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UCC27423DRG4

Texas Instruments

UCC27423DRG4 by Texas Instruments

UCC27423DRG4 by Texas Instruments is a MOSFET gate driver with 2 functions, operating at supply voltages of 4.5-15V. It features totem-pole output characteristics and turn-on/off times of 0.04/0.05 us, suitable for industrial applications requiring high-speed switching and precise control in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,687 parts In-Stock

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Digiode

USA . 3,077 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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AZTECH Wire

Italy . 344 parts In-Stock

1+ parts

$7.522

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344

$7.522

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Parana Technologies

USA . 918 parts In-Stock

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$7.960

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$739.222

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$7.164

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918

$7.960

$739.222

$7.164

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DigiPath Technology Company

USA . 1,340 parts In-Stock

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$8.765

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$8.064

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1,340

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$8.064

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IDEA Electronic Components Group

UK . 1,428 parts In-Stock

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$8.944

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$8.497

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$8.050

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1,428

$8.944

$8.497

$8.050

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ChromeModa Solutions

Germany . 305 parts In-Stock

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$8.944

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$7.334

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305

$8.944

$7.334

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Ampacity Inc.

Singapore . 1,125 parts In-Stock

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$12.500

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One Stop Electronics

USA . 500 parts In-Stock

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$47.500

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$47.500

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Microchip USA

USA . 3,372 parts In-Stock

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Corphita

USA . 2,847 parts In-Stock

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Assy Fe

Spain . 1,026 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Enhance your power management system with the reliable UCC27423DRG4 MOSFET Gate Driver by Texas Instruments. With a cutting-edge technology and industrial-grade quality, this product offers customers unmatched performance and efficiency. Perfect for a wide range of applications, this driver ensures seamless operation and precise control. Experience the superior value and benefits that Texas Instruments brings to the table with the UCC27423DRG4 - the ultimate solution for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and resistance to external elements, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 15 V

Supports a high maximum supply voltage, allowing for compatibility with a wide range of applications and systems.

No. of Functions: 2

Having multiple functions in one device reduces the need for additional components, simplifying circuit design and reducing costs.

Package Shape: RECTANGULAR

Rectangular shape offers a compact form factor, making it easy to integrate into existing designs and saving space on the PCB.

Power Supplies (V): 4.5/15

Supports a wide range of power supply voltages, providing flexibility in system design.

No. of Terminals: 8

Having multiple terminals allows for versatile connections and configurations in the circuit.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance in harsh environments or under heavy loads.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Width: 3.9 mm

Narrow width makes the product suitable for applications with space constraints or tight PCB layouts.

Output Polarity: INVERTED

Inverted output polarity is suitable for certain applications where an inverted signal is required.

Technology: BICMOS

BICMOS technology offers a combination of bipolar and CMOS advantages, providing high performance and efficiency.

Technical Specifications

MOSFET Gate Drivers UCC27423DRG4 attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

High Side Driver:

NO

Input Characteristics:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Nominal Output Peak Current Limit:

4 A

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Current:

1.35 mA

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.05 us

Turn-on Time:

.04 us

Width:

3.9 mm

Trade Compliance

UCC27423DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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