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UCC27322MDEP

Texas Instruments

UCC27322MDEP by Texas Instruments

UCC27322MDEP by Texas Instruments is a MOSFET gate driver with 8 terminals, operating voltage of 4.5-15V, and max output current of 9A. It is designed for military-grade applications requiring a small outline package style and half bridge based MOSFET driver interface IC type. With a temperature range from -55 to 125°C, it offers reliable performance in harsh environments.

Median Price

$12.960

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 89 parts In-Stock

1+ parts

$12.960

100+ parts

$8.871

1k+ parts

$8.141

10k+ parts

$7.964

89

$12.960

$8.871

$8.141

$7.964

Mouser Electronics

USA . 68 parts In-Stock

1+ parts

$13.120

100+ parts

$8.770

1k+ parts

$8.170

10k+ parts

-

68

$13.120

$8.770

$8.170

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Rochester

USA . 32 parts In-Stock

1+ parts

-

100+ parts

$5.920

1k+ parts

$5.300

10k+ parts

$4.980

32

-

$5.920

$5.300

$4.980

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 972 parts In-Stock

1+ parts

$5.681

100+ parts

-

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972

$5.681

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-

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Vyrian

USA . 4,899 parts In-Stock

1+ parts

-

100+ parts

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4,899

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-

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ACDS - Activité Composants Distribution Service

France . 150 parts In-Stock

1+ parts

-

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150

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-

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Holdelec - ElecDif-Pro

France . 150 parts In-Stock

1+ parts

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150

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,028 parts In-Stock

1+ parts

$5.382

100+ parts

-

1k+ parts

-

10k+ parts

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2,028

$5.382

-

-

-

Parana Technologies

USA . 1,041 parts In-Stock

1+ parts

$9.447

100+ parts

-

1k+ parts

$10.060

10k+ parts

-

1,041

$9.447

-

$10.060

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DigiPath Technology Company

USA . 268 parts In-Stock

1+ parts

$10.403

100+ parts

-

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-

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268

$10.403

-

-

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IDEA Electronic Components Group

UK . 2,128 parts In-Stock

1+ parts

$10.615

100+ parts

$10.084

1k+ parts

$9.554

10k+ parts

-

2,128

$10.615

$10.084

$9.554

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ChromeModa Solutions

Germany . 1,223 parts In-Stock

1+ parts

$10.615

100+ parts

$8.704

1k+ parts

-

10k+ parts

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1,223

$10.615

$8.704

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-

Microchip USA

USA . 2,547 parts In-Stock

1+ parts

$25.200

100+ parts

$24.840

1k+ parts

$24.660

10k+ parts

$24.480

2,547

$25.200

$24.840

$24.660

$24.480

QUARKTWIN TECHNOLOGY LTD

USA . 28,175 parts In-Stock

1+ parts

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28,175

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Kepictronics

USA . 3,200 parts In-Stock

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3,200

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Perfect Parts

USA . 504 parts In-Stock

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504

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Overview

Unlock the full potential of your power systems with the UCC27322MDEP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their MOSFET Gate Drivers. This versatile product offers a wide range of applications, from industrial automation to renewable energy systems. With its advanced technology and military-grade temperature rating, the UCC27322MDEP provides unmatched performance and seamless integration into your projects. Trust Texas Instruments to deliver premium solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the gate driver, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes it easier to integrate into circuit boards, saving space and making assembly more efficient.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this gate driver can perform reliably in challenging environments without risk of overheating.

Maximum Output Current: 9 A

Capable of delivering a high output current, making it suitable for driving power MOSFETs in various applications.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both bipolar and CMOS technologies, resulting in high performance and efficiency.

Technical Specifications

MOSFET Gate Drivers UCC27322MDEP attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

9 A

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/15

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.91 mm

Trade Compliance

UCC27322MDEP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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