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UCC2972AN

Texas Instruments

UCC2972AN by Texas Instruments

UCC2972AN by Texas Instruments is a BICMOS technology IC with 8 terminals, operating from -40 to 85 °C. It has a supply voltage range of 4.5V to 25V and is designed for Vacuum Fluorescent Display drivers in industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,553 parts In-Stock

1+ parts

-

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2,553

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Digiode

USA . 239 parts In-Stock

1+ parts

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239

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,584 parts In-Stock

1+ parts

$3.377

100+ parts

$313.574

1k+ parts

$3.039

10k+ parts

-

1,584

$3.377

$313.574

$3.039

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DigiPath Technology Company

USA . 1,992 parts In-Stock

1+ parts

$3.718

100+ parts

$3.421

1k+ parts

-

10k+ parts

-

1,992

$3.718

$3.421

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ChromeModa Solutions

Germany . 6,405 parts In-Stock

1+ parts

$3.794

100+ parts

$3.111

1k+ parts

-

10k+ parts

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6,405

$3.794

$3.111

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IDEA Electronic Components Group

UK . 919 parts In-Stock

1+ parts

$3.794

100+ parts

-

1k+ parts

$3.415

10k+ parts

-

919

$3.794

-

$3.415

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AZTECH Wire

Italy . 489 parts In-Stock

1+ parts

$6.988

100+ parts

-

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10k+ parts

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489

$6.988

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One Stop Electronics

USA . 791 parts In-Stock

1+ parts

$10.500

100+ parts

-

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791

$10.500

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Corphita

USA . 2,166 parts In-Stock

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2,166

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Overview

Unlock the power of your display with the UCC2972AN by Texas Instruments. Crafted with precision and expertise, this graphics display driver offers unparalleled quality and reliability. From industrial applications to consumer electronics, this versatile product delivers superior performance and efficiency. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations. Experience the value and benefits of the UCC2972AN, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the display driver, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 25 V

With a high maximum supply voltage of 25V, this display driver can handle a wide range of input voltages, making it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to mount and integrate into different electronic systems efficiently.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and interfaces, enabling the driver to control various display functions effectively.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this display driver is suitable for use in extreme cold environments without compromising performance.

Nominal Supply Voltage: 12 V

The nominal supply voltage of 12V provides stable power to the display driver, ensuring consistent performance and reliable operation.

Interface IC Type: VACUUM FLUORESCENT DISPLAY DRIVER

The use of vacuum fluorescent display driver technology enhances the display quality and visibility, making it an ideal choice for applications requiring clear and bright visuals.

Technical Specifications

Graphics Display Drivers UCC2972AN attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Supply Voltage:

25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

UCC2972AN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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