptional value, providing precise and efficient control over your power supplies. Whether you're working on motor drives, DC-DC converters, or power inverters, this compact and versatile driver is sure to optimize your design. Trust in Texas Instruments to elevate your projects with cutting-edge technology and superior performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring reliability and durability.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 15 V

Can handle high voltage requirements, making it suitable for a wide range of applications.

No. of Functions: 2

Offers versatility in functionality, allowing for multiple functions to be performed within the same device.

Package Shape: SQUARE

Provides a compact form factor, ideal for applications where space is limited.

Power Supplies (V): 4.5/15

Supports a range of power supply voltages, providing flexibility in design and compatibility with different systems.

No. of Terminals: 8

Sufficient number of terminals for connecting the device to other components, ensuring proper functionality.

Minimum Supply Voltage: 4.5 V

Can operate at low supply voltages, conserving power and extending battery life in portable devices.

Maximum Operating Temperature: 70 °C

Can withstand high operating temperatures, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: 0 °C

Can operate in cold environments without performance degradation, ensuring reliability in various conditions.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Provides good conductivity and corrosion resistance, ensuring stable connections over time.

Maximum Output Current: 4 A

Can deliver high output currents, suitable for driving power MOSFETs in demanding applications.

No. of Channels: 2

Supports multiple channels, allowing for control of different MOSFETs or devices independently.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies, offering high performance and efficiency.

Maximum Supply Current: 0.75 mA

Consumes low current during operation, contributing to energy efficiency and reducing heat dissipation.

Nominal Supply Voltage: 14 V

Optimal supply voltage for stable and efficient operation, maximizing performance over a wide range of conditions.

Turn-on Time: 0.04 us

Fast turn-on time ensures quick response and precise control of the MOSFET, improving overall system performance.

Turn-off Time: 0.05 us

Fast turn-off time minimizes switching losses and improves efficiency in high-frequency applications.

Technical Specifications

MOSFET Gate Drivers UCC37324DGN attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

High Side Driver:

NO

Input Characteristics:

STANDARD

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

4 A

Nominal Output Peak Current Limit:

4 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Current:

.75 mA

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

.05 us

Turn-on Time:

.04 us

Width:

3 mm

Trade Compliance

UCC37324DGN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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