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UCC2972APW

Texas Instruments

UCC2972APW by Texas Instruments

UCC2972APW by Texas Instruments is a BICMOS technology IC with 8 terminals, operating from -40 to 85°C. It's a VFD driver with supply voltage range of 4.5-25V, suitable for industrial applications like graphics display drivers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,823 parts In-Stock

1+ parts

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4,823

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Vyrian

USA . 2,563 parts In-Stock

1+ parts

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2,563

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,300 parts In-Stock

1+ parts

$6.744

100+ parts

-

1k+ parts

$7.418

10k+ parts

-

2,300

$6.744

-

$7.418

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AZTECH Wire

Italy . 747 parts In-Stock

1+ parts

$7.411

100+ parts

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747

$7.411

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DigiPath Technology Company

USA . 32 parts In-Stock

1+ parts

$7.425

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32

$7.425

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IDEA Electronic Components Group

UK . 1,417 parts In-Stock

1+ parts

$7.577

100+ parts

-

1k+ parts

$6.819

10k+ parts

-

1,417

$7.577

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$6.819

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ChromeModa Solutions

Germany . 745 parts In-Stock

1+ parts

$7.577

100+ parts

$6.213

1k+ parts

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745

$7.577

$6.213

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One Stop Electronics

USA . 1,203 parts In-Stock

1+ parts

$12.500

100+ parts

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1,203

$12.500

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Corphita

USA . 534 parts In-Stock

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534

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Overview

Upgrade your display driver capabilities with the UCC2972APW from Texas Instruments. Designed with precision and reliability in mind, this graphics display driver offers unmatched performance for a wide range of applications. With its advanced technology and industrial-grade temperature tolerance, this product ensures seamless operation even in the most demanding environments. Experience the value and benefits of enhanced display control with the UCC2972APW, setting a new standard in display driver excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and helps protect the internal components of the display driver.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly onto printed circuit boards, saving time and effort during production.

Maximum Supply Voltage: 25 V

The high maximum supply voltage of 25 V allows for versatility in power supply options, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular package shape is a common and standardized form factor that makes it easy to integrate the display driver into existing designs or circuits.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for interfacing with the display and other components, allowing for versatile display control.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board and in the overall device design, making it suitable for compact and slim applications.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5 V ensures compatibility with a wide range of power sources, enhancing the flexibility of the display driver.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the display driver can reliably operate in demanding industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the display driver can function effectively in cold climates or refrigerated environments.

Terminal Position: DUAL

Dual terminal position facilitates easy connection and integration into the circuit, ensuring secure and stable electrical connections for optimal display performance.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh and demanding conditions, making the display driver suitable for a wide range of applications.

Technology: BICMOS

BICMOS technology offers a blend of the advantages of both bipolar and CMOS technologies, providing high performance, low power consumption, and reliability in the display driver.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and connection to the circuit board, ensuring a strong and reliable electrical connection for stable display operation.

Nominal Supply Voltage: 12 V

The nominal supply voltage of 12V is a common and widely supported power requirement, making it easy to integrate the display driver into various systems and applications.

Interface IC Type: VACUUM FLUORESCENT DISPLAY DRIVER

The interface IC type specifically designed for vacuum fluorescent display drivers ensures optimal compatibility and performance with VFD displays, providing high-quality display output.

Technical Specifications

Graphics Display Drivers UCC2972APW attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Supply Voltage:

25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

UCC2972APW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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